MXPA00003228A - Visual display - Google Patents

Abstract

A field effect emission device (100) for a visual display has a ceramic substrate (1). On an emission side (2) of the substrate, it has an emission layer (3) including a lattice of conductive emitter and gates line stripes (4, 5). For electrical connection to the emitter and gate stripes, the substrate has apertures (16), into which the strip material - or other conductive material - extends as vias (17). The device substrate is made up of several substrate layers 11, 12, 13, 14 bonded together. Each layer piece has connection strips (19) set into its opposite surfaces and interconnecting vias (20), of the same material as the strips. The connection strips of adjacent layers about or at least vias of one layer abut with the connection strips of the next layer, providing electrical contact. The connection strips and the vias are arranged to spread or fan out the connections from the stripe pitch, typically 0.0125'', to that of driver chip contacts, typically 0.050'', to be connected to the contact pads (18).

Description

VISUAL SCREEN Field of the Invention The present invention is a visual screen, particularly, but not exclusively, p. the use with data processing ajparatos.

Antecedent ^ of the right Visyale screens for data processing apparatuses, such as computers, are usually of the cathode ray tube type. These in general have a depth of the order of their size dimension, which is conventionally their corner dimension a is in or diagonal. This depth can make them inconvenient in use. Recently, the portable coders (APJ: OP) have become more widely used. These incorporate a "flat" screen, usually of the liquid crystal type. Proposals have been made to provide pa t l ls that terminate. Xß-Rayo cathode screens. These are known as Spindt cathodes, then the inventor of U.S. Patent No. 3 ^, 755 ^, 704. In this specification, these are referred to as field mission devices.

Objective of the Invention The objective of the present invention is to provide a paitalla isura! e emi i field, flat, improved and an emission device for the screen. This request claims the priority of our Reln United mess request. 3120123. 1 of October 1, 1997 and the provisional application of the United States No, 6070 $ 7,, 508 of December 4, 1997. The priority requests describe our invention of the field emission device and its manner of sealing Within a screen and a machine for the i mata Egta speci fi cation describes both aspects and claims our invention of the device and field system, A co-pending request filed on the same date as the present one (PCT No ^ de ß rle) he describes similarly aguóo aspects and replama JLa invention of sealing.

The invention According to a first aspect of the invention, a field effect emission device is provided for a visual screen comprising: a substrate and an emission layer on one side of the substrate, the emission cap having: • a plurality of emitters and gates, arranged as an array of emission pixels and • conductive connections in the emission layer to the emitters and gates; • the substrate has • conductive pathways provided through the substrate or at the same time, at least some of the conductive connections in the emission layer for electric onduction to its emitters and gates. It is considered that normally all the conductive connections in the emission layer will have respective paths. The provision of conductive routes and conductive connections in the emission potato r, > they provide direct contact to connections and thus to transmitters and gates. This has advantages in terms of the response of the real time of the isores and the cmpmpts to the control signals. In other words, it provides fast integration of transmitters and gates and thus sharp video features. Normally, the conductive connections will be emitting lines and dp cpmpuerta to puales routes are directly connected. In the preferred embodiments, each of the gate issuing lines has a plurality of ports, as set forth therein. While it is considered that some of the roads can be connected to their lines at their ends; preferably the tracks are provided inside the body of emitters or of the gates ^, that is to say with the emitters or the gates placed on the lines on both sides of the ppsi-tion of, the tracks. According to an important feature of the invention 1.05 impulsor.es are mounted on the rear face (the opposite side of the emitter face) of the J ueva ueva ueva ueva ueva ueva ueva ueva,,,,,,,, en en en en?????????? Con con con con con con con con esto esto esto esto esto esto. emi response; yes > n. It is envisaged that the substrate may have a layer 'if it has an electric power track and preferably driver contact adrs provided s £ > r its opposite face from the emission layer. Normally, the substrate has at least one layer of substrate additional to the front substrate potato, or each additional layer of substrate having conductive paths a. through this one • electrical interconnection tracks that are provided in X-aβ integers to each or adjacent pair of substrate layers for the electrical interconnection of the p and p pairs of adjacent layers and • conpxipn eléptripa and prefere tracks It fears t contact adrs impellers that are provided .sppr a face. d) backing one of the additional substrate layers or layers opposite the front side. This arrangement provides that the space of the emissary and gate lines p e a be progressively open in fan for the connection to the impellers. In addition, the field emission device will usually include at least one additional substrate layer, intermediate, between the front and back substrate layers. The electrical interconnection tracks provided in the intercropings between or each adjacent pair of substrate layers can be provided only by one of the respective substrate layers in the interconnections, is interpolated in cpptactp between the paths of a layer and the tracks of the other layer. Alternatively, the electric interconnection tracks may be provided on both layers of the pipelines in the interconnections, the interlayer contact between the tracks of a potato being the tracks of the Ptra chr. Preferably, no gate line or ccnexion path-of emitting line-and coincident, from the front substrate layer to the next, with u on track to the next substrate potato. Preferably, the path of the gate line and the emitting line are accommodated in the minus the substrate layer having an emission layer in an array of aligned rows of lines in two alternating orientations, with both orientations being displaced respects the 5 directions of the emitter and gate line within the array, all the series is parallel to one or the other of the orientations. The arrangement of aligned series of v as can be a zigzag arrangement with free spaces between the zigs and the zags. In a particular arrangement, one of the alternating orientations is equal to the orientation of the series at ne, and the alternate series of paths are not only parallel but are aligned. The substrate is preferably ceramic, suitably alumina, to provide compatibility to the thermal expansion with other components of the j > t ß lß vi ual, particularly a cover plate. The ways are openings of the layers of which spn filled with sintered metal material. At least some of the electrically conductive networks, lines, connection tracks and tracks of Ipcalmente cupped inside the material of the layer (s) of the substrate In particular, the emitting X-rays are preferably at a level on their emission sides, with the emission side of the substrate, with a flat dielectric layer separating the emission lines and the gate lines. Normally, a resistive layer on the side of the emitting line of the dielectric layer will be provided. In one embodiment, the substrate includes additional pathways and conveying tracks to provide electrical connection through the substrate for the excitation lines of üosuprespate material. In accordance with an additional preferred feature, the face post of the substrat? , has a peripheral metal band for connection by solder dj.sj?psitivo within Xß. visual screen In addition, the power supply and signal tracks are preferably provided on the rear surface of the back layer to energize the impellers and provide the control signals to them. Normally, the gates are circular openings in the liner strips, to the gate, with the emitters that are pointed elements that are they project towards the gate openings through the empty spaces in the dielectric layer. According to a second aspect of the invention, a visual screen is provided comprising: a field emission device of the first aspect; a glass cover plate incorporating phosphorescent material selectively excitable by the pixels of the emission device; and fused sealing material which peripherally seals the cover plate to the emission device with which the cover plate is spaced apart from the emission layer of the emission device and the space between them is evacuated.

It can be assumed that the sealing material is interposed directly between the cover plate and the emission device. However, it is preferred that the sealing material is provided on a wall interposed between the cover plate and the emission device.

In the preferred embodiments, the visual display includes a carrier coupled to the face of the emission device of the emission chip. The preferred arrangement is one in which the fused seal material is projected onto a peripheral wall which is sealed to the carrier and extended from the top of the cover plate, or which forms a leg of the carrier. 10 which is of cross-section to the L-shaped and ß ß extends towards the cover plate, the cover plate eß tß separates ß the fused wall or sealing material, and the emission device is splladamenfß. ^ 1 pprtadpr on the 15 face of the opposite emission device of its emission layer. While the emission device can be secured at p > In the preferred embodiments, the device is welded to the carrier. Preferably, the emitting device and the peripheral carrier wall are complementaryly shaped, to place the emission device on the PPARTADPR, . In a In this embodiment, the peripheral carrier wall defines a space within which the emission device is adjusted with negligible free space between the emission device and the wall. In yet another embodiment, the peripheral wall defines a space that is larger than the emitting device, one of the wall and the emitting device, preferably the last one, has projections for coupling with the wall. of the emitting device, a free space being present between the stop and the emitting device between the projections. Since the emitting device will have electronic components welded to it, the welding of the carrier is preferably carried out with high temperature welding. For this, the apoplant portions of the device and the carrier are provided with complementary metal tracks, to one of which the weld is applied first. The back layer of the permica substrate and the finger may include metal tracks also connected by high-temperature welding for the connection of the electrical network and the excitation signal to the device. ^ Alte n tiv me te ß this, the connectors may be coupled directly to the ceramic substrate in the manner of the impellers that are to be removed later on. The carrier is preferably of the same material as the ceramic substrate, • 5 particularly to provide a similar coefficient of thermal expansion. -Also, pl pprtador is preferably of laminated construction. As an alternative, the carrier is made of high temperature plastic material. The edip of selladp preferably comprises a frit of molten glass, between the coating plate l carrier. The frit can have sloping sides. Conveniently, this is provided ppr the conformation of this to a trapezoidal cross section. The advantage of this form is that it makes possible an esp > acio libre in the frita that is going to be joined in bridge. To support X ß - plate of .repubrimientp • against collapse towards the issuing device, A array of spacers is preferably provided between the cover plate and the emission layer. Conveniently, lps spacers can be secured to the cover plate. These can be made of glass, ceramic or material high temperature plastic. 'The spacers are they can provide peripherally - from the phosphorescent material sqbrp the plaf dp repubrimin and the emission arrangement on the substrate - or within the t area of the phosphon material and the emission arrangement, ie the active area of the visual screen. Such spacer spn e om a o pp p "external spacers" and "internal spacers" respectively. Preferably, at least some of the external spacers may carry clues of contact for the lines of the phosphorescent material, whereby the pixels of the phosphorescent material can be xpi rlp or the impellers carried on the emission device. Where the arrangement of the internal spacers. eß causes attract the flow of electrons from the emitters, the primerp can point to an electric track which has a voltage applied to it in use, prpvpcandp. Electrons are repelled to continue towards the material phosphorescent Prefere pn e ^, IPS espapiadpres internal are accommodated in notches in the emission layer and n_a pap.a s, pb, re the p > coating, including the phosphorescent material layer.

J S = X ^^ siXXl: .. iiÍiú2, The internal spacers can extend through the full width of the aptiva area. Alternatively, these can be provided as short lengths and /? > , c, mp crossover ^ ^ Mient a g it is possible that the internal spacers may be of a width to obspure one or more lines dp the emission pixels, the preferred internal spacers are thin compared to the spacing of the pixel line, whereby these do not interfere with the n = junp of the pixels. For this, they can also have a tapered cross section, being thinner in their bprde of the cover plate. The external spacers can be thicker, particularly where they are providing connection to the excitation lines of the phosphprescejite material. For a small screen, a simple broadcast device can only be displayed on the screen. For larger screens, a plurality of laterally limited emission devices, all mounted on a common carrier, can be provided. Preferably, the emission devices are of suitable dimensions at the edges of the limit for the alignment of the pixels and at the peripheral edges for the . boundary or boundary with l > ared peripheral carrier. The carrier has additional members that bridge the lateral members of the carrier. The emission devices are supported and sealed. the bprdep of abutment by the bridge members. The bridge members and the emission devices. They provide complementary welding contact to provide electrical contact between the conDnntp circuits of the adjacent emission devices. Conveniently pstp is proportional to local swellings in the width of the bridge members, with the spldar tracks dp ßelladp following the edges of the bridge members and the contact points of sp that they provide between the welding tracks. Preferably, the visual screen includes an activatable pressure reducer for the final evacuation of the screen. Conveniently, this one is placed in the empty space of emission device / peripheral carrier wall. According to a third aspect of the invention, a method is provided in the manufacture of an effect emitting device Field of the first aspect of the invention, the method consists of: • the formation of an array of track openings in a substrate; • the filling of the track openings with conducting material, to fuse vUs and • the formation, on one side of the substrate, of a series of conductive connecting lines for the emitters of an emission layer that is to be produced on the From the substrate, the emitting potato has: • a plurality of emitters and gates, accommodated comp h arrangement of emission pixels; • the tracks and at least some of the conductive connections are positioned cpmo to interconnect.

In an alternative, the formation of the emitting lines and the dspirtue lines on the substrate fill the respective track openings with the conductor material of the lines. Then, preferably, the electrical connection tracks are formed on the substrate r gpuestp e ? * ^ ******** ^! the emission layer, with the tracks that are placed in such a way to interconnect with the respective tracks, the formation of the tracks connects them with the respective transmitters and gate. Alternatively, the electrical connection tracks may first lie on the face of the opposite substrate of the emission layer, the tracks being interplanted with the respective tracks, with the formation of the tracks that fill the openings of the yin. .. The emitting and gate lines are subsequently subsequently formed and connected by the tracks thus formed to the respective electrical connection tracks. While it is considered that the network of emitting lines and gateway can be placed on a ceramic substrate by means of a method or a similar method, preferably the electrical connection tracks and / or the emitter and gate lines are printed by printing by stenciling; the substrate is formed by emptying the pint. ceramic material, "and, the openings of track are formed by stamping them in the ceramic material cast in ^^ T ^ 'ft ^ ríMrifíif tape, when it is in the raw state. As an alternative to stamping, the substrate can be perforated by etching. In a particular embodiment, the emitting lines 5 in the case of the front substrate layer or the electrical extension tracks in the ca = p of other substrate layers are formed by stenciling on a smooth release layer, the substrate is formed by emptying ribbon, mate_rlal of ceramics on the emitting lines, the track openings are formed by stamping and are filled ppr stamping by stencil. The latter will normally include printing of electrical connection tracks for the on the other side of the substrate layer, but may include stencil stamping in track openings only. Preferably, the substrate is compressed between plates psra prpvppsr that the tracks of electrical connections are level with the surface of the substrate of., Ceramics .. Where the substrate has one or more additional layers with yias and tracks of electrical ppn.exipn formed in a similar way, the layers are Preferably compressed together to • - Ifif íf iiiffrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrr Preferably, the upper surface of the substrate is polished in preparation for the deposition of emitters on the surface. In a modality, after the cil stamping of the emitting lines with the layer of emission in n "state ru", this is compressed between the plates to press the strips of the emitting line into the substr to. Next, the dielectric layer and the resistive layer - when provided - are added, Preferably / these are spun. Then the gate lines are stamped, EJ. The substrate has one layer and the layers are compressed together to form electrical contacts at the interfaces of the interlayer before ignition, preferably having sidp first individually individually flattened by compression. The compression together ensures electrical contact in the lanes. The pnfaje is then turned on at high temperature to sinter the substratp and lps materials electrical components. After the ignition, the '^ & amp; & amp; amp; & ^ ^^ ^^ j ^ i ^^^ to openings of the gates and the dielectric layer are performed pre- micrp I-msquinapipn, I beg issuers are electrolytically deposited and micro-machined .. According to a room An aspect of the invention provides a substrat for a field effect emission device produced by the method of the third aspect of the invention.

Drawings of the Preferred Modalities of the Invention To help understand the invention, the specific modalities of these will be described by way of example and with reference to the accompanying drawings, in which Figure 1 in a perspective view of a part dp an emission dispps.itivp of the invention; Figure 2 is a partial cross-sectional view on a larger scale, through the device of Figure 1, with a further enlarged detail, Figure 3 is a perspective view of a substrate cut and punched, J.isto - for stamping by ciling of the issuing strips; Figure 4 is a partial view, on a larger scale, of a piez of Figure J3 after cil stamping of the emitting strips; Figure 5 is a similar view of the p ^ a after ciling of the gate lines; Figure 6 is a side view of the plurality of substrate shafts assembled for ignition; Figure 7 is a partial side view of another method d placement of substratp track and electrical connection; Figure 8 is a view similar to Figure showing, a photopreciplinary layer for controlling the engraving of the gates; Figure 9 is a perspective view of a second emission device of the invention; Figure 10 is a partial plan view 5 of the post-io-dpi second delivery device surface; Figure 11 is a view similar to Figure 9, of a third device Xß inyención, "10 Figure 12 is a partial view similar to Figure 9, from behind the third emission device of the invention, showing in particular the tracks and the conductive tracks, with the layers of substrate not shown as such; Figure 13 is a diagrammatic plan view of the placement of the tracks in the front substrate layer and the respective rniprocirpuitos p driver chips on the rear face of the emitting device of FIG. 11; Figure 14 is a perspective view of a visual display unit of the inception, before the adjustment of its cover plate; Figure 15 is a partial cross-sectional view, on a major scale, of part of the device of Figure 9 with its cover plate adjusted, put an enlarged additional detail showing an internal spacer; Figure 16 is a perspective, partial, exploded view of an external spacer on the cover plate of the display unit of Figure 14; Figure 17 is a view similar to Figure 14 of a larger visual display unit of the invention, with its plate coating that e, s shown; Figure 18 is a bottom view of the visuai display unit of Figure 17; Figure 19 is a view similar to Figure 15, which maps a pair to the polocation of the emitting devices on its carrier; Figure 20 is an example view of a corner of another visual screen of the invention, which shows an alternative arrangement for the placement of the emission devices SU carrier bearer; Figure 21 is a view similar to Figure 19, showing the alternative page arrangement of Figure 20; Figure 22 e lateral, transverse, partial view of a visual layer screen of simple substrate of the invention, "• Figure 23 is a similar view of a double substrate layer visual display of the invention; Figure 24 is a block diagram of the assembly apparatus according to the invention;; Figure 25 is a side cross-sectional view of a mounting station with a p > coating lacquer shown only in profile; Figure 26 is a partial plan view of the assembly station without a plate coating; ^ ^^^^^^^^ ^^^^ Figure 21 is a transverse side view of a sealing chamber; The ^ Figure 28 is a view similar to the Figure 15, showing an evaporable pressure reducer, according to Xß invention, Figure 29 is a partial plan view of a corner of a screen unit showing another deformable pressure reducer, according to the invention; Figure 30 is a cross-sectional side view of a visuai screen unit of the invention, complete with the drive microcircuits; Figure 31 is a perspective view of a dp emission device constituted by cleaning by a similar device; Figure 32 is a view in perspective of a second embodiment of a sealing machine of the invention; FIGURE 33 is a plan view of the machine of Figure 32; Figure 34 is a front view of the machine of Figure 32.}.

Figure 35 is a view similar to Figure 32 of this machine, ponfigurada of different way; Y Figure 36 is a similar view of a third seeding machine of the invention; Description of a First Modality of the Emission Device With reference to Figures 1 and 2, there is shown a representative pattern of a field effect emission device 100 for a visual screen having a ceramic substrate. I For compatibility with other components of the visual screen, in particular a Glass coating plate (see below), the ceramic used for the substrate is alumina,. Spbre a ladp ^^ j ^ g ^ | ^ ^ emission 2 of the substrate, it has an emission layer 3 that includes a ed dß strips 4, 5 linear, conductive and gate transmitters. In use, on a drive side 6 of the substrate, the latter 5 has impellers 7 mounted and connected, as will be described in more detail below, vej: Figure 30. The provision of impellers so close to the emissive layer as these are .accionando, minimizes capacitance and other losses electric. The emitting strips are made of nickel and the gate strips are of chrome, respective strips of the same type are spaced through the substrate. These are separated in their intersections for an electric-oriented potato 8 and a thinner resistive potato 9, on the side of the substratum of Xß dielectric layer ^ The dielectric layer is silicon dioxide. The resistive layer can be dp polycrystalline silipip p metal oxide. The emitting strips are hollowed out within the surface of the emission side of the substrate, whereby the dielectric and resistive layers are pineapple. Typically, the strips are accommodated at a spacing of 80 for every 2.54 centimeters (1 inch) for example centers of 0. 32 mm (0.0125 inches). Each strip is 0.10 mm (0.004 inches) wide and l Jim ÍP.0004 inches) thick. At each intersection, an emission pixel 10 is provided. Each pixel of emission has an array of emitters 11 and gates 12. The gates are openings 13 in the gate strip 5 at the intersection, with the openings 14 aligned, in the layer 8. The emitters are elements deposited on the resistive layer 9 on the emitter strip 4 at the intersection, in the openings 13, 14 in the gate strip and the dielectric layer. Typically, 300 emitters are provided per pixel. For the electrical connection to the emitting and gate strips, the substrate has openings 16, within which the material extends in a strip-u ptrp conductive material, see below - as the tracks 17. The gateways sp extend to through dp the dielectric and resistive layers as well as the substrate. To facilitate the electrical connection welded to the microcircuits and impellers 7 (see below) connected to the caxß ppsteripr of the device in the contact adapters 18, the substrate of the device is constituted by several layers of substrate, Ji, J2, 13, 1A , joined together- Each piece of layer has connecting strips 19 placed on their opposite surfaces and 5 interconnecting the tracks 20, of the same material as the strips. The connecting strips of the adjacent layers limit c at least the pathways of one layer limit with the fine dp dxxplation of the next layer, providing electrical contact. The connection strips and the, s, are arranged to diffuse or fan-open the strip spacing connections, typically 0 ^ .32 mm (0.0125 inch), to that of the impulse microcircuit contacts, typically X . 3 mm (0,, 0.5Q inches) to be connected to the contact adapters 18. ondp are used. More lines per centimeter (or inch), the strip spacing will decrease, requiring more open fan spread. Peripherally, the rear surface / drive of the substrate layer 14 has a continuous metallic strip 21, stencilled, electrically insulated - similar to the adapters 18 - to seal the connection of the substrate. device to a jportpdpr, despritp cpn major detail later. The power supply and signal-signaling tracks 22 are also provided on the back surface to energize the actuators and provide control signals to them. The emitting device has edge zones 23, along four edges of the ceramic substrate, within which the emitter and gate lines do not extend ^ Spaced ß X Q Along the two opposite edge zones, the emitting device has excitation contacts of red, blue and green color lines, 64R, 64B, 64G respectively, on its split ladder, these contacts are printed on top from the dielectric layer, and cpnpc to oß by connecting paths and strips to the contacting adapters on the rear surface of the substrate. Each layer is of the order of 0.25 mm to 0.50 mm • (0.010 to 0.020 inches in thickness) 20 The manufacture of the above emission device will now be described. Other embodiments of the emission device will be described below.

M *? ¡* * -t < m > ***** ití ^ mmj ^^^ Description of the Preferred Method of Manufacturing the Emission Device The emission device of Figure 1 is w 5 manufactured as follows: The individual layer pieces li, 12, 13, 1 of the substrate dp alumina 1 = e form by casting on tape. The strips are stamped from the tape-cast material and have openings. for the tracks 17 cut by means of photo-hardening etching d, e the ceramic enpendida p pun-zonadp of the material in its raw state. The arrangement of the track openings, shown in Figure 3, is illustrative only. Each emitting line and each gate line to have one way and preferably two. The arrangement shown in Figure 3 has all the gateways aligned and all the emitting tracks aligned. While this is convenient for the logical arrangement, it is.tp causes lines of weakness. An improved arrangement is described below. In addition, it is convenient to first form the openings of the emitting path. While the pieces are all raw, the emitting strips are stamped j by stenciling as a metal suspension on top of a l? of the pieces. Similarly, the connection strips 19 so mpxeß aß J > P stenciled on the other pieces 12, 13/1. The material 5 printed by pasp stencil. d & xp de. the openings to form the tracks 20, the emitting strip material fills the abutments of Xs. The transmitter and the connecting strip material, which is typically based on silver, fills the openings of the interconnection way. The pieces are then individually compressed between the plates for pressing the emitting strips 4 and the connecting strips 19 into the surfaces of the respective substrate pieces, see Figure 4. 5 In sec id, Xß dielectric and resistive layer 8, 9 They are added to the top of a piece by means of iX to D ^ ~ ß resistive potato is required only at the intersections of the emitting strips and the strips of the door, and may be 0 recorded elsewhere before it is add the dielectric layer., The openings via (not shown) for the gate strips 5 are formed and the strips are imp. rests over and through Xas openings, see Figure 5. All the layer 5 pieces that constitute substrate are Inegp apilesdas and pressed together to ensure contact between the respective bands of placement and the tracks in the adjacent layers. The assembly is switched on, see Figure 6. ' As an alternative to stenciling the conductive layers on the raw substrate, the conductor tracks 35, and for one side of a substrate layer 36, can be stencilled onto a release film 37, supported by a pXana surface 38, as shown in Figure 7. The substrate material 36 is then tape-draped over the conductive tracks, whereby a smooth level surface is achieved across the boundaries of the materials. The release material is shown in Figure 7 with esp > This is exaggerated, it is detached when the tape has been hardened, for operations. Subsequent, including the formation of the road and the constitution of the substrate.

With this method, the yías will require to be filled as a separate operation from the establishment of the conductor tracks on the raw substrate. This alternative method is also applicable to the issuing lines. on a release film and superimposed with .a. = a ^^ ceramics emptied on tape. The resistive layer can also be placed by stencil stamping, first, preferably in the pattern described above, which is only at the intersections between the emitting line and gate strips. After the constitution of the substrate and its ignition, the upper layer is preferably polished to provide a uniform surface on which the emitters are deposited, so that they are consistent and level with one another. After switching on, the gates and empty spaces are made by micro-machining. Then the emitters are electrolytically deposited and micromachined. This is achieved by the deposition of a photocurable layer 31, see Figure 8, on the emission side of the substrate, by exposing and developing it selectively, by recording the openings 32 in it, where the gate openings are to be formed. A separate etching process forms the gate openings 13. An additional etching process forms the openings 14 in the dielectric layer below the resistive layer 9. Not only is this electrically resistive, but it is also resistant to further etching.

® ¿S ^ A ^ J ¿? ^ Á + ii * ¿í *? Once the engraving is completed, the emitters 11 are hammered by the deposition of nickel on the resistive layer where it is exposed at the bottom of the X ^ openings in the dielectric. This can be either by vacuum deposition or by electrodeposition. The person skilled in the art will carry out this process without the need for additional disclosure in the present. 10 • Description of the Preferred Modes of the Issuance Device With reference now to Figures 9 and 10, here is shown the simple form d d spositiyo emission of the invention. This has a simple ceramic layer ^ .Spire -s and ladp emission is provided an emission layer 503 similar to the • emission layer 3. Comp tsl, this one does not neguire additional description. This device suffers from the disadvantage that the fan spread of the conductor tracks 519 on the back side of the substratum layer 5Jl? of the yías 51j > to make contact with the 518 adapters, requires a tortuous arrangement of the tracks, taking into ^^ m ^ bx ^^^ * ^ account that the energy tracks and signals 530 must also be provided to the driving microcircuits 507, and that in Figure 10, the separation of the tracks has shown sidp as 5 half from that of the spikes of the driving microcircuits, while in practice, the separation of the track is likely to be smaller still p > pr comparison. It should also be noted that while Figure 10 shows a line i esl 1 to spike 1 ..., line O to spike n • that they open in a fan, in fact the order of the ears is likely to cause a more complex disposition to be necessary. Also, bearing in mind that the device must be hermetic ß X a. pressure, in order to maintain the internal vacuum, the device suffers from the disadvantage of relying on the complete filling of the openings for integrity of the pressure. However, it is anticipated that • there are applications for this simpler form of emission device of the invention. Referring now to Figures 11, 12 and 13, the emitting device therein shown has two ceramic layers 6011, 6012. The rear face 606 of the first layer has interconnection tracks. 6191 that extend from tracks 616 of the line transmitter (for example) in the front substrate layer 6011, see Figure J.2, S ß must nptar gue in Figure 12, the individual layers as such are not shown pprp if the .display of 5 tracks is shown about them . The front face 6022 of the second layer 6012 also has interconnecting tracks 6192, the two groups of tracks 6191, 6192 are interconnected - where they are opted for. The tracks 6191 are fanned open to the separation of the tracks 616 up to the separation of the interconnection pins 6030 by a factor of two. The tracks 6192 fan open again to be of sequentially longer length, so that their ends are again at duplicate spacing.

Alternates at these ends have a track 6020 to the tracks 6194 for the microcircuit adapters 5181. Since the alternate tracks are those that have tracks at their extremps, the track separation is again duplicated, for example, this is ppr fan opens a fader ochp desdp the separation of tracks 616 in the front layer. The alternate tracks 6192 where np have tracks 6020 are continued transversely to the additional tracks 60201 on the other side of the microcircuit 607, with the tracks of the rear surface that lead again to the adapters 6182 on the other side of the microcircuit .. The power and signal lines 630 also lead to the microcircuit. It will be appreciated that the two layers of substrate give much greater flexibility in fanning than what is posibje with a layer, since the tracks 6191, 6192, 6193 could, if necessary, be transverse to the tracks ßß energy and signals 630 for the driving microcircuit 607. Alternatively, the energy tracks and dp signals can be flexibly placed as these can pass through the tracks to the interconnection of layer so that its relative order can be rearranged for example, otherwise, tracks 616, 6020 in both ceramic layers are covered by the piece of ceramic substrate of the other potato, with the tracks that are not coaxial. This provides greater security of the tightness aj, yaclo ^ In this mode, as shown in Figure 13, which is strictly diagrammatic, the tracks, at least towards the emitting and gate strips are spaced in an array of aligned series of paths in two alternate orientations - in fact equal and opposite - to, J3 for example, to the orientation A of the emitting line. Inside of the ..- 2-Ét- ^ M? ^^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ all the series are parallel to one another of the orientapipn.es Pt, ß ^ In a band, through the substrate in the direction A, there are four series of aligned paths. , 61.62, 616, 5 6I64. These represent two series 6I61, 6162 of emitting ways and two series 6163 6164, of gateways. Within each series, the successive routes are the successive transmission or gate lines, and a relatively large number of roads are arranged in each series, that is to say 25, which represents 6.35 m of the direction A, the effective length that depends trigonometrically on the direction ot the direction A) on a screen of 100 lines by 2.54 cm (1 inch). The proyislón of such short = prie locates the weakening of the substrate layer introduced by J.as yißs ^. From one of the series 6I61, the next of the series 6162, for example the paths for the next 25 lines, is spaced for an empty space 6166 of a previous one and fits in the other orientation ß ^ Estp introduces a transverse line of weakness. The provision of empty spaces ensures that total weakness is minimized. The arrangement is in effect a zigzag arrangement with empty spaces 6166 between the zigs and the -zags and a orientation? of the aligned series, ßß you will notice that the arrangement, shown in Figure 13, diffuses the track series horizontally of the Figure to twice the separation as it is vertically. In this way, series 6161 6162, will cross the emission device horizontally while reaching only half of its height. In this way, to make contact with all the broadcasting lines, it must be restarted halfway down the device. If the array of the series is closed norizontally, it is possible to avoid the restart. A particular configuration of the array that can be used is one in which the orientations ß and? they are both equal to 45 °. In st ca = O / the series 6162, they are all not only parallel but aligned by themselves. However, weakness is avoided, because of empty spaces. In addition, to provide two paths per line, the array array can be started again, with the starting point spaced horizontally as opposed to vertically as discussed above. Series 6J.63, 6J6á, are for the gate lines. Although these lines run transversely to the broadcasting networks, there is ^ t ^^^^^ -'- 3 - ^? tflffittff'Míiflffl same number and these are at the same spacing all over the emission layer. In this way, its tracks are adjusted in a precisely similar pattern. With each series of tracks on the front face, a microcircuit 6j07 is associated on the front X-side, conveniently in a one-to-one correspondence. However, u microcircuitp can service two series of tracks or vice versa. How I know shows in Figure 13, tpdop the microcircuits are placed on the same side of the tracks. However, it will be appreciated that where the yias are close to an edge of the emission device, it is convenient to select the micropircuits on the board of the tracks. In addition, where the driving microcircuits are provided which have hundreds of impeller output connections, in a rectangular arrangement, the microcircuitp rplapion to the series of paths will not be one-to-one and the diffusion in The range will be considerably more complex than that shown in Figure 12, but essentially within the skill of the person skilled in the art.

Description of the Preferred Modality of the Visual Screen The visual screen shown in Figures 5 14 and 15 includes the emission device 100 dp of Figures 1 to 6 and a carrier 40. This is dumped into dina alumina material tape. This has an L-shaped cross-section, comprising a flange of p ß 41 and a vertical wall or network 4.2., These are separately emptied into tape and assembled together before ignition. Four lengths 43, 44, 45, 46, corresponding to the four sides of the carrier on the four sides of the emitting device 100, are accommodated with butt joints in the corner. The flanges 41 have a continuous metal _pj.sta 47, complementary to continuous 21, printed by stencil and pressed in? F c .pe ß dß ceramics before firing metal strip. Similarly, it provide contacts 48 on the flange complementary to the supply tracks 22. The material of the contacts is continuous within the front surfaces 49 of the carrier, for the provision of electrical contacts. as described in more detail below. .ast? *? * ^ .. ltmet the Ui ?? ** As described below, the transmission device 100 stá soldier within carrier 40. A sealing wall 50 is sintered glass j? Rovides around LSS upper part 5 of the network 42. A glass cover plate 51 is mounted on the sealing wall at a predetermined spacing of the emission layer of the emission device- The inner surface of the cover plate has material phosphorescent 52 printed on ép for selective excitation by the pixels of the device • broadcast. The final components that are going to be added to the visual screen after the seals the front plate, are the impellers 7 (see Figure 30). These are welded to the contact adapters 18. At the same time a connector (not shown) is soldered to the contacts 48. Returning now to Figure 16, the screen visual, of which a portion is shown, is a color screen. The phosphorescent material is provided as red, blue and yerdes points 52R, 52B, 52G respectively. One of each of the points is opposed to each pixel of emission, with which the pixel can show É3 ^ * m ^ 0 & ^^ ~ * iz ^ ii ???! Visually a selected color. The points are arranged in uniform or arreglp frayes of the cover plate, with voltage lines red, blue and yerde 53R, 5ßB, 53G, interconnecting the respective colored through the cover plate points. The lines terminate in the outer spacers 54 arranged on opposite sides of the screen. The outboard spacers are alumina ceramic and are formed of two layers 55, 56, with an arrangement dp yí, and from connecting track which enables the contact ends 57R, 57B, 57G, all the respective dp lines colors are collectively connected to a respective common one of the three contacts 58R, 58B, 58G. The top layer 55, which is joined by laser at its ends to the cover plate 51, has red way, blue and green 59R, 59B, 59G leading to the red, blue and green cpntactos 0R, i > 0B, 60G on its side in contact with the glass. The contacts 60 limit with the respective contact ends 57. The pathways of the respective colors are alternated at the edge of the anchor of the spacer layer 55, and lead through one of the red, yerde and blue contact bands 61R, 61B , 61G, Similarly, the lower spacer layer 56 has bands of red contact, blue and green 62R, 62B, 62G running longitudinally its limited side with the upper spacer layer, whereby each of the lines of red voltage, blue and yielde J53R, 53B, 53G is connected to the respective red, blue and green contact bands 62R, 62B, 62G, The lower strainer layer 56 also has red, blue and green contact paths 63 ^, 63 ^, 63G connecting the strips 62 to the red, blue and green contacts 58R, 58B, 58G on the opposite side of the outer spacer 54 of the facing face. Contacts 5.8 sp > n large and widely spaced in comparison with the line of phosphorescent intermaterial that separates to be born possible the placement of the cover plate with respect to the emission device to be made with a greater tolerance than the spacing of said line., The device The transmitter has complementary contacts 64R, 64B, 64G in its emission layer, which has been previously = pribe. Returning to Figure 15, the visual screen has a number of internal spacers 81 across its width, only one being shown. The spacer is for the plate holder ^ ^ - of coating 51 and the ceramic substrate 1 against atmospheric pressure using one towards the other. This is ceramic tape-cast, but it could be made of ceramic. Typically, it will have a thickness of 50.8 μm (0.002 inches) and a height of 1.27 mm (Q., 0.50 inches). This is adjusted in a notch 82 in polyimide material in a phosphorescent layer 83. The polyimide is opened to give access to the electrons emitted to the points of phosphorescent material 52 and covered with a layer of reflective chrome, in the manner conventionally used in A cathode ray tube.- The internal spacers are initially adhered to the cover plate 51, before it is assembled to the emission device as described below. The emission layer 3, in particular the gate strip material 5, is also provided with a notch 8 for the opposite bord of the internal spacer, the spacer 81 being register with the notch 84, in the assembly, the jtmeßcas are formed in masks (not shown) in the constitution of the surrounding material. As shown, the spacer has a conductive line 85 running along it. The line is connected to a contact adapter (not shown) for the application of a volt to deflect the emission of electrons from the spacer. While the spacer shown in Figure 15 is rectangular in cross section, it can be tapered towards the cover pXaca to minimize its effect on the visual screen. In addition, this may not ß through the full width of the screen. It is considered that cruciform, extruded glass internal spacers can be used in place of rectangular spacers, with cross braces extending in line with the array of pixels between emitters in both directions. cruciform can taper toward the cover plate. JSpacers 91 arranged in an elliptical pattern 92 are shown in Figure 17. The pattern provides support over the entire screen area of the multiple emission device, shown here. The linear internal spacers 93 are also shown as an alternative in another portion of the screen.

Description of j-as Additional Modalities of the Visual Screen Returning now to Figures 17 and 18, the gup screen is similar to aguplla shown in Figures 14, 15 and 16, except that it is larger. The emission devices 71 included therein can be made only to certain dimensions, usually 25.8 cm2 (4 square inches). To make the screen larger, it has a limited range of emission devices limited edge to edge. As shown, the screen has four emission devices 71., giving a size of 51.6 cm2 (8 square inches). The emitting devices 71 are identical to the emitting devices 1, except that along two side edges 72, the edge areas are not present and the emitting line and gate arrangements extend towards each edge of the ceramic substrate. . One advantage of using alumina as a ceramic material of the substrates is that it can be cut, microtrockered, up to precise tolerances, ie, the edges can be cut to have half the separation of a pixel, desdp the Xtüat ^ íi gate emitting line adjacent to the edge. The arrangement is such that where two emission devices limit edge to edge, the arrangement of emission pixels is continuous from one device to the next. The other edges 75 of the emitting devices may be bruised-to fit closely to the side walls 42 of the carrier, along its length as shown in Figure 19, to give positive alignment of the devices in the carrier. Alternatively, edges 75 may be cut between location projections 76, conveniently at the corners of the emitting devices, as shown in Figures 20 and 21, JEstp provides a channel 77 for a pressure reducer 301, as described in more detail below. The -channel has been hollowed out within the carrier to accommodate a deep pressure reducer. As an alfernatiya to the projections on the corners of the plates or slabs, the carrier can be provided with positioning legs 761 in the channel 77, which perform the same function, Sp should note that the cover plates 51 of the screens shown in Figures 19,, 20 and 21 extend laterally beyond the carriers 40. This facilitates connection to lines of phosphorescent material when Xa connection- is not performed through the spacers and edge connectors are used (np shown) ^ The lateral extension also provides a flange or edge that can be held for handling before .1 sealed, as described in more detail later. In Figure 21, an alternative is provided for connecting the line of phosphorescent material in the form of connection tracks 1 on the outside of the carrier. These pass over the upper part of the carrier, where contact is made with the lines of phosphorescent material and the conductive frit 79. In order to support the connections between two devices, the carrier is provided with additional flanges 73 that bridge the flanges. the lateral members of the carrier behind the joints or joints in the devices. In this way, on the screen of the device of four emissions shown, the carrier forms an encircling square with an internal cross. The emitting dp devices are welded to the cross piece 73 in the same way as the flanges 41, that is to say with high temperature welding joining the bands. j ^^^^^^^^^^^^^^^^ g ^ g ^ g ^^^^ around the back face of the devices to the tracks 47 along the carrier members. The weld can be brazed, which is a brass-based or indium-based weld. Where the adjacent emission devices need to be interconnected for synchronization, the contacts 481 on the carrying bridge members and the complementary contacts (not shown) on the emitting devices are provided. These come together in the high temperature welding process. In order to provide space for the contacts 481 between the welding tracks 47, the last and the bridge members 73 are locally open with the contacts 481 provided between the tracks. Turning now to Figure 22, a simpler form of visual display of the inception is shown, where the cover plate 511 is connected to the emission device 501). d.e the simple substrate layer of Figures 9 and '10, by means of a glass band s nterizpdp 510, thick / without the interposition of any wall. The lines of phosphorescent material 531 are not taken for the substrate, but pass laterally straight for connection to the impellers (not shown). Figure 23 shows another simple screen, this having two layers of substrate. Again, the cover plate 511 and the substrate 6011, 6012 are joined without the interposition of a carrier. A glass wall 421 is coupled between the two and adhered to by adhesive 411 dp curing by ultraviolet light, on both sides. The adhesive is cured on both sides of the wall by a simple irradiation of UV light. To provide additional structural strength, the emitting device is adhesively secured to a plastic carrier 411 on the back of the device.

Description of a. First Mpd, ality of the Assembly of the Invention With reference to Figs. 24 to 26, the apparatus shown therein diagrammatically has a mounting station 2.01 with a number of auxiliary stations associated therewith, in particular a cleaning station 0 of the emitter device / a station 203 of sub-assembly preheating, a cleaning station 204 of the cover plate, a preheating station 2.05 of the cover plate and an evacuation unit 20.6. The components are moved between stations by means whose design is within the skill of the expert person in the technique and will not be described here. The cleaning station 202 of the emission device incorporates an emission device 101, cleaning, as described below, fc constituted to clean the emission devices 1, which are to be assembled. The sub-assembly preheating station 203 incorporates heaters (not shown) for heating a sub-assembly however of how many - four as shown in Figure 26 - of the emitting devices 1 on their carrier 0 will be assembled on a visual screen. The cleaning station 204 of fc the cover plate has another device 101 emission, cleaning similarly constituted for the cleaning of. 5 coating plates that are going to be assembled. The preheating station 205 of the emission device incorporates heaters (not shown) for heating the cover plate ^ X to be assembled on the visual screen. The evacuation unit 206 comprises a devastation pump 207 and a high vacuum pump 208, in series. The mounting station 201 includes a vap chamber 209, where the assembly is carried out. The vacuum safety valves 210 are provided through which the components can be passed, while maintaining a vacuum in the chamber 209. Inside the chamber 209, there is a reference template or positioner 211 for positioning the carrier 40, introducing a sub-assembly through the valve 210 from its preheating station 203. Heating elements are placed below the positioner radiant 212 aligned with the flanges 41, 73 of the carrier to heat them to the temperature at which the solder melts between them and the ceramic substrates 1.

• On the template or positioner 211 accommodates at least one optical position sensor 21ß and a plurality of robotic arms 214, for maneuvering the substrates 1 onto its p > ortador to sß design position. Once placed, these are temporarily secured by aluminum punas 215, which were included with the sub-assembly and the which are pressed in position by the robotic arms. The robotic arms themselves are adapted to maneuver the cover plate 51 (shown in dashed line in FIG. 25) in position on the placed sub-assembly. Adjacent to the radiant heating elements 212 are the conduits 216 leading to the vacuum unit for extracting air flux beyond the flanges 41, 73 to cool the weld upa vpz which emission devices have been placed and wedged. Within the chamber 209, also mounted on the positioner 211, a spot welding laser 217 is provided on a track .218 allowing it to be moved in alignment with various points on the periphery of the carrier, for spot welding the plate. coating 51 to the sinteri-zsdp 50 glass over the wall 42 of the carrier.

Description of the Preferred Cleaning Method of the Emission Device Figure 31 shows the emission device of Figure 1 arranged opposite to others i ^^? jMá to similar devices 101, which typifies its XmpuXß oxeß 107 controlled to provide a maximum electron beam irradiation of the emission layer 3 of the device 100. The devices are placed one next to the other, preferably but not necessarily a vacuum chamber. These are close enough for the irradiation with electrons from the device 101 to activate and displace any molecular waste on the emission device that can not be removed by conventional washing techniques. The emission device 101 is energized for a sufficient length of time to clean the device 100.

Description of the Mounting Method used by the First Mounting Device Returning again to Figures 24 to 26, a sub-frame of four transmitting devices 1 on a carrier 40 is inserted into the cleaning station 202 of the emitting device, where the devices are electronically cleaned as described above, JE1 sub-assembly is then moved over the guides that do not fc¡?! ^ jgj? SgS? fegj show, towards the preheating station 203 of the sub-assembly, where it is prepared. Again, this moves on the mounting station 201. Simultaneously, a cover plate is cleaned in the cleaning station 204 of the cover plate and pre-heated in the preheating station 205. The vacuum chamber 209 is heated and evacuated to a substantial vacuum by means of the pumps 207, 208. The sub-assembly is intrinsic within the vacuum chamber via the vacuum safety 210 and placed on the 2-ppsicator. .Preliminary to having been cleaned, the high temperature welding, for example, which has a melting point of 300 ° C, was stamped on the bands 21 and Xaß p >istas 22 of the substrates 1 .. The temperature in the preheating station is not enough comp. to melt the weld, but heating elements 212 heat the carrier and substrates locally to fuse the weld and cause it to flow and wet the complementary track 47 and contacts 48 on the carrier. While the weld is still fused, the robptipps arms are manipulated to make contact with the free edges 220 of the optical devices. An optical sensor 213 is centrally located on the emitting devices and can detect the junction lines 221 • 5 between the devices. The four connecting lines between the four devices are located at n cross 222 from which the opposite legs 223, 224 are aligned when the emitting devices are correctly positioned one with respect to the other.

The pentral sensor is associated with a light recognition system (not shown) such that it can control the robotic bracts 214 to manipulate the emitting devices in the correct positioning, to ensure the Correct rotational positioning on the carrier, the additional sensors 212 are provided radially of the cross 222. Once the placement is correct / the robotic arms • are used to press the aluminum wedges 215 in position between the edges 220 and the walls 42 of the carrier - the wedges having been added to the sub-assembly before cleaning. Immediately after the wedging, the vacuum pumps are operated, to extract the air introduced with the sub-assembly and the plate coating that is now introduced. The inputs to the pumps are the conduits 215 adjacent to the heating elements, whereby the cooling effect of the withdrawn air flow is locally concentrated to the welded joints which now solidify. This makes a hermetic seal peripherally of each emission device. The cover plate is introduced to rest via its spacers 54 on the emitting devices. The respective contacts 63 and 64 are aligned. A small free space .223 (see Figure 15) is present between the underside of the cover plate at its edges and the frit 50 on top of the walls. The printed symbols, borrablps (not shown) on the front of the cover plate are observed by the sensors .213, and the robotic bps manipulate the cover plate in pixel / pixel alignment with the emitting devices. With the cover plate held by the robotic arms, the .217 laser is activated by spot welding between the glass of the cover plate and the 50"Sß frit. Note that the frit has a transverse shape ^ Yg¡ ^ ig¡ | g! ¡^ AS & Sb trapezoidal, which causes it to form a curved meniscus Jaacia up when it is fused by the laser. This makes possible the union between the frit and the front face to jump the yacíp space -223, which is of the order of 0.5 mm (0.020 inches). Four points are typically plated, one on each edge of the rectangular coating plate, the last one being this mode held in fixed position with respect to the carrier, to which the emission devices in the solidification of the weld have been fixed. .

Description of a First Modality of the Sealing Apparatus of the Invention Connected to the vacuum chamber 209 via one of its shutoff valves 210 is a second high vacuum chamber 230 with a high vacuum pump 231, separate, X chamber is boosted with nn positioner 232 similar to the positioner 211 and a laser 233 and the track .234 similar to the laser .217, and its track 218 in the first vacuum chamber 209.

Description of the Sealing Method using the First Sealant Apparatus With reference to Figure 27, after the introduction of the visual screen into the sealing chamber 230 and its location on the positioner 232, the pump 231 is operated to extract a high vacuum in the chamber. The laser 233 is aligned with the frit 50 at the periphery of the cover plate, either at a preliminary spot welding or at another site. The laser is ignited and traversed around the entire periphery of the coating plate, welding it to the frit in the same way that the spot welds were made. Since there is free space between the cover plate and the frit before welding, the evacuation can be continued simultaneously with the welding, with the air being evacuated from the screen via the free space. The completion of the crossing of the periphery completes the seal.

Description of the Preferred Visual Display Evacuator of the Invention With reference to Figure 28, the visual screen of which a portion / is shown has a pressure reducer 301, evaporable, barium. This is metal sheet twisted around quadrant pieces 302 of the ceramic material spaced along the carrier 40. The pressure reducer is placed in the space 303 between a spacer 54 and the carrier wall 52, whereupon after the evaporation of the pressure reducer by irradiation with a laser acting through a clear marginal part 304 of the cover plate, "the evaporated material is deposited on the surfaces around the space / which do not include active parts of the emission layer Figure 29 shows a pressure reducer 311, non-evaporable alternative, which extends through a corner 312 of each emission device 100. The pressure reducer is formed as an inverted C with the ends of the between the edges 220 of the ceramic substrates Xas walls 42 of the carrier The arrangement is such that the pressure on the upper part 313 of the reduct It diffuses it so that it acts as a wedge during the placement of the emission devices.

Description of the Preferred Evacuation Method of the Invention After sealing the visual screen with either an evaporable or non-evaporable pressure reducer, 301, 311 respectively, the laser 234 is moved from one side to the other to heat the pressure reducer to its active temperature at which it will absorb the greatest part of the gases still present on the screen after sealing. The activation of the pressure reducer dp can be immediately subsequent to sealing, while the screen is still in the sealing chamber 230. Alternatively, this can be carried out subsequently at room temperature. The completed visual screen is prepared for the use by welding of stamping by stenciling on the contact adapters 18 for the welding of its micropcircuit impellers 7, .? fc.,? j¿i ¿¿Description of a Second .Modality of the Combined Mpntajs and the Sealer Apparatus Returning now, to Figures 35, there is shown an apparatus for mounting cover plates 753 to pre-assembled emission disks and carriers 754, hereinafter referred to as cathodes. The emitting devices and carriers are pre-assembled in a station - not shown - which heats them to melt the solder by joining them and cooling them to harden the solder. The use of cut emission devices to adjust their carrier, avoids the need to manipulate them with respect to the carrier. The pressure reducing bands 301 are added to the channels 77, to complete the pre-assembly of the cathodes. The apparatus has three stations 701, 702, 703. The first 701 is a preheater, the second 702 is in alignment and the irradiation station and the third 703 is a controlled cooling station. A conveyor 704 is provided to feed the overlapping coating dies and the cathodes through a first gate valve 705 into the preheater. Then, an internal conveyor operable by a button 706 moves them through another gate valve 7p7 to the s-station 5 702 and through a third gate valve 708 to the cooling station 703. This has a valve of final gate 709 through which the sealed field effect emission devices are removed. Below each station, a vacuum pump 710 capable of extracting ultra-low pressures is provided. Each station is isolated from your pump by a gate valve 711. The preheater is precisely that and is equipped with the upper and lower banks of the radiant heaters and the 712 ^ reflectprps. The upper heaters provide above a window dp quartz 713 of a chamber 714 gue • constitutes the station. The lower heaters are provided inside the chamber, ie above a bottom plate 715 thereof, which incorporates an opening towards the gate valve of the station, and the vacuum pump. The heaters heat the cover plate and the cathode at a temperature close to but less than i fusion point of the solder that joins the emission devices with the carrier. This temperature is not exceeded in the apparatus, except locally when the frit is melted. The pressure in • 5 the pre-heater is pumped down to that in the alignment and irradiation station, before the opening of the gate valve between them, and to transfer the cover plate and the cathode, with the result that this second chamber is kept constantly evacuated. • In the alignment and irradiation station, the additional heaters 716 are provided. Those above the plate The coating and the cathode, with the cover plate in the upper part, are mounted on frames 717 around hinges 718, whereupon they can be moved oscillatingly to • clear this window from the superipr of the station, exposing the cover plate in view of an optical system 719 and a laser 720. These are mounted on a platform X-Y 721 extending from the rear of the apparatus. The conveyor in this station 702 can be secured stationary / which ensures that the pad is stationary. Handling controls 722 are provided to manipulate the position of the cover plate to be in pixel alignment =, as measured by the optical system 719 with the cathode. The optical system is adapted to measure not only the XY alignment, but also the parallelism and Z spacing. Once the XY alignment and parallelism are correct, the station is finally pumped to 10"8 Torr and the coating plate is It lowers to a small controlled separation from the frit on the carrier wall.The laser is moved from side to side around the frit almost at full power to finally degrade the frit.The laser is then moved from side to side again to energy The final traverse melts the frit which was already close to its melting point, a side to side movement only at full and adequate energy to cause the frit to rise by capillary action in contagtp with the coating plate and melts once the laser has been moved further The continuous crossing of the frit provides that it is only local to the current position of the irradiation. So the temperature of the frit is brought to its glass melting point. In addition, the components are kept colder and below the melting point of the high-temperature weld, the location of the elevated temperature in the laser makes the substantial thermal stress formed and resulting in cracking obvious. An overlapped peg is provided at the end of the movement from side to side. As soon as the frit has melted in Pl overlap, the laser trip is changed to irradiate the portions of the pressure reducing material provided in the carrier channel. The cooling station 703 has meanwhile been pumped and the sealed device is transferred thereto. The temperature of the device is allowed to rise very slowly, in order to reduce the risk of thermal cracking to a degree as high as possible. As the temperature drops slowly, the air is slowly introduced, so that the finished device can be removed to the surrounding environment. Referring now to Figure 36, there is shown in this an alternative sealing apparatus, which is adapted to the automated processing of higher volume At the input end of the device, a pair of receptacles 801, 802 are provided, in which the cassettes 803, 804 of the cover plates and the cathodes are respectively charged. The receptacles are internally provided with heaters 805 and vacuum pumps (not shown). The receptacles are connected to a robotic input station 806, ppn a robotic arm 807. Two cleaning stations 808, 809 are provided peripherally of robotic station 806. Each has its own vacuum pump 810. These are provided with sources of radiation of electrons and / or ions 811, 812, the first being a device for the emission of Xß invention and the last one a source of inert gas plasma, for example. The robotic arm is adapted to discharge the cover plates and the cathodes 813, 814 from their receptacles for cleaning at the stations £ 08, 809, Agui a cover plate is irradiated under vacuum to degas the phosphorescent material, in particular to ensure that it does not release gas later in the service. Similarly, the cathodes are irradiated to remove the molecules that hang from the tips of the particular emitters. The cleaned devices are charged within the sealing station 815, essentially similar to the station 702 of the previous mode. Downstream of this is an exit robot 816, adapted to the sealed screens of station 815 and loaded into a cassette (not shown) in an outlet receptacle 817. This has a temperature and pressure control to slowly return the screens finished at room temperature. The receptacles are uncoupled from the robots as their cassettes are emptied and refilled. The apparatus described is essentially modular, whereby the cleaning devices and the sealing stations can be duplicated as necessary to avoid slow velocity, limiting the processing speed of the entire apparatus.

Claims (61)

1. CLAIMS 1. A field effect emitting device for a visual screen, comprising: a multi-layer substrate having a front substrate layer and at least one additional substrate layer and; an emission layer on one side of the substrate, the emission layer has: a multiplicity of emitters and gates, arranged 10 as an array of emission pixels and; conductive connections in the emission layer to the emitters and gates; the substrate has: conductive paths provided through the front layer thereof to at least one of the 15 conductive connections in the emission layer, for the electrical connection to their emitters and gates, the front layer path is in the body of the emitters and the gates, the conductive pathways are provided through the or each substrate • 20 additional; electrical interconnection tracks provided at the interface (s) between the or each adjacent pair of substrate layers for electrical interconnection of the pathways of the adjacent pair of layers; the arrangement of the roads and 25 the interconnection tracks that is such that the position of a path in the front substrate layer is displaced from that of a path in a reinforcement of the additional substrate layer (s) to which it is electrically connected; the electrical connection tracks are provided on an outer face of a reinforcement of one or more additional substrate layers opposite the front substrate layer.
2. 2. A field effect emitting device according to claim 1, wherein the conductive connections are emitting and gate lines to which the tracks are connected.
3. 3. A field effect emitting device according to claim 2, wherein the tracks are placed with emitters or gates placed on the lines on both sides of the position of the tracks.
4. 4. A field effect emitting device according to claim 2 or claim 3, wherein each of the emitter and gate lines has a plurality of paths connected thereto. -ttéfa ^ j ^^ a ^^ a-attáaiat-afe 5. A field effect emitting device according to claim 1, claim 2, claim 3, or claim 4, wherein the electrical connection tracks are provided on the outer face of the subsequent substrate layer include impeller contact pads. 6. A field effect emitting device according to claim 5, including at least one additional intermediate substrate layer, between the front and rear substrate layers. 7. A field effect emitting device according to claim 5, or claim 6, wherein the electrical interconnection tracks provided at the interfaces between the or each adjacent pair of substrate layers are provided on only one of the respective layers of substrate in the one or the interfaces, the interlayer contact being between the tracks of one layer and the tracks of the other layer. 8. A field effect emitting device according to claim 5 or claim 6, wherein the electrical interconnection tracks provided at the interfaces between the or each adjacent pair of substrate layers are provided on both respective substrate layers in the or the interfaces, the interlayer contact being between the tracks of one layer and the tracks of the other layer. 9. A field effect emitting device according to any of claims 5 to 8, wherein neither the gate nor the emitting line connection path are 15 matching, from the front layer to the next layer, with one track in the next layer, nor the next tracks to the subsequent layer are coincident. • A field effect emitting device according to any of the preceding claims, wherein the path of the gate line and the emitting line are accommodated in at least the substrate layer that 25 has the emission layer in a series array line aligned in two alternating orientations, both orientations are displaced with respect to the directions of the emitting and gate line, within the arrangement, all the series are parallel to one or the other of the orientations. 11. A field effect emitting device according to claim 10, wherein the arrangement of the aligned series of tracks is a zigzag array with free spaces between the zigs and the zags. 12. A field effect emitting device according to claim 11, wherein one of the alternating orientations is equal to the orientation of the aligned series, and the alternating series of paths are not only parallel but are themselves aligned. 13. A field effect emitting device according to any of the preceding claims, wherein the paths are openings in the substrate layers, which are filled with sintered metal material. 14. A field effect emitting device according to any of the preceding claims, wherein the substrate is ceramic, preferably alumina. 15. A field effect emitting device according to any of the preceding claims, wherein at least some of the electrically conductive connections, the lines, the connecting tracks and the interconnection tracks, are locally embedded within the material of the the substrate layers. 16. A field effect emitting device according to any of the preceding claims, including impellers mounted on the rear face of the back layer. 17. A field effect emitting device according to any of the preceding claims, wherein the substrate includes additional pathways and conductive tracks to provide the electrical connection through the substrate, for the excitation lines of the phosphorescent material. 18. A field effect emitting device according to any of the preceding claims, wherein the rear face of the substrate has a peripheral metal strip for welding connection of the device within the visual screen. 10 19. A device for emission of the effect of • field according to any of the preceding claims, which includes the power supply and signal tracks on the 15 rear surface of the back layer to energize the impellers and provide control signals to them. áfk 20. An effect emission device Field according to claim 2, or any of claims 14 to 19, as they depend on these, which includes: a flat dielectric layer separating the emission lines and the gate lines and a resistive layer on the side of the gate. the emitting line of the dielectric layer. 21. A field effect emitting device according to claim 2 or any of claims 14 to 20, as it depends on these where: the gates are circular openings in the strips of the gate line, and the emitters are portions in tip projecting towards the gate openings through the empty spaces in the dielectric layer. 22. A visual screen, comprising: a field emission device according to any preceding claim; a glass cover plate incorporating phosphorescent material selectively excitable by the pixels of the emission device; and molten seal material which peripherally seals the cover plate to the emission device, whereby the cover plate is spaced apart from the emission layer of the emission device and the space between them is evacuated. 23. A visual display according to claim 22, including a carrier coupled to the face of the emission device, opposite its emission layer. 24. A visual screen in accordance with 5 claim 22 or claim 23, wherein the sealing material is interposed directly between the cover plate and the emitting device. 25. A visual screen according to claim 22 or claim 23, in • where the sealing material is provided on a wall interposed between the cover plate and the emission device. 26. A visual screen according to claim 23, wherein the molten seal material is provided on a wall (Peripheral ß which is sealed to the carrier and 20 extends from it towards the cover plate or which forms a leg of the carrier which is of L-shaped cross section and extends towards the cover plate, the cover plate being sealed to the wall by the material of 25 melted seal and the emission device that is - £ afcfe «« £ S t¡®Wt? ttf (mm ..., .. aa ^ - & .11. ^^ = a ^ ^ a ^ 3j ^ JB [iÍ. ^ ÍÍMllÍfe ^ 4z ^ r - 'Z É?. * -. z arias mS ^ m sealingly coupled to the carrier on the face of the emission device opposite its emission layer. 27. A visual screen according to claim 25 or claim 26, wherein the emitting device is secured to the carrier by means of adhesive. 28. A visual screen according to claim 25 or claim 26, wherein the emitting device is secured to the carrier by means of welding. 29. A visual display device according to claim 28, wherein the weld is a high temperature weld, coupling portions of the device and the carrier that is provided with metal tracks. • Complementary, to one of which welding was preliminarily applied. 30. A visual display device according to claim 28 or claim 29, wherein the back layer of the 25 ceramic substrate and the carrier includes tracks . The metal connectors are also connected by high-temperature welding to connect the electric power and the impulse signal connection to the device. • 31. A visual display device according to any of claims 25 to 30, wherein the carrier is of the same material as the ceramic substrate and preferably of 10 laminated construction. • 32. A visual display device according to any of claims 27 to 30, wherein the carrier is of material 15 high temperature plastic. 33. A visual display device according to any of claims 22 to 32, wherein the molten sealing material 20 comprises frit of molten glass. 34. A visual display device according to claim 33, wherein the frit has sloping sides, preferably of 25 trapezoidal cross section. 35. A visual display device according to any one of claims 22 to 34, including an array of spacers between the cover plate and the emitting device. 36. A visual display device according to claim 35, wherein at least some of the spacers are provided within the area of the phosphorescent material and the emission layer. 37. A visual display device according to claim 35 or claim 36, wherein at least some of the spacers are provided peripherally of the phosphorescent material on the cover plate and the emission layer on the substrate. 38. A visual display device according to claim 37, wherein one or more of the peripheral or external spacers includes paths and / or contact tracks for the excitation lines of phosphorescent material, whereby the pixels of phosphorescent material can be excited by the impellers carried on the emission device. 39. A visual display device according to claim 35 to 38, wherein one or more of the spacers within the area of phosphorescent material and the emission layer, by For example, the internal spacers have an electric track to repel the emitted electrons. • 40. A visual display device according to claim 39, wherein the 15 internal spacers are placed in grooves in the ceramic substrate. 41. A visual display device according to claim 39 or • Claim 40, wherein the internal spacers are short-laterally of the emitting device-in the lengths and / or cross-members and are preferably thin compared to the spacing of the pixel lines, and are tapered 25 'towards the cover plate, whereby these they do not interfere with any of the pixels and preferably have uaji. tapered cross section. 42. A visual display device according to claim 26 or any of claims 29 to 41, as dependent on claim 26, wherein the emitting device and the peripheral carrier wall are complementary in order to position the device emission on the carrier. 43. A visual display device according to claim 42, wherein the peripheral carrier wall defines a space within which the emission device is adjusted with negligible space between the emission device and the wall. 44. A visual display device according to claim 42, wherein the peripheral carrier wall defines a space that is larger than the emission device, one of the wall and the emission device has projections for coupling with the other, for the positioning of the emission device, a free space is present between the wall and the emission device between the projections. 45. A visual display device according to claim 26 or any of claims 27 to 44, as dependent on claim 26, wherein the device includes a plurality of emission devices and 10 wherein the carrier has additional members that bridge the lateral members of the carrier, • the emission devices are in alignment of pixels and supported and sealed in edges of abutment with the bridge members. 46. A visual display device according to claim 45, as dependent on claim 42, claim 43 or claim 44, wherein • The emission devices are of suitable dimensions at the limiting edges for alignment of pixels and peripheral edges for the abutment or abutment with the peripheral carrier wall. 47. A visual display device according to any of claims 22 to 46, including an activatable pressure reducer, for the final evacuation of the screen. 48. A visual display device according to claim 47 as dependent on claim 44 or claim 45, as dependent on claim 44 or claim 46, as dependent on claim 44, wherein the pressure reducer activable is placed in the free space of the peripheral carrier wall / emitting device. 49. A visual display device according to any one of claims 45 to 48 as dependent on claim 28, claim 29 or claim 30, wherein the bridging members and the emitting devices are provided with solder contacts complementary to provide electrical contact between the circuitry of the adjacent emission devices. 50. A visual display device according to any of claims 22 to 48, wherein a point of the respective red, green and blue phosphorescent material is provided for each of the emission pixels, whereby each pixel can be controlled to illuminate any or all three points at will. 51. A method for the manufacture of a field effect emission device according to any of claims 1 to 21, the method consists of the steps of: 15 forming an array of track openings in a plurality of substrate layers for a multi-layer substrate; the filling of the track openings of conductive material to form tracks; the formation, on a face of a front of the layers • 20 substrate, a series of connecting lines conductive to the issuers of an emission layer to be produced on the surface of 'the substrate, the emission layer having: a multiplicity of emitters and gates, arranged as an array from 25 emission pixels; the roads and at least some of ^^^^ s ^ i & . ^ ^ ^^ ^^ t ^ s - ^ • ^ i ^^ '-': - XWU (tt ^ r conductive connections are positioned as to interconnect in the body of the emitters and the gates, the forming tracks electrical connection on the outer face of a backing layer opposite to the emission layer substrate, the tracks are positioned to interconnect with the respective routes, the formation of tracks electrical interconnection to one or both of faces substrate layer which limited in or on each interface in the substrate multilayer being placed tracks to interconnect with the respective routes through the interface, the layers are compressed together to form electrical contacts at interlayer interfaces before of the ignition. 52. A method according to claim 51, wherein the formation of the emitting lines and gate lines on the substrate fills the respective track openings with conductor material of the lines. 53. A method according to claim 51, wherein the formation of the electrical tracks and / or interconnection tracks fills the respective via apertures, the gate lines and stations on the front substrate layer, being subsequently formadas- and connected by means of the tracks thus formed to the respective electrical connection tracks. 54. A method according to any of claims 51 to 53, wherein the formation of the electrical connection tracks and / or the emitting and gate lines is by stencil stamping. 55. A method according to any of claims 51 to 54, wherein the formation of the substrate is by casting the ceramic material. 56. A method of. according to claim 55, wherein the formation of the track openings is by stamping them in the tape cast ceramic material, when in the raw state. 57. A method according to claim 51, wherein the emitting lines in the case of the front substrate layer or the electrical connection tracks in the case of the other layers of the substrate, are * formed by stenciling on a layer of smooth release, the substrate is formed by casting the ceramic material over the emitting lines in tape, the track openings are formed by stamping and filling by stencil printing. 58. A method according to claim 53 or any of the • claims 54, 55, and 56 as dependent on claim 53 or claim 57, wherein the substrate is compressed between plates for 15 cause the electrical connection tracks to be level with the surface of the. ceramic substrate. 59. A . method according to claim 58, wherein the substrate layers • 20 ignition are individually flattened by compression, before the joint compression of the layers. 60. A method according to any preceding claim, wherein the upper surface of the substrate * is polished in preparation for the deposition of emitters on the surface. 61. A substrate produced by the method according to any of claims 51 to 60, for a field emission device according to any of claims 1 to 21. * »A # ^^^^^. ^^^^^ -, ^^ - .. ^ mm ^^ ^^^^^^ d