MX6774E - Metodo mejorado para formar un paquete semiconductor de dos lados montado a presion y enfriado y paquete semiconductor resultante - Google Patents

Metodo mejorado para formar un paquete semiconductor de dos lados montado a presion y enfriado y paquete semiconductor resultante

Info

Publication number
MX6774E
MX6774E MX901776U MX901776U MX6774E MX 6774 E MX6774 E MX 6774E MX 901776 U MX901776 U MX 901776U MX 901776 U MX901776 U MX 901776U MX 6774 E MX6774 E MX 6774E
Authority
MX
Mexico
Prior art keywords
semiconductor package
sided
building
pressure
improved method
Prior art date
Application number
MX901776U
Other languages
English (en)
Inventor
Dominic Anthony Cusano
James Anthony Loughran
Yen Sheng
Edmund Sun
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/600,300 external-priority patent/US3994430A/en
Priority claimed from US05/696,899 external-priority patent/US4129243A/en
Application filed by Gen Electric filed Critical Gen Electric
Publication of MX6774E publication Critical patent/MX6774E/es

Links

MX901776U 1975-07-30 1976-07-30 Metodo mejorado para formar un paquete semiconductor de dos lados montado a presion y enfriado y paquete semiconductor resultante MX6774E (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US05/600,300 US3994430A (en) 1975-07-30 1975-07-30 Direct bonding of metals to ceramics and metals
US05/696,899 US4129243A (en) 1975-07-30 1976-06-17 Double side cooled, pressure mounted semiconductor package and process for the manufacture thereof
MX349876 1976-07-30

Publications (1)

Publication Number Publication Date
MX6774E true MX6774E (es) 1986-07-08

Family

ID=27350820

Family Applications (1)

Application Number Title Priority Date Filing Date
MX901776U MX6774E (es) 1975-07-30 1976-07-30 Metodo mejorado para formar un paquete semiconductor de dos lados montado a presion y enfriado y paquete semiconductor resultante

Country Status (1)

Country Link
MX (1) MX6774E (es)

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