MX342134B - Mitigación de tensiones de voltaje pcb en dispositivos de alto voltaje. - Google Patents
Mitigación de tensiones de voltaje pcb en dispositivos de alto voltaje.Info
- Publication number
- MX342134B MX342134B MX2015008465A MX2015008465A MX342134B MX 342134 B MX342134 B MX 342134B MX 2015008465 A MX2015008465 A MX 2015008465A MX 2015008465 A MX2015008465 A MX 2015008465A MX 342134 B MX342134 B MX 342134B
- Authority
- MX
- Mexico
- Prior art keywords
- terminal
- voltage
- pcb
- mitigating
- stresses
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Un método para mitigar la tensión de voltaje en una PCB que incluye la aplicación de voltaje AC a una estructura de condensador multi-terminal de una PCB multi capa. La estructura de condensador terminal está formada por la superposición de una pluralidad de trazos conductores entre las capas de la tableta de la PCB multicapa. Una capa dieléctrica correspondiente está dispuesta entre los trazos conductores superpuestos de las capas de la tableta. Los trazos conductores superpuestos incluyen una primera terminal, una segunda terminal, una tercera terminal, y una cuarta terminal. La primera terminal y la tercera terminal están dispuestas en una primera capa de la PCB multi-capa, y la segunda terminal y la cuarta terminal están dispuestas en una capa inferior de la PCB multi-capa. La primera terminal y la segunda terminal están conectadas a un punto de tierra, y la tercera terminal y la cuarta terminal están conectadas al voltaje AC. Las tensiones de voltaje en la PCB se mitigan utilizando la estructura de condensador multiterminal.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361783901P | 2013-03-14 | 2013-03-14 | |
| PCT/US2014/024052 WO2014159537A1 (en) | 2013-03-14 | 2014-03-12 | Mitigating pcb voltage stresses in high-voltage devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| MX2015008465A MX2015008465A (es) | 2015-09-23 |
| MX342134B true MX342134B (es) | 2016-09-14 |
Family
ID=51522409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2015008465A MX342134B (es) | 2013-03-14 | 2014-03-12 | Mitigación de tensiones de voltaje pcb en dispositivos de alto voltaje. |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9313878B2 (es) |
| EP (1) | EP2974565B1 (es) |
| AU (1) | AU2014240504B2 (es) |
| BR (1) | BR112015021592B1 (es) |
| MX (1) | MX342134B (es) |
| TR (1) | TR201910190T4 (es) |
| WO (1) | WO2014159537A1 (es) |
| ZA (1) | ZA201503761B (es) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2894505T3 (es) | 2018-10-17 | 2022-02-14 | 3M Innovative Properties Co | Ensamblaje de placa de circuito impreso encapsulada para detectar el voltaje de un cable de alimentación en una red de distribución de energía |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6370012B1 (en) * | 2000-08-30 | 2002-04-09 | International Business Machines Corporation | Capacitor laminate for use in printed circuit board and as an interconnector |
| US6816356B2 (en) | 2002-05-17 | 2004-11-09 | Daniel Devoe | Integrated broadband ceramic capacitor array |
| US7186919B2 (en) * | 2004-08-16 | 2007-03-06 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board including embedded capacitors and method of manufacturing the same |
| US7075185B2 (en) * | 2004-09-14 | 2006-07-11 | Hewlett-Packard Development Company, L.P. | Routing vias in a substrate from bypass capacitor pads |
| US8115113B2 (en) * | 2007-11-30 | 2012-02-14 | Ibiden Co., Ltd. | Multilayer printed wiring board with a built-in capacitor |
| WO2011074283A1 (ja) * | 2009-12-15 | 2011-06-23 | 日本特殊陶業株式会社 | キャパシタ内蔵配線基板及び部品内蔵配線基板 |
-
2014
- 2014-03-12 MX MX2015008465A patent/MX342134B/es active IP Right Grant
- 2014-03-12 AU AU2014240504A patent/AU2014240504B2/en active Active
- 2014-03-12 WO PCT/US2014/024052 patent/WO2014159537A1/en active Application Filing
- 2014-03-12 EP EP14773012.1A patent/EP2974565B1/en active Active
- 2014-03-12 US US14/206,366 patent/US9313878B2/en active Active
- 2014-03-12 TR TR2019/10190T patent/TR201910190T4/tr unknown
- 2014-03-12 BR BR112015021592-0A patent/BR112015021592B1/pt active IP Right Grant
-
2015
- 2015-05-26 ZA ZA2015/03761A patent/ZA201503761B/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| BR112015021592B1 (pt) | 2021-12-21 |
| BR112015021592A2 (pt) | 2017-07-18 |
| AU2014240504B2 (en) | 2017-04-13 |
| EP2974565A4 (en) | 2016-12-21 |
| MX2015008465A (es) | 2015-09-23 |
| TR201910190T4 (tr) | 2019-07-22 |
| EP2974565A1 (en) | 2016-01-20 |
| US9313878B2 (en) | 2016-04-12 |
| ZA201503761B (en) | 2016-08-31 |
| AU2014240504A1 (en) | 2015-06-11 |
| WO2014159537A1 (en) | 2014-10-02 |
| BR112015021592A8 (pt) | 2019-11-19 |
| EP2974565B1 (en) | 2019-05-08 |
| US20140262445A1 (en) | 2014-09-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG | Grant or registration |