MX2019000503A - Material de interfaz termica de tipo gel. - Google Patents

Material de interfaz termica de tipo gel.

Info

Publication number
MX2019000503A
MX2019000503A MX2019000503A MX2019000503A MX2019000503A MX 2019000503 A MX2019000503 A MX 2019000503A MX 2019000503 A MX2019000503 A MX 2019000503A MX 2019000503 A MX2019000503 A MX 2019000503A MX 2019000503 A MX2019000503 A MX 2019000503A
Authority
MX
Mexico
Prior art keywords
thermal interface
interface material
gel
type thermal
polysiloxane
Prior art date
Application number
MX2019000503A
Other languages
English (en)
Inventor
Zhang Kai
Shen Ling
Jun Wang Wei
Zhang Liqiang
Liu Yaqun
Kang Haigang
Original Assignee
Honeywell Int Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Int Inc filed Critical Honeywell Int Inc
Publication of MX2019000503A publication Critical patent/MX2019000503A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Un material de interfaz térmica incluye al menos un polisiloxano; al menos una carga térmicamente conductora; y al menos un promotor de adhesión que incluye grupos funcionales amino y alquilo.
MX2019000503A 2016-07-26 2017-07-11 Material de interfaz termica de tipo gel. MX2019000503A (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662366694P 2016-07-26 2016-07-26
US15/642,092 US20180030328A1 (en) 2016-07-26 2017-07-05 Gel-type thermal interface material
PCT/US2017/041447 WO2018022288A2 (en) 2016-07-26 2017-07-11 Gel-type thermal interface material

Publications (1)

Publication Number Publication Date
MX2019000503A true MX2019000503A (es) 2019-09-02

Family

ID=61011750

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2019000503A MX2019000503A (es) 2016-07-26 2017-07-11 Material de interfaz termica de tipo gel.

Country Status (9)

Country Link
US (1) US20180030328A1 (es)
EP (1) EP3491096B1 (es)
JP (1) JP6705919B2 (es)
KR (1) KR102236416B1 (es)
CN (1) CN109415619A (es)
BR (1) BR112019000352A2 (es)
MX (1) MX2019000503A (es)
TW (1) TWI731123B (es)
WO (1) WO2018022288A2 (es)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX2016016984A (es) 2014-07-07 2017-05-03 Honeywell Int Inc Material de interconexion termica con depurador ionico.
US10287471B2 (en) 2014-12-05 2019-05-14 Honeywell International Inc. High performance thermal interface materials with low thermal impedance
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
KR102554661B1 (ko) 2016-03-08 2023-07-13 허니웰 인터내셔널 인코포레이티드 상 변화 물질
US10501671B2 (en) * 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) * 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
EP3522212A1 (en) * 2018-01-31 2019-08-07 ABB Schweiz AG Power electronics module and a method of producing a power electronics module
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
CN113874465B (zh) * 2019-05-21 2024-05-24 Ddp特种电子材料美国有限责任公司 热界面材料
JP2023509568A (ja) * 2019-11-25 2023-03-09 ダウ シリコーンズ コーポレーション 難燃性ポリシロキサン組成物
US20220298305A1 (en) * 2021-03-17 2022-09-22 Sandisk Technologies Llc Thermally Conductive Non-Oil Bleed Liquid Thermal Interface Materials

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070241303A1 (en) * 1999-08-31 2007-10-18 General Electric Company Thermally conductive composition and method for preparing the same
US6597575B1 (en) * 2002-01-04 2003-07-22 Intel Corporation Electronic packages having good reliability comprising low modulus thermal interface materials
US6815486B2 (en) * 2002-04-12 2004-11-09 Dow Corning Corporation Thermally conductive phase change materials and methods for their preparation and use
US6791839B2 (en) * 2002-06-25 2004-09-14 Dow Corning Corporation Thermal interface materials and methods for their preparation and use
WO2006065282A1 (en) * 2004-12-16 2006-06-22 Dow Corning Corporation Amide-substituted silicones and methods for their preparation and use
KR101547343B1 (ko) * 2007-02-20 2015-08-28 다우 코닝 코포레이션 수소결합 폴리오가노실록세인을 기반으로 하는 충전물 처리제
US20100075135A1 (en) * 2007-04-02 2010-03-25 Kendall Philip E Thermal grease article and method
JP5372388B2 (ja) * 2008-01-30 2013-12-18 東レ・ダウコーニング株式会社 熱伝導性シリコーングリース組成物
WO2010104534A1 (en) * 2009-03-12 2010-09-16 Dow Corning Corporation Thermal interface materials and mehtods for their preparation and use
WO2014021980A1 (en) * 2012-07-30 2014-02-06 Dow Corning Corporation Thermally conductive condensation reaction curable polyorganosiloxane composition and methods for the preparation and use of the composition
FR3000090A1 (fr) * 2012-12-20 2014-06-27 Bluestar Silicones France Procede et compositions utiles pour l'etancheification et l'assemblage de composants d'un groupe moto-propulseur

Also Published As

Publication number Publication date
KR20190032358A (ko) 2019-03-27
WO2018022288A3 (en) 2018-07-26
BR112019000352A2 (pt) 2019-04-16
JP2019522711A (ja) 2019-08-15
KR102236416B1 (ko) 2021-04-08
TWI731123B (zh) 2021-06-21
TW201829722A (zh) 2018-08-16
EP3491096A2 (en) 2019-06-05
WO2018022288A2 (en) 2018-02-01
JP6705919B2 (ja) 2020-06-03
EP3491096A4 (en) 2020-03-25
US20180030328A1 (en) 2018-02-01
EP3491096B1 (en) 2021-06-16
CN109415619A (zh) 2019-03-01

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