MX2015010539A - Un ensamble de pila de dispositivos de silicio/disipadores de calor y un metodo para separar un dispositivo de silicio defectuoso en dicho ensamble de pila. - Google Patents

Un ensamble de pila de dispositivos de silicio/disipadores de calor y un metodo para separar un dispositivo de silicio defectuoso en dicho ensamble de pila.

Info

Publication number
MX2015010539A
MX2015010539A MX2015010539A MX2015010539A MX2015010539A MX 2015010539 A MX2015010539 A MX 2015010539A MX 2015010539 A MX2015010539 A MX 2015010539A MX 2015010539 A MX2015010539 A MX 2015010539A MX 2015010539 A MX2015010539 A MX 2015010539A
Authority
MX
Mexico
Prior art keywords
stack assembly
silicon
heatsinks
faulty
silicon devices
Prior art date
Application number
MX2015010539A
Other languages
English (en)
Inventor
Roman Raubo
Marek Furyk
John Schwartzenberg
Original Assignee
Alstom Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alstom Technology Ltd filed Critical Alstom Technology Ltd
Publication of MX2015010539A publication Critical patent/MX2015010539A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Thyristors (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Secondary Cells (AREA)
  • Silicon Compounds (AREA)
  • Rectifiers (AREA)

Abstract

La invención se refiere a un ensamble de pila de dispositivos de silicio/disipadores de calor y un método para separar un dispositivo de silicio defectuoso en dicho ensamble de pila. Dicho ensamble de pila de dispositivos de silicio/disipadores de calor comprende un acomodo de muchos discos de dispositivos de silicio (20), dos discos de dispositivos de silicio adyacentes (20) estando separados por un dispositivo de disipador de calor plano (22), cada disco de dispositivo de silicio (20) y cada disipador de calor (22) comprende un agujero de centrado en sus ambas caras, un pasador de centrado colocado entre los agujeros de centrado adyacentes de un disco de dispositivo de silicio y un dispositivo de disipador de calor adyacente. Cada dispositivo de disipador de calor (22) está perforado con dos agujeros de guía (24), en dos extremos opuestos del mismo.
MX2015010539A 2013-02-20 2014-02-19 Un ensamble de pila de dispositivos de silicio/disipadores de calor y un metodo para separar un dispositivo de silicio defectuoso en dicho ensamble de pila. MX2015010539A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/772,296 US8896023B2 (en) 2013-02-20 2013-02-20 Silicon devices/heatsinks stack assembly and a method to pull apart a faulty silicon device in said stack assembly
PCT/EP2014/053207 WO2014128151A1 (en) 2013-02-20 2014-02-19 A silicon devices / heatsinks stack assembly and a method to pull apart a faulty silicon device in said stack assembly

Publications (1)

Publication Number Publication Date
MX2015010539A true MX2015010539A (es) 2016-03-04

Family

ID=50193453

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2015010539A MX2015010539A (es) 2013-02-20 2014-02-19 Un ensamble de pila de dispositivos de silicio/disipadores de calor y un metodo para separar un dispositivo de silicio defectuoso en dicho ensamble de pila.

Country Status (7)

Country Link
US (1) US8896023B2 (es)
EP (1) EP2959510B1 (es)
CN (1) CN105009284B (es)
BR (1) BR112015019901A2 (es)
CA (1) CA2901151A1 (es)
MX (1) MX2015010539A (es)
WO (1) WO2014128151A1 (es)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105355603B (zh) * 2015-09-25 2018-10-23 全球能源互联网研究院 一种大组件igbt压装单元
CN106392954B (zh) * 2016-11-01 2018-05-11 中车株洲电力机车研究所有限公司 压装串器件更换工装
CN108206152B (zh) * 2018-01-04 2021-05-18 许继集团有限公司 一种igbt取换方法及实施该方法的igbt取换装置
KR102020317B1 (ko) 2018-03-30 2019-09-10 엘에스산전 주식회사 가압장치 및 스위칭모듈에서의 스위치 교체 방법
CN114144010B (zh) * 2021-11-17 2024-02-09 杭州汉安半导体有限公司 一种高压电机软起动装置
CN114594844B (zh) * 2022-03-07 2024-04-09 英业达科技有限公司 水冷板组件

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1860069A (en) * 1930-07-26 1932-05-24 Hanovia Chemical & Mfg Co Mounting for rectifier plates
US2114898A (en) * 1935-07-03 1938-04-19 Union Switch & Signal Co Apparatus for rectifying alternating electric currents
DE1914790A1 (de) * 1969-03-22 1970-10-01 Siemens Ag Fluessigkeitsgekuehlte Baugruppe mit Scheibenzellen
US4338652A (en) * 1980-02-26 1982-07-06 Westinghouse Electric Corp. Stack module and stack loader therefor
JPS58112353A (ja) * 1981-12-25 1983-07-04 Shinko Electric Co Ltd 半導体スタツクにおける半導体素子の取り出し方法
US4779812A (en) * 1982-01-06 1988-10-25 Kuhlman Corporation Toroidal electrical transformer and method of producing same
FR2550887B1 (fr) * 1983-08-19 1986-11-07 Jeumont Schneider Element pretare pour le maintien en place et le serrage de semi-conducteurs et de radiateurs disposes en colonne par alternance
US4989070A (en) * 1988-11-10 1991-01-29 Coriolis Corporation Modular heat sink structure
KR100209782B1 (ko) * 1994-08-30 1999-07-15 가나이 쓰도무 반도체 장치
US5940271A (en) * 1997-05-02 1999-08-17 Lsi Logic Corporation Stiffener with integrated heat sink attachment
US6677673B1 (en) * 2000-10-27 2004-01-13 Varian Medical Systems, Inc. Clamping assembly for high-voltage solid state devices
JP3631445B2 (ja) * 2001-06-06 2005-03-23 東芝三菱電機産業システム株式会社 平型半導体スタック装置
US8189324B2 (en) * 2009-12-07 2012-05-29 American Superconductor Corporation Power electronic assembly with slotted heatsink

Also Published As

Publication number Publication date
BR112015019901A2 (pt) 2017-07-18
EP2959510B1 (en) 2017-04-12
WO2014128151A1 (en) 2014-08-28
US20140231869A1 (en) 2014-08-21
CA2901151A1 (en) 2014-08-28
CN105009284B (zh) 2017-12-15
CN105009284A (zh) 2015-10-28
EP2959510A1 (en) 2015-12-30
US8896023B2 (en) 2014-11-25

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