MX2014007773A - Thermal buffering of downhole equipment with phase change material. - Google Patents
Thermal buffering of downhole equipment with phase change material.Info
- Publication number
- MX2014007773A MX2014007773A MX2014007773A MX2014007773A MX2014007773A MX 2014007773 A MX2014007773 A MX 2014007773A MX 2014007773 A MX2014007773 A MX 2014007773A MX 2014007773 A MX2014007773 A MX 2014007773A MX 2014007773 A MX2014007773 A MX 2014007773A
- Authority
- MX
- Mexico
- Prior art keywords
- phase change
- change material
- temperature
- electronic component
- housing
- Prior art date
Links
- 239000012782 phase change material Substances 0.000 title claims abstract description 89
- 230000003139 buffering effect Effects 0.000 title abstract 3
- 238000004891 communication Methods 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 14
- 239000007787 solid Substances 0.000 claims description 13
- 239000007788 liquid Substances 0.000 claims description 10
- -1 polytetrafluoroethylene Polymers 0.000 claims description 8
- 239000012229 microporous material Substances 0.000 claims description 5
- 239000004744 fabric Substances 0.000 claims description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 4
- 239000012528 membrane Substances 0.000 claims description 2
- 239000012071 phase Substances 0.000 description 18
- 238000005553 drilling Methods 0.000 description 12
- 239000012530 fluid Substances 0.000 description 10
- 239000007789 gas Substances 0.000 description 7
- 238000013016 damping Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000005755 formation reaction Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000010779 crude oil Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000003129 oil well Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920001410 Microfiber Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 238000005338 heat storage Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000003658 microfiber Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003345 natural gas Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- E—FIXED CONSTRUCTIONS
- E21—EARTH OR ROCK DRILLING; MINING
- E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
- E21B36/00—Heating, cooling or insulating arrangements for boreholes or wells, e.g. for use in permafrost zones
- E21B36/001—Cooling arrangements
-
- E—FIXED CONSTRUCTIONS
- E21—EARTH OR ROCK DRILLING; MINING
- E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
- E21B47/00—Survey of boreholes or wells
- E21B47/01—Devices for supporting measuring instruments on drill bits, pipes, rods or wirelines; Protecting measuring instruments in boreholes against heat, shock, pressure or the like
- E21B47/017—Protecting measuring instruments
- E21B47/0175—Cooling arrangements
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Geology (AREA)
- Mining & Mineral Resources (AREA)
- Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Fluid Mechanics (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Geophysics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A downhole assembly may include a housing containing a heat-producing component in thermal communication with a thermal buffering component. The thermal buffering component includes a container (232) having a phase change material disposed therein that is selected to have a phase change at or below a selected temperature.
Description
THERMAL SHOCK ABSORBING OF EQUIPMENT WITH PHASE CHANGE MATERIAL IN THE HOLE FUND
Technical field
The disclosure belongs, in general, to the thermal damping of electronic components and more specifically, to the thermal damping of the electronic components at the bottom of the hole using phase change materials.
Antecedent
Mounting components at the bottom of the hole in an oil well can be subject to pressures, temperatures and fluid compositions that are hostile to temperature sensitive components. The temperature sensitive components, such as the different electronic components in the tools of the bottom hole assemblies can initially be protected from the temperatures of the well by a housing, but the temperature inside the housing finally rises above of the desired operating temperature as the heat producing components operate in a closed environment.
Therefore, there is a need for thermal damping of the temperature sensitive components, particularly in the high temperature environment of an oil well.
Compendium
This document provides the methods, technical systems that refer to thermal damping heat sensitive components.
In some embodiments, a bottomhole assembly of a well placement system includes a housing that contains an electronic component that can generate heat, and a first phase change material. The first phase change material is packed in a first container consisting of a first microporous material and placed in thermal communication with the electronic component so that the heat generated by the electronic component can be transferred to the first phase change material. The first phase change material has a phase change at a temperature at or below a first temperature.
In some embodiments, the mounting at the bottom of the hole also includes a second exchange material.
phase packed in a second container consisting of a second microporous material. The second phase change material is also in thermal communication with the electronic component so that the heat generated by the electronic component can also be transferred to the second phase change material. The second phase change material has a phase change at a temperature at or below the second temperature. The phase change temperature of the second phase change material is different from the phase change temperature of the first phase change material.
In some embodiments, the first temperature is a predetermined maximum operating temperature of the electronic component.
In some embodiments, the first phase change material changes from solid to liquid, from liquid to gas, or from solid to gas at a temperature at or below the first temperature.
In some embodiments, the second phase change material changes from solid to liquid, liquid to gas, or solid to gas at a temperature at or below the second temperature.
In some embodiments, the first and second temperatures each are at or below a predetermined maximum operating temperature of the electronic component.
In some embodiments, the first or second container consists of a microporous polytetrafluoroethylene material, a microporous film, a laminate or a coated fabric.
In some embodiments, the first phase change material is included in a sufficient mass to increase the operating time of the electronic component at or below the first temperature by at least about 10%.
In some embodiments, mounting at the bottom of the hole includes two phase change materials at a combined mass sufficient to raise the operating time of the electronic component at or below a predetermined maximum operating temperature by at least about 10%.
In some modalities, the method consists of the steps of: a) having a mount at the bottom of the
hole containing a housing, an electronic component disposed within the housing and a first phase change material placed inside the housing; b) placing the first phase change material in thermal communication with the electronic component; and c) absorbing the heat generated by the electronic component by a phase change of the first phase change material at or below a first temperature.
In some embodiments, the method provides a mounting at the bottom of the hole that also contains a second phase change material placed inside the housing. The method further includes the steps of: a) placing the second phase change material in thermal communication with the electronic component so that the heat generated by the electronic component can be transferred to the second phase change material; and b) absorbing the heat generated by the electronic component by a phase change of a second phase change material at or below a second temperature.
In some embodiments, the method further includes automatically stopping the operation of the electronic component when a temperature inside the housing reaches the first or second temperature.
In some embodiments, the method further includes stopping the operation of the electronic component at a calculated time point when or before a housing temperature reaches the first or second temperature.
In some embodiments, the first phase change material is provided at a sufficient mass to raise the operating time of the electronic component at or below the first temperature by at least about 10%.
In some embodiments, the first phase change material and the second phase change material are provided in a combined mass sufficient to raise the operating time of the electronic component at or below a predetermined maximum operating temperature of the electronic component by less approximately 10%.
In some embodiments, the first and second temperatures are at or below a predetermined maximum operating temperature of the electronic component.
Although multiple modalities with multiple elements are described, still other embodiments and elements of the present invention will be apparent to those skilled in the art from the following detailed description, which shows and describes illustrative embodiments of the invention. Accordingly, the drawings and the detailed description should be considered as illustrative and not restrictive.
Brief description of the figures
Figure 1 is a schematic diagram of a well placement system according to one embodiment of the disclosure.
Figure 2 is a schematic diagram of a cross section of an assembly according to one embodiment of the disclosure.
Figure 3 is an example of a phase change material in a flexible container according to one embodiment of the disclosure.
Figure 4 is a flow diagram illustrating a method according to one embodiment of the disclosure.
Figure 5 is a flow chart illustrating a method according to one embodiment of the disclosure.
Detailed description
One or more specific embodiments of the present disclosure will be described below including the modalities of the method, apparatus and system. These described modalities and their different elements are only examples of the techniques currently disclosed. It must be appreciated that during the development of any real implementation, as in the case of any technical or design project, numerous specific decisions of the instrumentation can be made to achieve the specific objectives of the developers, such as compliance with the restrictions related to the system and related to the business, which may vary from one application to another. In addition, it should be appreciated that such development efforts can be delayed, however it would be a routine design, manufacturing and manufacturing practice for those with ordinary skills that have the benefit (s) of this disclosure.
When elements of the various modalities of the present disclosure are presented, the articles
"one", "one", and "the" are intended to be understood as having one or more of the elements. The terms "consisting of", "including" and "having" are intended to be inclusive and to mean that there are additional elements different from the aforementioned elements. Furthermore, it should be understood that references to "one modality", or "modality" of the present disclosure, do not intend to be interpreted as excluding the existence of other modalities that also incorporate the aforementioned elements.
Figure 1 illustrates a modality of an apparatus, system and methodology for well ement. The well ement system of Figure 1 can be on the beach or offshore to, for example, explore and produce crude oil, natural gas and other resources that can be used, refined and otherwise processed for fuel, raw materials and other purposes. In the well ement system of Figure 1, a hole 11 can be formed in underground formations, such as rock formations, by rotary drilling using any suitable technique. A drill string 12 may be suspended within the hole 11 and may have a mounting at the bottom of the hole 100 that includes an auger.
perforation 105 at its lower end. A surface system of the well ement system of Figure 1 may include a form and derrick 10 ed over the hole 11, the form and derrick 10 includes a rotary table 16, square shank or kelly 17, hook 18, and rotating coupler 19. Drill string 12 can be rotated by rotating table 16, powered by any appropriate means, which engages kelly 17 at the upper end of drill string 12. Drill string 12 can be suspended of the hook 18, attached to a traveling block (not shown), through the kelly 17 and the rotary coupler 19, which allows the rotation of the drill string 12 with respect to the hook 18. Otherwise a rotary union could be used motorized which may be a motorized rotary joint well known to those skilled in the art.
In the system of location of the well of the Figure
1, the surface system may also include drilling fluid or slurry 26 stored in a pit 27 formed at the site. A pump 29 can deliver the drilling fluid 26 to the interior of the drill string 12 through a port in the coupler 19,
causing the drilling fluid to flow down through the drill string 12 as indicated by the directional arrow 8. The drilling fluid 26 can exit the drill string 12 through the ports of the drill bit 105 , and circulate upwards through the annular region between the outside of the drill string 12 and the wall of the hole 11, as indicated by the directional arrows 9. In this way, the drilling fluid 26 lubricates the drill bit 105 and brings the cut-outs of the formation up to the surface, as the fluid 26 is returned to the pit 27 for recirculation.
The bottom set-up of the hole 100 of the well ement system of Figure 1 can, as an example, include one or more log modules during drilling (LWD) 120, a measurement module during drilling (MWD) 130, a rotary-steerable system and motor 150, and drill bit 105. As will be appreciated, the bottom-mount assembly equipment may include heat-producing components (eg, electronic components) as well as sensitive components. heat (eg, electronic components), where thermal damping can be beneficial.
As shown in Figure 1, the well ement system is used for a logging operation during drilling (LWD) or drilling measurement (MD) performed on a ground-based drilling rig, but could be any type of crude oil / gas operations (eg the installation of well cable, winding of the production pipeline, tests, completions, production, etc.) carried out on a drilling rig based on land or sea form in.
Figure 2 is a schematic illustration of a cross section of an assembly at the bottom of the hole 200 that can, for example, be included in a MWD module, an LWD module or other equipment at the bottom of the hole, such as the equipment of pressure tests of well formation. The assembly 200 includes a housing 210 that contains a heat producing component 220 in thermal communication with a thermal shock absorbing component (eg, phase change material) 230. When used herein, a first component (e.g. (eg, a heat producing component) is considered to be in thermal communication with a second component (eg, a phase change material component) if the thermal energy of the first component can be
transferred to the second component within the housing 210. In some embodiments, the heat producing component 220 and the phase change material component 230 may be in thermal communication by direct physical contact. In some embodiments, the heat producing component 220 and the material phase change component 230 may be in thermal communication indirectly, for example, by contact with another component or part of the housing or the open space in the container 210.
A heat producing component 220 can be an electronic component, such as a multi-chip module. In some embodiments, a heat producing component 220 may include individual electronic parts, such as integrated circuit (IC) chips that are welded or otherwise secured to a substrate, such as an over-insulating silica (SOI) or board of printed circuits. In some embodiments, traces of copper wire inside the printed circuit board may help to move thermal energy away from the IC chips and other elements within the heat producing component 220.
A material phase change component 230 includes a phase change material packaged in a container 232 (Figure 3) having any suitable shape. In some embodiments, a phase change material is packaged in a flexible container. In some embodiments, a phase change material may be packaged in a container that contains a material that prevents the phase change material from flowing out of the container 232 when the phase change material is in a fluid or semi-liquid phase. fluid Suitable materials for use in a container of the phase change material can be, without limitation, microporous films or membranes (eg, polytetrafluoroethylene (PTFE), polypropylene, polyethylene, polyester, microporous open pore nylon and / or filled pore, etc.), woven or non-woven fabrics (eg, polyester, polypropylene, and spin-bonded polyethylene, spunlace, blown microfiber in the molten state, etc.), laminates, coated fabrics and similar. The different microporous films are available from various sources such as W. L. Gore & Associates Various microporous fabrics are available from various sources such as Mogul Tekstil, BP Amoco and DuPont.
In some embodiments, a material used to pack a phase change material may be chosen based on the ability to maintain high temperature integrity and / or the ability to conduct thermal energy to the packaged phase change material. In some embodiments, a material that is used to pack a phase change material may be chosen based on a property (eg, hydrophobicity, hydrophilicity, fluidity of one or more phases, etc.) of the exchange material. chosen phase. In some embodiments, different materials may be used to pack different phase change materials.
In some embodiments, for example as illustrated in Figure 3, the container 232 is flexible, allowing the phase change material component 230 to be inserted into various spaces within the housing 210. In these embodiments, the phase change material contained within the container 232 may be in shape that can be deformed, such as a collapsible solid, a fluid, a powder, a suspension or a plurality of encapsulated or non-encapsulated portions. In some embodiments, the phase change material can be preformed to fit within a specific space within the container 232.
A phase change material can be any suitable material that absorbs thermal energy during a phase change (eg, solid to solid, solid to liquid, liquid to gas, or solid to gas) that happens when the temperature changes. elevate Examples of suitable phase change materials can be, without limitation, paraffins, fatty acids, hydrated salts and eutectic materials. Various phase change materials are available from various sources including PCM Products Ltd., PCM Thermal Solutions, Microtek Laboratories, Inc., and Amec Thermasol.
A phase change material can be chosen for the ability to absorb thermal energy during a phase change at or below a selected temperature. In some embodiments, a selected temperature may be at or below a predetermined maximum operating temperature, at or below which a heat sensitive component usually does not fail due to thermal stress. In some embodiments, a selected temperature may be at or below a temperature at which the heat-sensitive component begins to fail due to thermal stress.
In some embodiments, assembly 200 includes a plurality of phase change material components 230 that consist of different phase change materials each with different temperatures at which the phase change occurs. For example, the different phase change materials can be chosen in order to increase the total thermal energy absorption potential during the use of a single phase change material within the available volume in the housing 210. In some embodiments, it is possible to choose additional phase change materials for a phase change that is at or below that of another phase change material [sic]. As such, a temperature can be selected that is at or below a temperature at which a phase change material changes phase.
A phase change material can be included in assembly 200 with a sufficient mass to increase the time at which a heat producing component 220 can operate at or below a chosen temperature. In some embodiments, a plurality of different phase change materials may be included in assembly 200 to a combined mass sufficient to increase the time in which a heat producing component 220 can operate at or below a temperature
maximum predetermined operating temperature of a heat-sensitive component. In some embodiments, a phase change material may be included in assembly 200 at a mass sufficient to increase the time during which a heat producing component 220 may operate at or below a selected temperature of at least about 5% . For example, the time during which a heat producing component 220 can operate at or below a selected temperature can be increased by at least about 7%, 10%, 12%, 15%, 18%, 20%, 25 %, 30%, 50%, or more.
In some embodiments, the assembly 200 may further include other components, such as a temperature sensor for measuring the temperature inside the housing 210. In some embodiments, a thermal circuit breaker may be included in the assembly 200 that automatically interrupts the operation of the component. heat producer 220 when the temperature in container 210 reaches a selected temperature. In some embodiments, the temperature within the housing 210 can be monitored and the operation of a heat producing component 220 can be interrupted when the temperature in the container 210 is observed to reach a selected temperature.
In some embodiments, the amount of time that a heat producing component 220 can operate at or below a selected temperature can be calculated based on a latent heat storage potential and the mass of a selected phase change material included. in assembly 200. In some embodiments, the operation of a heat producing component 220 can be interrupted at a time point that is calculated at or before reaching a selected temperature.
As shown in Figure 4, one embodiment of method 1000 consists of the steps of providing an assembly at the bottom of the hole consisting of a housing, an electronic component placed inside the housing and a first phase change material also placed inside the housing 1050; placing the first phase change material in thermal communication with the electronic component 1052; and absorbing heat generated by the electronic component by a phase change of the first phase change material to or below a first temperature 1054. In some embodiments, as shown in Figure 5, a method 1200 may comprise the steps of providing a mounting at the bottom of the hole consisting of a housing, a
electronic component placed inside the housing and a first phase change material and a second phase change material also placed inside the housing 1250; placing the first phase change material in thermal communication with the electronic component 1252; placing the second phase change material in thermal communication with the electronic component or the first phase change material 1254; and absorbing the heat generated by the electronic component by a phase change of a second phase change material at or below a second temperature 1256.
In some embodiments, a method 1000 or 1200 may include automatically stopping the operation of the electronic component when a temperature inside the housing reaches the first or second temperature, or stopping the operation of the electronic component at a time point calculated at or below a temperature in the housing reaches the first or second temperature.
Various modifications, additions and combinations can be made to the exemplary embodiments and their various characteristics discussed without departing from the scope of the present invention. For example, although
The above described modalities refer to particular characteristics, the scope of this invention also includes modalities having different combinations of characteristics and modalities that do not include all the features described above.
Claims (15)
1. A mounting at the bottom of the hole consisting of: a housing; an electronic component placed inside the housing, where the electronic component can generate heat; Y a first phase change material packaged in a first container consisting of a first microporous material and placed inside the housing in thermal communication with the electronic component so that the heat generated by the electronic component can be transferred to the first phase change material , the first phase change material having a phase change at a temperature at or below a first temperature.
2. The mounting at the bottom of the hole of claim 1, further contains a second phase change material packed in a second container consisting of a second microporous material and placed inside the housing in thermal communication with the electronic component so that the heat generated by the electronic component can be transferred to the second phase change material, the second change material of phase having a phase change at a temperature that is at or below a second temperature and different from the phase change temperature of the first phase change material.
3. The bottomhole assembly of claim 1 or 2, wherein the first phase change material changes from solid to liquid, liquid to gas, or solid to gas at a temperature at or below the first temperature.
4. The bottomhole assembly of claim 2 or 3, wherein the second phase change material changes from solid to liquid, liquid to gas, or solid to gas at a temperature-at or below the second temperature.
5. The bottom hole assembly of any of claims 1-4, wherein the first and second temperatures each is at or below a predetermined maximum operating temperature of the electronic component.
6. The mounting at the bottom of the hole of any of claims 1-5, wherein the first or second Micro-porous material consists of a microporous polytetrafluoroethylene material, a microporous film or membrane, a laminate or a coated fabric.
7. The bottom hole assembly of any of claims 1-6, wherein the first phase change material is included in a more sufficient one to increase the operating time of the electronic component at or below the first temperature by at least approximately 10%.
8. The bottom hole mounting of any of claims 2-7, wherein the first phase change material and the second phase change material are included in a sufficient combined mass to increase the operating time of the electronic component in or below a predetermined maximum operating temperature of the electronic component, by at least about 10%.
9. A method that consists of: have a mounting at the bottom of the hole consisting of a housing; an electronic component placed inside the housing and a first phase change material placed inside the housing; placing the first phase change material in thermal communication with the electronic component; Y absorbing the heat generated by the electronic component by a phase change of the first phase change material at or below a first temperature.
10. The method of claim 9, wherein mounting at the bottom of the hole further contains a second phase change material placed within the housing; the method further consists in: placing the second phase change material in thermal communication with the electronic component or the first phase change material; Y absorbing the heat generated by the electronic component by a phase change of the second phase change material at or below a second temperature.
11. The method of claim 9 or 10 further comprises automatically stopping the operation of the electronic component when a temperature within the housing reaches the first or second temperature.
12. The method of claim 9 or 10 further comprises stopping the operation of the electronic component at a time point calculated on or before a temperature in the housing reaches a first or second temperature.
13. The method of any of claims 9-12, wherein the first phase change material is disposed at a sufficient mass to increase the operating time of the electronic component at or below the first temperature by at least about 10%.
14. The method of any of claims 10-13, wherein the first phase change material and the second phase change material are provided to a combined mass sufficient to raise the operating time of the electronic component to or below an operating temperature. predetermined maximum of the electronic component by at least about 10%.
15. The method of any of claims 9-14, wherein the first and second temperatures each is at or below a predetermined maximum operating temperature of the electronic component.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP11290600.3A EP2607620A1 (en) | 2011-12-22 | 2011-12-22 | Thermal buffering of downhole equipment with phase change material |
| PCT/US2012/070806 WO2013096550A1 (en) | 2011-12-22 | 2012-12-20 | Thermal buffering of downhole equipment with phase change material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MX2014007773A true MX2014007773A (en) | 2014-09-15 |
Family
ID=47501539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2014007773A MX2014007773A (en) | 2011-12-22 | 2012-12-20 | Thermal buffering of downhole equipment with phase change material. |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20150000913A1 (en) |
| EP (1) | EP2607620A1 (en) |
| MX (1) | MX2014007773A (en) |
| WO (1) | WO2013096550A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10787897B2 (en) | 2016-12-22 | 2020-09-29 | Baker Hughes Holdings Llc | Electronic module housing for downhole use |
| US11306578B2 (en) | 2018-04-16 | 2022-04-19 | Baker Hughes, A Ge Company, Llc | Thermal barrier for downhole flasked electronics |
| CN108952688B (en) * | 2018-08-22 | 2021-11-23 | 西安石油大学 | Deepwater high-temperature high-pressure oil and gas well testing pipe column and testing method thereof |
| CN109652028A (en) * | 2018-12-29 | 2019-04-19 | 中石化石油工程技术服务有限公司 | A kind of drilling fluid temperature control method based on phase-change material |
| WO2023173030A1 (en) | 2022-03-11 | 2023-09-14 | Axis Service, Llc | Pressure control assembly |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0129954A1 (en) * | 1983-06-22 | 1985-01-02 | Mobil Oil Corporation | A passive temperature control system |
| US5485671A (en) * | 1993-09-10 | 1996-01-23 | Aavid Laboratories, Inc. | Method of making a two-phase thermal bag component cooler |
| US5704416A (en) * | 1993-09-10 | 1998-01-06 | Aavid Laboratories, Inc. | Two phase component cooler |
| US6341498B1 (en) * | 2001-01-08 | 2002-01-29 | Baker Hughes, Inc. | Downhole sorption cooling of electronics in wireline logging and monitoring while drilling |
| US7124596B2 (en) * | 2001-01-08 | 2006-10-24 | Baker Hughes Incorporated | Downhole sorption cooling and heating in wireline logging and monitoring while drilling |
| US6877332B2 (en) * | 2001-01-08 | 2005-04-12 | Baker Hughes Incorporated | Downhole sorption cooling and heating in wireline logging and monitoring while drilling |
| AU2005316870A1 (en) * | 2004-12-03 | 2006-06-22 | Halliburton Energy Services, Inc. | Heating and cooling electrical components in a downhole operation |
| US7440283B1 (en) * | 2007-07-13 | 2008-10-21 | Baker Hughes Incorporated | Thermal isolation devices and methods for heat sensitive downhole components |
| EP2518265A1 (en) * | 2011-04-29 | 2012-10-31 | Welltec A/S | Downhole tool |
-
2011
- 2011-12-22 EP EP11290600.3A patent/EP2607620A1/en not_active Withdrawn
-
2012
- 2012-12-20 US US14/366,678 patent/US20150000913A1/en not_active Abandoned
- 2012-12-20 MX MX2014007773A patent/MX2014007773A/en unknown
- 2012-12-20 WO PCT/US2012/070806 patent/WO2013096550A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| US20150000913A1 (en) | 2015-01-01 |
| WO2013096550A1 (en) | 2013-06-27 |
| EP2607620A1 (en) | 2013-06-26 |
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