MX2009002263A

MX2009002263A - Cooking apparatus.

Info

Publication number: MX2009002263A
Application number: MX2009002263A
Authority: MX
Inventors: Su-Hwan Kim
Original assignee: Lg Electronics Inc
Priority date: 2006-09-01
Filing date: 2006-12-07
Publication date: 2009-03-20
Also published as: CN101506583B; RU2411414C2; KR100862112B1; WO2008026799A1; CN101506583A; EP2057417A1; EP2057417B1; CN101893264B; EP2237642A1; EP2057417A4; CN101893264A; EP2237642B1; RU2455571C2; DE602006017119D1; KR20080020875A; RU2010130154A; ATE482603T1; RU2009111886A

Abstract

In order to provide a cooking apparatus having a cooking cavity with an increased height and width by efficiently using the rear space of the cooking apparatus, the present invention discloses a cooking apparatus, comprising: a cooking cavity; and a component room located at the rear side of the cooking cavity and provided with a plurality of components used for a cooking process in the cooking cavity. Through this structure, the cooking apparatus has an expanded cooking cavity with an increased height and width. Although the modification of the cooking cavity of a conventional cooking apparatus is restricted by a circular turntable therein, the use of a rack or a plate instead of the turntable may resolve such restriction.

Description

POROUS MATERIALS CONDUCTORS FIELD OF THE INVENTION The present invention relates to electrical circuits formed on a flexible substrate. More particularly, the present invention pertains to electrical circuits formed on a substrate having a high degree of surface porosity.

BACKGROUND OF THE INVENTION The electrical circuits have been printed or otherwise applied to flexible substrates, such as paper, woven fabrics, non-woven fabrics and polymer films. The electrical circuits have incorporated conductive inks applied with various ink printing techniques, and various products, such as covers, badges, labels and labels, have incorporated the printed circuits. In particular arrangements, the printed circuits have been employed in hygienic products, such as covers, gowns, garments, absorbent products for personal care, and the like. In other arrangements, electrical / electronic circuits have been used to provide sensors located in selected personal care products, such as moisture sensors in disposable diapers for babies.

Conventional printed circuit configurations formed on substrates that have high levels of surface porosity, however, have continued to exhibit problems. When the conductive inks have been printed on porous materials, the level of electrical conductivity has been excessively degraded. As a result, there has been a continued need for improved configurations of conductive circuits printed on porous materials.

BRIEF DESCRIPTION OF THE INVENTION Generally noted, the present invention provides a limited use badge, a disposable article, comprising a matrix substrate, and an electrically conductive region of a separately provided electrically conductive material that has been operatively applied to the matrix substrate of a viscous configuration of the electrically conductive material . The matrix substrate includes a first matrix region, and at least one second matrix region. At least the second matrix region may include a treatment that provides a formation of a selected sensitivity in the electrically conductive region. The first matrix region has a high resistance, and the region electrically conductive is operatively positioned adjacent to the second matrix region. The electrically conductive region has a low resistance, as determined when the electrically conductive region is operatively positioned adjacent to the second matrix region and configured for its intended use. In particular aspects, the matrix substrate may include a substantially continuous extended network of matrix material; and the high strength of the first matrix region can be at least about the order of a magnitude greater than the resistance of the electrically conductive region.

By incorporating its various aspects and characteristics, the method can provide a more effective impression of electrical conductors on porous or semi-porous materials, with a reduced loss of conductivity. The method can help form a flexible continuous base region to support electrical connections with more uniform electrical continuity. Additionally, the method can be more readily employed with ordinary ink formulas, and with ordinary printing equipment.

BREATE DESCRIPTION OF THE DRAWINGS The invention will be better understood by reference to the following description of the invention taken in conjunction with the accompanying drawings, wherein: Figure 1 shows an end view of a representative article in which a matrix substrate includes a first matrix region and at least one second matrix region, wherein at least the second matrix region has been treated to include at least one supplementary material to accommodate an electrically conductive material.

Figure 2 shows a representative end-side view in which a layer of auxiliary material can be applied or otherwise configured to operatively sandwich a layer of supplementary material between the auxiliary material and a layer of base material.

Figure 3 shows a representative end view of an article in which at least the second matrix region has a treatment with a supplementary material which substantially excludes fibers and operatively fills the hollow voids of surface interstices.

Figure 4 shows a representative end view of an article having at least one matrix region where an electrically conductive material is initially applied to a surface of the selected matrix region for subsequent integration into a composite material upon application of an operating force.

Figure 4A shows a representative end view of an article having electrically integrated conductive material in a composite material.

Figure 5 shows a perspective view, partly cut away of a representative article having a sensor or other external electrical monitoring device that is placed on the inner side surface of the substrate to be insulated and interconnects along a conductive duct through the substrate to a circuit conduit and a cooperating processor that is placed on the opposite outer side of the substrate.

Figure 6 shows a partial perspective view of another representative arrangement of a first circuit conduit that is placed on a conductive connecting conduit through the substrate to a second circuit conduit and a cooperating processor that is positioned on the opposite lateral surface out of the substrate.

DETAILED DESCRIPTION OF THE INVENTION It should be noted that, when employed in the present description, the terms "comprises", "comprising" and other derivatives of the root term "understand" are intended to be open terms that specify the presence of any features, elements, integers, steps, or components, and are not limited to preventing the presence or addition of one or more other features, elements, integers, steps, components, or groups thereof.

By the terms, "particle", "particles", "in particle", "in particles" and the like, it is meant that the material is generally in the form of discrete units. The units may comprise granules, powders, spheres, pulverized materials or the like, as well as combinations thereof. The particles may have any desired shape such as, for example, cubic, rod-like, polyhedral, spherical, or semi-spherical, rounded or semi-rounded, angular, irregular, etc. Forms that have a larger proportion of dimension or smaller dimension, such as needles, leaflets, and fibers, are also contemplated for inclusion here. The terms "particle" or "in particle" can also include an agglomeration comprising more than one individual particle, in particle or the like. Additionally, a particle, particle or any desired agglomeration thereof may be composed of more than one type of material.

As used herein, the term "nonwoven fabric or fabric" generally refers to a polymeric fabric having a structure of individual fibers or strands that are between placed, but not in an identifiable way, repeatedly.

As used herein, "spunbond fibers" refer to small diameter fibers that are formed by extruding a molten thermoplastic material as filaments through a plurality of fine spinner capillaries having a circular configuration or otherwise, with the diameter of the extruded filaments being rapidly reduced.

As used herein, the term "meltblown fibers" means the fibers formed by the extrusion of a molten thermoplastic material through a plurality of thin and usually circular capillary matrix vessels with strands or filaments fused into gas jets. heated at high speed (for example, air) and converging that attenuate the filaments of molten thermoplastic material to reduce its diameter, which can be to a micro-fiber diameter. After this, the meltblown fibers are carried by the high speed gas jet and are deposited on a collecting surface to form a randomly dispersed meltblown fabric.

As used herein, the term "coform" refers to a mixture of melt blown fibers and absorbent fibers such as cellulose fibers that can be formed by air-forming a meltblown polymer material while simultaneously blowing fibers suspended in the air into the jet of blown fibers with melting. The meltblown fibers contain wood fibers that are collected on a forming surface, such as provided by a foraminous web. The forming surface may include a gas permeable material that has been placed on the forming surface. The forming surface may include a gas permeable material, such as a spunbond fabric material, which has been placed on the forming surface.

As used herein, the phrase "absorbent article" generally refers to devices that can absorb and contain fluids. For example, absorbent articles for personal care refer to devices that. They are placed against or close to the skin to absorb and contain the various fluids discharged from the body. The term "expendable" is used herein to describe absorbent articles that are not intended to be washed or otherwise restored or reused as an absorbent article after a single use Examples of such disposable absorbent articles include, but are not limited to, health-related products including surgical covers, gowns, covers and sterile dressings; absorbent products for personal care such as feminine hygiene products (eg, sanitary napkins, panty liners, tampons, interlabial devices and the like), baby diapers, children's underpants, incontinence products for adults and the like; as well as absorbent cleaning cloths and cover pads.

Disposable absorbent articles such as, for example, many of the feminine care absorbent products, may include a liquid pervious topsheet, a bottom sheet substantially impervious to liquid attached to the topsheet, and an absorbent core placed and held between the sheets. upper sheet and lower sheet. The topsheet is operatively permeable to liquids that are intended to hold or store the absorbent article, and the bottom sheet may be substantially impermeable or otherwise operably impervious to intentional liquids. The absorbent article may also include other components, such as liquid transmission layers, liquid acquisition layers, distribution layers, liquids, transfer layers, barrier layers, and the like, as well as combinations thereof. The disposable absorbent articles and components thereof can operate to provide a body view surface and a garment view surface. As used herein, the body-to-body or side-to-body surface means that the surface of the article or component that is intended to be disposed towards or positioned adjacent to the user's body during ordinary use, while the surface of view to the garment or seen out, out, is on the opposite side, and is intended to be arranged to face outside the user's body during ordinary use. Such. Outward surface can be arranged to face toward or be placed adjacent to the user's undergarments when the absorbent article is worn.

With reference to Figures 1 to 4, a disposable disposable article of limited use badge 20 may include a matrix substrate 22; and an electrically conductive region 24 of a separately provided electrically conductive material that has been operatively applied to the matrix substrate 22 from a viscous configuration of the electrically conductive material. For example, the electrically conductive material can be deposited directly or indirectly on the matrix substrate. The matrix substrate includes a first matrix region 26, and at least one second matrix region 28. The second matrix region may optionally have a structure that differs from the first matrix region. In a particular aspect, at least the second matrix region 26 can include a treatment that provides by an operational formation of a selected resistance in the electrically conductive region. The first matrix region has a high resistance value. The electrically conductive region 24 is operatively positioned adjacent to the second matrix region 28.; and the electrically conductive region 24 has a value of significantly low resistance, operative, as compared to the resistance value of the first matrix region 26. The resistance value of the electrically conductive region 24 is determined when the electrically conductive region has been operatively placed adjacent to the second matrix region 28 and has been configured for its intended use.

In particular aspects, the matrix substrate 22 may include a substantially continuously extended network of network material; and the high strength of the first matrix region 26 can be at least about one order of magnitude greater than the resistance of the electrically conductive region 24.

By incorporating its various aspects and features, alone or in desired combinations, the method of the invention can efficiently and economically provide a more effective impression of the conductive circuit conduits electrically on porous or semi-porous materials with reduced conductivity loss. For example, the method can more effectively integrate electrical conductors and circuits into health and hygiene garments constructed entirely or partially of porous fabric or foam materials. The method can help form a flexible continuous base region to support the electrical conditions with more uniform electrical continuity. Additionally, the method can be more readily employed with ordinary ink formulas, and with ordinary printing equipment.

The disposable limited use article 20 can have various configurations. Examples of such articles may, for example, include disposable sanitary articles, such as covers, sheets, caps, robes, garments, personal hygiene products, adult incontinence products, feminine hygiene products, baby diapers, underpants for children, and the like.

Particular article configurations can, for example, help provide a new generation of disposable SMART items that are capable of providing sensing and real-time diagnostic functions. The articles may, for example, be configured to provide a moisture indicator for a product having a semi-durable alarm component placed on the product with internal electrodes printed directly on the liner from the side to the body of the product. In other arrangements, the article can be configured to produce an electrocardiogram (EKG) jacket, which has an internal wiring harness incorporated in the disposable material used to build the jacket. The jacket can also have a conductive duct through the thickness of the jacket material that operatively interconnects the wiring harness to an electrical interface located on an outer surface of the jacket. The interface can, in turn, be operatively connected to a device or monitoring system of the electrocardiogram (EKG). In still other arrangements, the article can be configured to include electrical conductors connected to sensors embedded in disposable articles, such as disposable hospital gowns, to monitor selected bodily functions.

The article 20 may include at least one flexible substrate, such as a flexible matrix substrate 22. The substrate may have sufficient flexibility to allow convenient use in an ordinary, disposable article. Desirably, the substrate can have a flexibility that is stiffer than the flexibility of a typical layer or felt or woven fabric that can be employed in ordinary heavy winter clothing.

In another aspect, the substrate can have a significantly high degree of surface porosity. In particular arrangements, the highly porous surface of the substrate may have a percentage of open area that is 50% or more. For example, the porous substrate may include a cellular foam material, an open cell foam material, a fibrous fabric placed by air, a nonwoven fabric, or the like. Suitable fabrics or fibrous nonwoven fabrics can include fibrous tissues placed by air which have been stabilized with binding materials, coform materials, fabrics bonded with yarn, fabrics of carded and bonded fabrics, carded fabrics and bonded through air, or the like.

An adequate technique to measure and determine the level of surface porosity can include conventional image analysis systems. In a desired technique, the surface of a matrix substrate can be reflected with an electron scanning microscope (SEM) equipped with a nuclear particle deviation detector to acquire high contrast images where the pores appear as black regions, and the materials of the matrix substrate (for example fibers) appear as white regions. The image analysis can subsequently be performed on the images to measure the sizes and the entire level of the surface porosity. The Electron Scanning Microscope (SEM) method has been referred to as the Nuclear Particle Deviation / High Contrast Electron Detection Reflector (BSE / HICON). A series of digital surface images are acquired (for example 12 images) at an appropriate enlarged one, which will depend on the size of the pores and the matrix substrate material. Typical enlargements may be within the range of about 25-500 times, and pixel resolutions are normally about 1024 x 1024, or larger. Details regarding the process of Nuclear Particle Deviation Electron Detection Relay / High Contrast (BSE / HICON) have been described in U.S. Patent No. 5,743,999 issued to Kamps et al .; and U.S. Patent No. 5,492,598 issued to Hermans and others, each of which is incorporated by reference in its entirety in a manner that is consistent with this. Even though these particular documents describe the analysis of the cross sections through a material, similar procedures and similar equipment (for example, without cross-section by liquid nitrogen, assembly of edge view, and photo-editing) can be used to access the porosity of a principal surface view of a selected material. It should also be appreciated that the acquisition of digital images can be replaced by the use of Polaroid film. " Once the digital images of the Nuclear Particle Deviation / High Contrast Electron Detection Reflector (BSE / HICON) are acquired, they can be electronically transferred directly to an image analysis system for subsequent measurements. The image analysis software Leica Micro-Systems QWIN, version 3.2 can be implemented quickly, along with an appropriate routine QUANTIMET (User Interactive Programming System) (QUIPS) to perform conventional pore size measurements, and determine the open area provided by the porous regions. Typically, pore sizes can be measured in units of area or calculated in a derived parameter, such as equivalent circular diameter (for example, square root of the quantity, 4 * area / ü), or equivalent-hydraulic diameter (for example, 4 * area / perimeter). Other more sophisticated methods of determining the surface pore size can also be used (eg, rolled-up pore width). The total level of surface porosity can be determined by each Nuclear Particle Deviation / High Contrast Electron Detection Reflector (BSE / HICON) image by measuring the percentage of pores within the entire image.

To provide the desired performance, the matrix substrate 22 may have selected base weight levels. In particular aspects, the basis weight of the matrix substrate can be at least a minimum of about 5 grams per square meter. The basis weight may alternatively be at least about 10 grams per square meter, and may optionally be at least about 15 grams per square meter to provide desired benefits. In other aspects, the base weight can be up to a maximum of around 130 grams per square meter, or more. The basis weight may alternatively be up to about 45 grams per square meter or 60 grams per square meter, and may optionally be up to about 30 grams per square meter to provide desired effectiveness. Accordingly, the above described base weight levels can also be provided to the first matrix region 26.

In desired configurations, the matrix substrate can include a substantially continuously extended network of matrix material. Additionally, the matrix material can be configured to provide an interconnected plurality of matrix elements. The matrix elements may, for example, include fibers, cell wall elements, network elements of spun, blown or extruded materials, polymer network elements or the like, as well as combinations thereof.

In a particular configuration, the matrix material can be configured to provide a plurality of interconnected fibers, and the fibers can be configured to provide an operative woven or non-woven fabric. Suitable non-woven fabrics may for example include joined fabrics, with spinning, meltblown fabrics, coform materials, hydroentangled fabrics, stretched-bonded-laminated fabrics, elastomeric fabrics, elastomeric fabric laminates or the like, as well as combinations thereof. .

In another aspect, the interconnected plurality of fibers in the fibrous matrix material can be configured to provide a first fibrous matrix region 26 and a second fibrous matrix region 28. As representatively shown, the first fibrous matrix 26 can include a first fibrous layer or other fibrous region; and the second matrix region 28 may include a second fibrous layer or the other fibrous region.

The electrically conductive region 24 of the electrically conductive material provided separately can be deposited on the matrix substrate 22, and in particular arrangements, the electrically conductive material can be placed on the second matrix region designated 28 of the matrix substrate. The electrically conductive material provided separately can be applied by employing any operative technique, and the desired viscous configuration of the electrically conductive material can typically be a generally liquid and operative form of the electrically conductive material. In a desired arrangement, the liquid configuration of the electrically conductive material may include an electrically conductive ink material. The liquid or other viscous configuration of the electrically conductive material can be applied by employing any operative printing technique or system.

An individual electrically conductive material can include an electrically conductive ink. The conductive ink includes the electrically conductive materials and can be formulated to print on the selected substrate using various printing processes. The conductive ink typically includes a vehicle that includes one or more resins and / or solvents. Various other ink additives known in the art, for example, antioxidants, leveling agents, flow agents and drying agents can be included in the conductive ink. The conductive ink may be in the form of an unpleasant solution or dispersion. The ink generally also includes one or more solvents that can be easily adjusted by the skilled practitioner for a desired rheology. The ink formulation is desirably mixed in a grinding mill to sufficiently wet the conductive particles with the vehicle eg, the solvent and the resin.

The conductive material may include silver, copper, gold, palladium, platinum, carbon or combinations of these particles. The average particle size of the conductive material may be within the range of between about 0. 5um and at around 20μp ?. Desirably, the size of Average particle can be between about 2μp? already around 5μt ?. Alternatively, the particle size average can be around 3μt ?. The amount of conductive material in the conductive trace or circuit path may be between about 60% and about 90% on a dry weight basis. Desirably, the amount of conductive material in the conductive trace may be between about 75% and about 85%, on a dry weight basis.

The electrically conductive particles can be flakes and / or powders. In particular arrangements, the conductive flakes have an average aspect ratio of between about 2 and about 50, and desirably between about 5 and about 15. The aspect ratio is a proportion of the largest linear dimension of a particle to the smallest linear dimension of the particle. For example, the aspect ratio of an ellipsoidal particle is the diameter along its principal axis divided by the diameter along its minor axis. For a flake, the aspect ratio is the longest dimension through the length of the flake divided by its thickness.

Suitable conductive flakes can include those sold by METALOR (a business having offices located in Attleboro, Massachusetts, USA), under the following trade designations: flakes P185-2 having a particle size distribution of essentially between about 2μp? and at around 18μt ?; the flakes P264-1 and P264-2 having particle size distributions essentially between about 0.5μt? and at around 5μ ??; the P204-2 flakes having a particle size distribution essentially between about? μt? and around of ?? μt ?; the 204-3 leaflets having a size distribution of particle essentially between? μt? and at around 8μt ?; the P204-4 leaflets having a particle size distribution essentially between about 2μp? and around of 9μp ?; the EA-2388 leaflets having a distribution of particle size of essentially between about? μp? and at around 9μt ?; SA-0201 chips having a particle size distribution essentially between about 0.5μp? and at around 22μt? and having a value medium of around 2.8μt ?; the flakes RA-0001 having a particle size distribution essentially of between about? μt? and at around 6μt ?; the flakes RA-0015 having a particle size distribution of essentially between about 2μ? and at around 17μp ?; and the flakes RA-0076 having a particle size distribution of essentially between about 2μ? and around 62μ? t ?, and having an average value of around 12μt ?.

Suitable silver powders can include those sold by METALOR under the following trade designations: powder C-0083P having a particle size distribution essentially between about 0.4μt? already around 4μp ?, and having a value, average of around 1. 2μt ?; K-0082P powder having a size distribution of particle essentially between about 0.4μt? already around 6.5μp ?, and having an average value of around 1. 7μt ?; and K-1321P powder having a particle size essentially between about? μt? and at around 4μp ?.

The conductive ink may include a resin. Suitable resins may, for example, include polymers, mixtures of polymers, fatty acids or the like, as well as combinations thereof. In particular arrangements, some resins can be used. Examples of such resins include alkyd resins LV-2190, LV-2183 and XV-1578 from Lawter International (a business having offices located in Kenosha, Wisconsin, E.U.A.). Also suitable are the shiny metal amber resin, the Z-kyd resin and the alkali refining linseed oil resin available from Erley Ink (a business having offices located in Broadview, Illinois, E.U.A.). Soybean resins, such as those available from Ron Ink Company (a business having offices located in Rochester, New York, E.U.A.) are also suitable.

Solvents for use in the conductive ink formulation are well known in the art, and a person can easily identify a number of suitable solvents to be used in a particular printing application. Solvents can generally comprise between about 3% and about 40% of the ink by weight on a wet basis. The amount may vary depending on several factors including the viscosity of the resin, the solvation characteristics of the solvent, and the conductive particle size, the distribution and surface morphology for any given printing method. Generally, the solvent can be added to the ink mixture until a desired ink rheology is achieved. The desired rheologies may depend on the printing method used, and it is well known to those skilled in the art and by the ink manufacturers.

The solvent in the conductive ink may include non-polar solvents such as a hydrocarbon solvent, water, and an alcohol such as isopropyl alcohol, and combinations thereof. Particular arrangements may employ an aliphatic hydrocarbon solvent. Examples of suitable solvents include the ISOPAR H aliphatic hydrocarbon solvent from Exxon Corporation (a business having offices located in Houston, Texas, USA), the EXX-PRINT M71a aliphatic and aromatic hydrocarbon solvent and EXX-PRINT 274a from Exxon Corporation; and the aliphatic and aromatic hydrocarbon solvents MCGEE SOL 52, MCGEE SOL 47 and MCGEE SOL 470 from Lawter International (Kenosha, Wisconsin, E.U.A.).

Various printing techniques can be employed to produce an indicium or individual electrically conductive circuit path. The printing techniques are conventional and commercially available. For example, the electrically conductive ink can be applied to the second substrate using the printing techniques known in the art to print inks on paper and other substrates, including, but not limited to offset-lithographic (wet, dry and waterless), flexographic , rotogravure (direct or offset), engraving, inkjet, electrophotographic (for example, chorrolaser and photocopy), and typographic printing. These printing methods are desirable because conventional methods for forming indicia on circuit boards include multiple steps (eg, photoresist, cure and pickling) that are time intensive, environmentally unfriendly, and relatively expensive. Commercial printing garments are preferably used to print on the substrates of the present invention. Commercial printing presses may require additional drying capacity to dry the ink after printing or require modifications to handle polymer films (e.g., to handle an electrostatic charge). These types of modifications are known in the art and typically can be ordered when a commercial printing press is purchased. Depending on the printing technology, a printing speed in the range of about 150 feet per minute to around 300-feet per minute easily. It is anticipated that even higher print speeds may be achieved, for example, around 1,000 feet per minute or more.

The electrically conductive ink may desirably be deposited in an amount such that the dried conductive trace or the circuit path has a thickness dimension which is within the range of about? Μp? to around dμp ?, depending on the printing process used. For example, a single print operation which provides an ink film thickness of around 2μp? at around 3μt? it is typically sufficient to achieve sufficient conductivity. The conductive ink can optionally be printed on the selected substrate two or more times to deliver more conductive ink to the selected substrate. In particular arrangements, the conductive ink is printed only once to avoid the matching problems that may arise when printing multiple items.

Optionally, the conductive ink can be dried at a selected drying temperature to help form the desired conductive path or path. In a particular aspect, the drying can be carried out before the step of immersing the indicia inside its associated cooperating substrate. The drying temperature is desirably selected to avoid excessive damage to the substrate or barrier layer material.

The conductive ink may be dried at the selected drying temperature to eject some or all of the solvent or carrier to minimize any bubbles containing trapped solvent, and / or minimize the pin holes or craters of the fast solvent operation. The conductive ink can be dried using an oven, such as a convection oven, or using an infrared and a radiofrequency drying, or ultraviolet (UV) radiation. In a particular arrangement, the heating device can be designed to allow the printed substrate to pass through it so that the conductive ink can be dried in a continuous manner to facilitate large-scale production. The drying temperature employed will depend on the ink used, the softening temperature of the selected substrate and the drying time or the web speed. Typical drying temperatures can be within the range of (around 52 ° C - 62 ° C). When used ultraviolet, the drying temperature can be at room temperature. After the drying step, the circuit element can be allowed to cool before the optional embed step. Alternatively, the drying step can be achieved continuously with the embedding step when the indicia is heated to the drying temperature.

In a desired aspect, at least the second matrix region 26 may include a treatment that provides for an operational formation of a selected resistance in the electrically conductive region, and the selected treatment may be provided by any operational configuration or technique. When the second matrix region 26 of the matrix substrate 22 is provided, the material initially provided in the second matrix region may or may not be modified or adjusted to significantly differ from the first matrix region 24 of the matrix substrate.

With reference to Figures 1-4, for example, substrate-matrix 22 can include a first matrix region 26 and at least a second matrix region 28, and at least the second matrix region 28 can be treated to include at least one second complementary material 32. In a particular arrangement, the substrate-matrix 22 may include a selected base material 30, and the base material is located in at least the first region of matrix 26. Additionally, the The base material may also extend into or may otherwise be located in the second matrix region 28. At least the second matrix-region 28 includes the complementary material 32. Optionally, the complementary material may be configured to extend only to the first matrix region 26. In the desired case, the electrically conductive material can be deposited on or otherwise be applied to the selected area of the complementary material 32 to provide the desired electrically conductive region 24.

The matrix base material 30 may, for example, be fibrous and include a first fibrous material. Alternatively, the base material may not be fibrous. For example, the base material may be a foam material or other cellular material. Typically, the base material includes surface pores, openings, hollow spaces or other surface interstices. Thus, the first matrix region 26 may include a first fibrous layer having a plurality of surface interstices. The second complementary material can also be fibrous or essentially non-fibrous as desired.

Figure 1 representatively shows a configuration in which the complementary material 32 includes fibers or is otherwise configured to be fibrous. As illustrated in the example shown, the fibrous base material 30 may also include a non-woven fabric. Suitable non-woven base fabrics may include spunbonded fabrics, woven-bonded fabrics or the like, as well as combinations thereof.

The complementary fibrous material 32 may include a nonwoven fibrous material that is provided separated from the base material. Suitable complementary materials may, for example, include non-woven fabrics, layers or layers of meltblown fibers or the like, as well as combinations thereof. In a desired feature, the layer and the complementary fibrous material 32 can provide a more continuous or otherwise improved support for the electrically conductive material that is applied to the complementary material 32.

In a desired representative arrangement, the matrix substrate 22 may have a base material which includes a spunbond fabric, and the complementary material may include a blown layer with fibrous melt provided separately. The meltblown fiber layer may have a relatively low porosity and a relatively low permeability with respect to the applied electrically conductive ink. The porosity and permeability of the meltblown material can, for example, be adjusted by controlling the pattern and density of the meltblown material. In a desired aspect, the meltblown material can be configured to operatively make a bridge through the surface interstices of the material in the second matrix region to support the electrically conductive region in a configuration having a desired strength.

The conductive ink or other conductive material may be applied to the layer of meltblown fibers during the manufacturing process in a location which is close to and subsequent to the point at which the melt blown fibers are applied to the base material 30. For example, conductive ink sprayed or otherwise printed at a location which is next to and close to the point at which a layer of meltblown fibers is formed on a fibrous layer bonded with yarn or base material 30.

In another feature, a separately provided layer of auxiliary material 34 may be applied or otherwise configured to operatively sandwich the complementary material 32 between the auxiliary material and the base material 30, as representatively shown in Figure 2. Additionally, the electrically conductive material may be in the form of a sandwich between the complementary material 32 and the auxiliary material 34.

In optional arrangements, article 30 may further comprise a third matrix region. In particular configurations, the third matrix region may include a third fibrous layer. Other aspects may have a first matrix region which includes a first fibrous layer, and a second matrix region which includes a second fibrous layer containing the meltblown fibers. In a further aspect, the second matrix region it can be placed in the form of a sandwich between the first matrix region and the third matrix region.

In alternating arrangements, a sandwich configuration of the complementary material 32 between the base material 30 and the auxiliary material 34 can be configured to provide an elastic material that can be stretched elastomically in one or more directions. Such materials that can be stretched can have the configuration of a narrow-bonded laminate (NBL), a stretched-attached laminate (SBL) or a vertical filament laminate (VFL). Therefore, the material that can be stretched can contain strips and other regions of electrically conductive material.

Figure 3 representatively shows a configuration in which at least the second matrix region 26 has a treatment with a complementary material 32 which essentially excludes the fibers or is otherwise configured to be essentially non-fibrous. As shown representatively, the first matrix region 26 may include a first fibrous or non-fibrous layer having a plurality of surface interstices. Additionally, the second matrix region 28 may include a corresponding fibrous or non-fibrous layer having a plurality of surface interstices. The second matrix region may also include a complementary filler material that operatively fills the hollow spaces of the surface interstices. By Thus, the filler material can help to bridge through at least the surface interstices of the second matrix region. In a particular aspect, the complementary filler material can operatively form a bridge through the surface interstices to support the electrically conductive region in a configuration having a desired resistivity.

The voids of surfaces or other surface interstices in the porous substrate material can be filled by the complementary material 32 in selected local areas to create the positioning zones 36 that are operatively non-porous. The conductive ink or other electrically conductive material can then be printed on or otherwise applied to the placement areas 36. Most of the base material of the matrix substrate 22 can remain significantly more porous and a relatively small percentage of the area The total total surface area of the substrate-matrix 22 can be operatively filled into the selected complementary filler material.

The placement zone filler material may include any operative material, and may desirably be applied while the filler material is in a liquid or semi-solid form. Suitable fillers may include a wax material, a hot melt adhesive material, a powder material synthetic or similar, as well as combinations thereof. The conductive ink or other electrically conductive material that is applied to an individual positioning zone 36 can be configured to penetrate the positioning zone or to extend on or around the terminal ring of the positioning zone to provide conductivity through the thickness dimension of the substrate material from a main face surface to an opposite face surface.

The filler material may have a selected melting point temperature. In particular aspects, the melting point temperature can be at least a minimum of about 38 ° C. The melting point temperature may alternatively be at least about 50 ° C, and may optionally be at least about 60 ° C to provide the desired benefits. In other aspects, the melting point temperature can be up to a maximum of about 150 ° C or more. The melting point temperature may alternatively be up to about 140 ° C, and may optionally be up to about 130 ° C to provide the desired effectiveness.

The melting point can be selected to conveniently allow a deposit or other application of the filler material to the second matrix region while the filler material is in a liquid or other operatively viscous state.

With reference to Figures 4-4A, at least one selected matrix region can include a treatment wherein a conductive ink or other electrically conductive material is operatively consolidated with one or more substrate materials. For example, the electrically conductive material can be operatively consolidated with the second matrix region 28. The electrically conductive material in an individual electrically conductive region 24 can be initially applied to a surface of the selected matrix region and the materials in the region. of selected matrix (e.g., in the second matrix region 28) can be fused, or otherwise integrated or combined in a composite material 38 by applying an operational compressive force F.

These base substrate materials in the selected matrix region can include any suitable material. Such materials may, for example, include an SMS material, a polymer film material, a nonwoven fabric material or the like, as well as combinations thereof. The material may also be elastomeric, and may include one or more layers or layers. Such material may, for example, include an NBL material, an SBL material, a VFL material or the like, as well as combinations thereof. For example, the selected matrix region may include a spunbonded web, a web base material, and a blown layer with fibrous melt. The electrically conductive material can be applied to the meltblowing layer.

The force F can be generated by any operative technique. Such techniques may, for example, include ultrasonic techniques, fluid pressure techniques or the like, as well as combinations thereof. The force of the conductive material in the selected matrix region can, for example, increase the density of the electrically conductive material so that the conductive material will more effectively maintain a desired high conductivity and a resistivity value (eg, ohms per unit length). conductor) while the electrically conductive region is operatively positioned to one side of the second matrix region and configured for intended use. This can also provide an improved ability to access the conductive path in the substrate material from one or both sides, depending on the application. The force of the electrically conductive material inside the composite material 38 can be controlled by adjusting the selected parameters. Such parameters may, for example, include the aggregate amount of a conductive ink, the fusion or force pressure applied to form the composite material 38, the geometry of the force device and the ink particle size compared to the size of the interstices in the matrix substrate material, as well as other parameters.

Thus, article 20 may have a first matrix region, and at least a second matrix region. The first matrix region may include a first fibrous layer, and the second matrix region may include a second fibrous layer. The electrically conductive material has been applied to the matrix material in the selected matrix region. Additionally, the second matrix region and the applied electrically conductive material have been operatively compacted together to provide the resistivity of the electrically conductive region.

In another aspect, the second matrix region 28 can be modified by melting, glazing, or melting fibers to create the operative positioning zone that is operatively non-porous (eg, a laying area having a fused area 38). The conductive ink or other electrically conductive material may be subsequently printed on or otherwise applied to the positioning areas. The majority of the base material of the matrix substrate 22 can remain significantly more porous, and a relatively small percentage of the overall total surface area of the matrix substrate 22 can be operatively filled with the fused material. In particular arrangements, the complementary material can be added to help provide the desired low porosity in the merged areas.

The second matrix region may include a second fibrous layer having a selected basis weight. In particular aspects, the basis weight of the second fibrous layer can be at least a minimum of about 5 grams per m2. The basis weight may alternatively be at least about 10 grams per m2, and may optionally be at least 15 grams per m2 to provide the desired benefits. In other aspects, the basis weight of the second fibrous layer can be up to a maximum of about 130 grams per m2, or more. The basis weight may alternatively be up to about 45 grams per m2 or 60 grams per m2, and may optionally be up to about 30 grams per m2 to provide the desired effectiveness. In another feature, the second matrix region can be operatively compacted to provide a selected composite density.

A further feature may include a matrix substrate 22 having a selected resistivity value. Therefore, at least the substrate part of the first matrix region 26, the second matrix region 28 and / or the other matrix region may have the selected resistivity value. In a particular aspect, the resistivity value can be at least a minimum of about mega-ohms per meter (? O / m). The resistivity value can alternatively be up to about 10? O / m, and can optionally be up to around 100 ? O / m, or more to provide the desired performance. In the desired arrays, the resistivity value of the matrix substrate 22, particularly in the first matrix region 26, can be at least about one order of magnitude (10 times) greater than a resistivity value of the region electrically conductive 2 The resistivity value of the matrix substrate 22 may alternatively be at least about 100 times greater than the resistivity value of the electrically conductive region 24 and may optionally be at least about 1,000 times greater than the resistivity value of the electrically conductive region 24. resistivity value of the electrically conductive region to provide the improved benefits.

An individual electrically conductive region 24 can have a selected electrical resistance per unit length value. In a desired aspect, the resistance per unit length value can be essentially zero O / m (ohms / meter). In other aspects, the electrical resistance value per unit length may not be more than a maximum of about 1? O / m (Mega-ohms / meter). The resistance per unit length value may alternatively not be more than about 1? O / m (kilo-ohms / meter), and may optionally not be more than about? O / meter to provide an effectiveness improved In another aspect, the resistivity value of an electrically conductive region 24 can be essentially zero ohms per square per thousandth of an inch of the electrically conductive material (O / square per thousandth of an inch), where: 1 thousandth of an inch = 0.001 inches . The resistivity value can alternatively be as low as? O / square per thousandth of an inch, and can optionally be as low as? O / square per thousandth of an inch. In other respects, the resistivity value may not be more than a maximum of about 33? O / square per thousandth of an inch. The resistivity value can alternatively be no more than about 16? O / square per thousandth of an inch and can optionally not be more than about 8? O / square per thousandth of an inch to provide improved effectiveness.

A suitable procedure for determining resistivity values in terms of "ohms per square per thousandth of an inch" is ASTM F1896-98 (newly approved 2004). The test method to determine the electrical resistivity of a printed conductive material.

In a desired feature, the electrically conductive region may have a relatively longer extension dimension and a width dimension of relatively shorter transverse frame 40. The electrically conductive region may extend longitudinally along an essentially continuous electrically conductive path length dimension of at least about 0.1 centimeter. The length of the electrically conductive path may alternatively be at least about 1 centimeter, and may optionally be at least about 100 centimeters. In another feature, the electrically conductive path length may alternatively be up to 1,000 centimeters or more.

A further feature may include an electrically conductive region 24 having a cross-frame dimension of up to about 10 centimeters. The cross-frame dimension may alternatively be about 5 centimeters or less, and may optionally be about 1 centimeter or less to provide desired benefits. Additionally, the transverse frame dimension can be as low as 0.1 centimeters or less.

It should be readily apparent that the length, width and other dimensions of an individual electrically conductive region can be determined by employing standard microscopy techniques. Such techniques are conventional and are well known in the art.

With reference to Figures 5 and 6, another aspect of the article can include at least one electrically conductive circuit path 50 or another electrically conductive region which has been operatively connected to a sensor mechanism 46 which can provide selected sensor data. In a further aspect, at least another electrically conductive circuit path 52 can be operatively connected to an electrical processor mechanism 48 which can be operatively received sensor data and provide selected signal data.

Any appropriate sensing or interrogation and detection system or device can be operatively employed to provide the sensor mechanism 46 that is incorporated with the method. A suitable sensor mechanism can, for example, include a wet sensor, a motion sensor, a temperature sensor, a humidity sensor, a pressure sensor, a position sensor, a proximity sensor, a light sensor, an odor sensor or the like as well as combinations thereof.

It should be appreciated that any data or appropriate information can be operatively included in the sensor data that is generated with the method. Suitable sensor data can, for example, include resistance, voltage, capacitance, inductance, humidity, movement, temperature, wet, pressure, position, proximity, light, smell or the like, as well as combinations thereof.

Any appropriate evaluation or computation and evaluation system or device may be appropriately included with the electronic processor mechanism 48. A suitable electronic processor mechanism may, for example, include a microcontroller, a microprocessor, an analog-to-digital converter, a LEAK (programmable field gate arrangement), an EEPRO (electrically erasable programmable read only memory), an electronic memory device or the like, as well as combinations thereof. The electronic processor may collect, process, store, analyze, convert analog or digital data, provide feedback or the like, - as well as combinations thereof.

It should be appreciated that any appropriate information or data can be operatively included in the signal data that is generated with this method. Suitable signal data may, for example, include data relating to light, sound, touch, smell, electrical impulses, biometric data, movement, vibration, wireless communication or the like as well as combinations thereof.

In desired arrangements, the electronic processor mechanism 48 can be configured to transfer the data signal to another relatively remote location. As shown representatively, for example, the method of the invention can be configured to transmit signal data with a wireless communication link to a remote receiving device 56.

A suitable product article, such as a representative personal care item, can be configured to configure the present invention. As illustrated, the product article 60 may, for example, be configured to provide a diaper for infant, or a training underpants for child care. The product article may have an outer cover layer 62 and a first circuit path 50 positioned along a side surface outward or sideways to the selected body of a nonwoven fabric component. Optionally, the product article may include one or more second circuit paths 52 positioned along a side-to-side surface of the outer cover. As shown representatively, the product article may include one or more first complementary circuit paths 50a, which are positioned along a selected surface of a selected nonwoven fabric component, and one or more second complementary circuit paths. 52a placed along a side-to-garment surface of the outer cover.

In a particular configuration, the first circuit paths 50 and 50a can be operatively connected to a selected sensor mechanism. In the arrangement shown representatively, for example, the sensor mechanism may be a wet sensor.

The sensor mechanism can, for example, be configured to configure one or more functions or operations belonging to a wireless, audio, visual and / or tactile indication of a monitored event. Additionally, the sensor mechanism may, for example, be configured to provide one or more functions or operations belonging to a number of events, time durations between events, as well as any other statistics pertaining to a selected event, as desired by an user. As shown representatively, for example, the sensor mechanism may be an internal sensor that is configured to detect a presence of an aqueous liquid, which is inside the product article 60 and is present above a selected threshold level.

Additionally, the circuit paths 50 and 50a can be operatively connected to the selected electronic processor mechanism 48. In the example arrangement shown representatively, for example, the electronic processor mechanism can be a microcontroller, and a Suitable circuit can be extended through the thickness of the intervening components to interconnect the first circuit paths 50 with the second circuit paths 52. Additionally, the electronic processor mechanism can be selectively connected to the cooperating circuit paths to provide a desired operation. The electronic processor mechanism may for example be configured to convert data (analog to digital or digital to analog), store data, activate a predetermined response, allow a user to interrupt, provide a conditioning signal, computer and process algorithms or the like , as well as combinations thereof.

As shown representatively, at least a selected part of the first circuit path (50 and / or 50a) is positioned next to one side of at least one operating part of the second circuit path (52 and / or 52a) in an electrically predetermined junction location. The outer cover 62 has a position that is interposed between the first and second circuit paths, and is composed of a material that provides an electrically insulating barrier layer which is interposed between the first circuit path and the second circuit path in the first union location. The first circuit paths 50 and / or 50a are configured to connect operatively to the second ones circuit paths 52 and / or 52a through the thickness dimension of the outer cover 62 with a mechanical joint placed in the first junction location. Desirably, the mechanical bond includes an ultrasonic joint. The mechanical link is configured to provide an electrically conductive junction path 54 between the first designated circuit path and the second circuit path designated at the first junction location.

An example of a suitable technique for providing an electrically conductive bond path through an intervening layer of an insulating material is described in U.S. Patent Application Serial No. 11 / 514,541 entitled ELECTRICALLY CONDUCTIVE BRIDGE IN AN ARTICLE OF MULTIPLE CONDUCTIVE LAYERS by Darold Tippey et al. (Attorney's issue number 64121572US01), which was filed on August 31, 2006. The description of this document is hereby incorporated by reference in a manner that is consistent with said description.

As shown representatively, a separately provided external electronic processor mechanism 48 can be operatively connected to the second circuit paths 52 and / or 52a. In the desired arrangements, the electronic processor mechanism 48 can be removably attached or otherwise removably connected to the second circuit paths 52 and / or 52a on the surface outer of the outer cover 62. Therefore, the electrically conductive bonding path can be used to operatively connect the sensor mechanism internally positioned to the external electronic processor mechanism, provided separately with an operational electrically conductive connection.

The product article 60 may also include a topsheet or a body-facing liner layer 64, an absorbent structure 66 positioned between the outer cover layer 62 and the topsheet layer 64. Additionally, the product article 60 may include other components such as fasteners, elastic members, transfer layers, distribution layers or the like as desired in a conventional arrangement that is well known in the art.

The outer cover layer 62 may be constructed of any operative material that may not be configured to be liquid permeable operatively. In a particular configuration, the outer cover layer 62 can be configured to provide a liquid impervious layer operatively. The outer cover layer may, for example, include a polymeric film, woven fabric, a non-woven fabric or the like, as well as combinations or compounds thereof. For example, the outer cover layer 62 may include a polymer film laminated to a woven or non-woven fabric. In a particular feature, the film of The polymer can be composed of a polyester, polyethylene, polypropylene or the like as well as combinations thereof. Additionally, the polymer film can be micro-recorded. Desirably, the outer cover layer 62 can operatively allow a passage of sufficient air and moisture vapor out of the product article, particularly out of an absorbent (e.g., an absorbent or storage structure 66) while blocking the passage of body fluids.

The top sheet layer 64 can be constructed of any operative material and can be a composite material. For example, the top sheet layer may include a woven fabric, a nonwoven fabric, a polymer film or the like as well as combinations thereof. Examples of a non-woven fabric include a spunbonded fabric, a meltblown fabric, a coform fabric, a carded fabric, a bonded and bonded fabric or the like as well as combinations thereof. For example, the top sheet layer may include a woven fabric, a nonwoven fabric, a polymeric film that has been configured to be operatively impermeable to liquid or the like, as well as combinations thereof.

Other examples of suitable materials for building the top sheet layer may include rayon, carded and bonded fabrics of polyester, polypropylene, polyethylene, nylon or other fibers that may be bonded by heat, polyolefins, such as copolymers of polypropylene and polyethylene, linear low density polyethylene, aliphatic esters such as polylactic acid, finely perforated film fabrics, network materials and the like as well as combinations thereof.

The top sheet layer 64 may also have at least a part of its body side surface treated with a surfactant to make the top sheet more hydrophilic. The surfactant can allow the arrangement of body fluids to more easily penetrate the top sheet layer. The surfactant may also decrease the possibility that arriving body fluids, such as menstrual fluid, will flow out of the top sheet layer rather than penetrate through the top sheet layer into other components of the product article. (for example, inside the absorbent body structure 66). In a particular configuration, the surfactant can be evenly distributed in essential form through at least a part of the side surface to the upper body of the upper sheet layer 64 that lies on the side surface of the upper body of the absorbent.

The top sheet layer 64 typically extends over the side surface to the upper body of the absorbent structure, but may alternatively extend further around the product article to surround or enclose partially or completely the absorbent structure. Alternatively, the upper sheet layer 64 and the outer cover layer 62 may have peripheral margins which extend outwardly beyond the terminal, the peripheral edges of the absorbent structure 66, and the spreading margins may be joined together to surround or partially or completely enclose the absorbent structure.

The structure of the absorbent body 66 may include a matrix of absorbent fibers and / or absorbent particulate material. The absorbent fiber may include a natural or synthetic fiber. The absorbent structure 66 may also include a super absorbent material, and the super absorbent material may be in the form of particles having selected sizes and shapes. Super absorbent materials suitable for use in the present invention are known to those skilled in the art. As a general rule, the hydrogel-forming polymeric absorbent material generally water-insoluble and water-swellable (super absorbent) is capable of absorbing at least about 10, desirably at about 20 and possibly about 100 times or more its weight in water Additionally, the absorbent body structure 66 may comprise a compound. The absorbent composite may, for example, include a take-up layer, a distribution layer and / or a storage / retention layer as desired.

An example of a personal care item may include a sensor system and is described in U.S. Patent Application Serial No. 11 / 303,283 entitled GARMENTS WITH EASY-TO-USE SIGNALING DEVICE of Andrew Long et al. attorney number 22,139) which was filed on December 15, 2005. The full description of this document is hereby incorporated by reference in a manner that is consistent therewith.

Those experts in the. The art will recognize that the present invention is capable of many modifications and variations without departing from the scope thereof. Therefore, the detailed description and the examples set forth are intended to be illustrative only and are not intended to limit, in any way, the scope of the invention as set forth in the attached clauses.

Claims

R E I V I N D I C A C I O N S

1. A disposable item of limited use, comprising: a substrate-matrix which includes a network that extends in an essentially continuous form of matrix material; an electrically conductive region of separately provided electrically conductive material that has been operatively applied to the substrate-matrix from a viscous configuration to the electrically conductive material; wherein the substrate-matrix includes a first matrix region and at least one second matrix region; at least a second matrix region includes a treatment that provides an operational formation of a selected resistivity in the electrically conductive region; the first matrix region has a resistivity value of at least about 5MQ / m; the electrically conductive region is operatively positioned to one side of the second matrix region; the electrically conductive region has an operatively low resistivity value, as determined when the electrically conductive region is operatively positioned to one side of the second matrix region and configured for intended use.

2. An article as claimed in clause 1, characterized by the fact that the electrically conductive region has a resistivity value of no more than about 1? O /?

3. An article as claimed in clause 1, characterized in that the electrically conductive region has a resistivity value of no more than about 3? O / square per thousandth of an inch.

4. An article as claimed in clause 1, characterized in that the electrically conductive region has a corresponding resistivity value, and the first matrix region has a resistivity value which is at least about 10 times the resistivity value of the electrically conductive region.

5. An article as claimed in clause 1, characterized in that the second matrix region has a basis weight of up to about 130 g / m2.

6. An article as claimed in clause 1, characterized in that the matrix material is configured to provide a plurality of interconnected matrix elements.

7. An article as claimed in clause 1, characterized in that the matrix material is configured to provide a plurality of interconnected fibers.

8. An article as claimed in clause 1, characterized in that the first matrix region includes a first fibrous region; the second matrix region includes a second fibrous region.

9. An article as claimed in clause 8, characterized in that the second matrix region includes a layer of meltblown fibers.

10. An article as claimed in clause 1, characterized in that it also comprises a third matrix region, wherein the first matrix includes a first fibrous region; the second matrix region includes a second fibrous layer containing meltblown fibers; the third matrix region includes a third fibrous region; the second matrix region is in sandwich form between the first matrix region and the third matrix region.

11. An article as claimed in clause 1, characterized in that the first matrix region includes a first fibrous region having a plurality of surface interstices; the second matrix region includes a filler material that operationally bridges through the surface interstices of the second matrix region to supporting the electrically conductive region in a configuration having a resistivity value of no more than about 1? O / m.

12. An article as claimed in clause 11, characterized in that the filling material has a melting point temperature of at least about 38 ° C and has been applied to the second matrix region from a liquid state.

13. An article as claimed in clause 12, characterized in that the filling material includes a wax or hot melt adhesive.

14. An article as claimed in clause 1, characterized in that the first matrix region includes a first fibrous region having a basis weight of up to about 130 g / m2; the second matrix region includes a second fibrous region having a basis weight of up to about 130 grams per m2.

15. An article as claimed in clause 1, characterized in that the first matrix region includes a first fibrous region; the second matrix region includes a second fibrous region; the second matrix region and the applied electrically conductive material have been operatively compacted together to provide the resistivity of the electrically conductive region.

16. An article as claimed in clause 1, characterized in that the electrically conductive material has been applied to the matrix substrate from an operatively liquid configuration of the electrically conductive material.

17. An article as claimed in clause 1, characterized in that the electrically conductive material includes an electrically conductive ink material that has been printed on the matrix substrate.

18. A disposable article of limited use that includes: a matrix substrate provided by an essentially continuous extension of the network of interconnected matrix elements including the matrix material; an electrically conductive region of a separately provided electrically conductive material that has been applied to the matrix substrate from an operably liquid configuration of the electrically conductive material; where the substrate-matrix includes a first matrix region and at least one second matrix region; the at least the second matrix region includes a treatment that provides an operational formation of a second resistivity in the electrically conductive region; the first matrix region has a resistivity value of at least a minimum of about 5 ? O / m; the second matrix region has a resistivity value of at least a minimum of about 5 ? O / m; the electrically conductive region is operatively positioned adjacent to the second matrix region; the electrically conductive region has a resistivity value of no more than about 1 O / m as determined when the electrically conductive region is operatively positioned to one side of the second matrix region and configured for intended use; Y the resistivity value of the first matrix region is at least about 10 times the resistivity value of the electrically conductive region.

19. An article as claimed in clause 18, characterized by the first matrix region includes a first fibrous region; the second matrix region includes a second fibrous region containing meltblown fibers.

20. An article as claimed in clause 18, characterized in that the first matrix region includes a first fibrous region having a plurality of surface interstices; the second matrix region includes a filler material that operationally bridges through the surface interstices of the second matrix region to support the electrically conductive region in a configuration having a resistivity value of no more than about 1? O / m. SUMMARY A disposable, limited use article comprises a substrate-matrix and an electrically conductive region of a separately provided electrically conductive material that has been operatively applied to the substrate-matrix from a viscous configuration of the electrically conductive material. The substrate-matrix includes a first matrix region and at least one second matrix region. At least the second matrix region may include a treatment that provides for an operational formation of a selected resistivity in the electrically conductive region. The first matrix region has a resistivity and an electrically conductive region that is operatively positioned to one side of the second matrix region. The electrically conductive region has a low resistivity, which was determined when the electrically conductive region is operatively positioned to one side of the second matrix region and configured for its intended use.