MX169778B - Composiciones curables y componentes electricos o electronicos o dispositivos, encapsulados con las mismas - Google Patents

Composiciones curables y componentes electricos o electronicos o dispositivos, encapsulados con las mismas

Info

Publication number
MX169778B
MX169778B MX013977A MX1397788A MX169778B MX 169778 B MX169778 B MX 169778B MX 013977 A MX013977 A MX 013977A MX 1397788 A MX1397788 A MX 1397788A MX 169778 B MX169778 B MX 169778B
Authority
MX
Mexico
Prior art keywords
components
encapsulated
electrical
devices
same
Prior art date
Application number
MX013977A
Other languages
English (en)
Inventor
Kyle B Benkendorfer
Ha Quoc Pham
David B Fritz
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Publication of MX169778B publication Critical patent/MX169778B/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

La presente invención se refiere a una composición curable que comprende, por lo menos una resina epóxica bromada y una cantidad de curación de por lo menos un agente de curación para la resina epóxica.
MX013977A 1987-11-30 1988-11-29 Composiciones curables y componentes electricos o electronicos o dispositivos, encapsulados con las mismas MX169778B (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12638987A 1987-11-30 1987-11-30

Publications (1)

Publication Number Publication Date
MX169778B true MX169778B (es) 1993-07-26

Family

ID=22424559

Family Applications (1)

Application Number Title Priority Date Filing Date
MX013977A MX169778B (es) 1987-11-30 1988-11-29 Composiciones curables y componentes electricos o electronicos o dispositivos, encapsulados con las mismas

Country Status (7)

Country Link
EP (1) EP0318824A3 (es)
JP (1) JPH02623A (es)
KR (1) KR890008251A (es)
BR (1) BR8806337A (es)
IL (1) IL88389A (es)
MX (1) MX169778B (es)
NZ (1) NZ227105A (es)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3720721A (en) * 1970-07-09 1973-03-13 Gen Electric Halogenated biphenols and methods for preparing the same
US4647648A (en) * 1985-08-26 1987-03-03 The Dow Chemical Company Polyhydroxyethers from hydroxybiphenyls
US4661644A (en) * 1985-09-09 1987-04-28 The Dow Chemical Company Brominated epoxyaromatic compounds
CA1272345A (en) * 1986-02-24 1990-07-31 The Dow Chemical Company Curable compositions containing a polyepoxide and a halogenated bisphenol
US4727119A (en) * 1986-09-15 1988-02-23 The Dow Chemical Company Halogenated epoxy resins

Also Published As

Publication number Publication date
IL88389A (en) 1992-02-16
BR8806337A (pt) 1989-08-15
KR890008251A (ko) 1989-07-10
JPH02623A (ja) 1990-01-05
EP0318824A2 (en) 1989-06-07
AU614789B2 (en) 1991-09-12
AU2519988A (en) 1989-06-01
IL88389A0 (en) 1989-06-30
NZ227105A (en) 1991-09-25
EP0318824A3 (en) 1991-01-30

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