MD2197C2 - Electrochemical process for obtaining of highly dispersed copper and installation for realization thereof - Google Patents

Electrochemical process for obtaining of highly dispersed copper and installation for realization thereof Download PDF

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Publication number
MD2197C2
MD2197C2 MDA20010159A MD20010159A MD2197C2 MD 2197 C2 MD2197 C2 MD 2197C2 MD A20010159 A MDA20010159 A MD A20010159A MD 20010159 A MD20010159 A MD 20010159A MD 2197 C2 MD2197 C2 MD 2197C2
Authority
MD
Moldova
Prior art keywords
cathode
copper
solution
working
highly dispersed
Prior art date
Application number
MDA20010159A
Other languages
Romanian (ro)
Russian (ru)
Other versions
MD2197B2 (en
MD20010159A (en
Inventor
Ольга КОВАЛЁВА
Виктор КОВАЛЁВ
Original Assignee
Государственный Университет Молд0
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Государственный Университет Молд0 filed Critical Государственный Университет Молд0
Priority to MDA20010159A priority Critical patent/MD2197C2/en
Publication of MD20010159A publication Critical patent/MD20010159A/en
Publication of MD2197B2 publication Critical patent/MD2197B2/en
Publication of MD2197C2 publication Critical patent/MD2197C2/en

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Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/20Recycling

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  • ing And Chemical Polishing (AREA)

Abstract

The invention relates to a process for obtaining of highly dispersed copper and may be used in the industries, wherein there are formed wastes of copper etching used solutions, in particular in the production of printed circuit boards.Summary of the invention, according to the proposed process, consists in that it is carried out the electrolysis of the working solution and separation of the copper in the form of suspension, and in the capacity of working solution it is used the used solution of copper etching from the printed circuit boards, with copper ions concentration of 30…120 g/L. The process is conducted at the temperature of 20…25°C, the cathode current density being of 10…20 A/dm2, and the highly dispersed copper is removed from the cathode surface, which is preliminarily wetted with 0,5…1% solution of oleic acid in toluole.The device for realization of the said process contains a body with a cylindrical cathode, installed within it and concentrically placed anodes, pipes for inlet and outlet of the working solution, the cathode being made in the form of a hollow drum of stainless steel and situated in the upper part of the body with the possibility of rotation so that the upper part of the cathode be placed beyond the working volume of the body and provided with a device for dispersed copper removal from the cathode surface. The anodes are inclined placed under the cathode in the chambers with ion exchanging membranes, the upper parts of the chambers being brought outside the limits of the lateral walls of the body, the lower part is executed conic for sediment withdrawal and includes a circulating system, and in the upper part of the body it is disposed an indicator of the working and toluol solutions level.
MDA20010159A 2001-03-19 2001-03-19 Electrochemical process for obtaining of highly dispersed copper and installation for realization thereof MD2197C2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
MDA20010159A MD2197C2 (en) 2001-03-19 2001-03-19 Electrochemical process for obtaining of highly dispersed copper and installation for realization thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MDA20010159A MD2197C2 (en) 2001-03-19 2001-03-19 Electrochemical process for obtaining of highly dispersed copper and installation for realization thereof

Publications (3)

Publication Number Publication Date
MD20010159A MD20010159A (en) 2003-03-31
MD2197B2 MD2197B2 (en) 2003-06-30
MD2197C2 true MD2197C2 (en) 2003-12-31

Family

ID=19739850

Family Applications (1)

Application Number Title Priority Date Filing Date
MDA20010159A MD2197C2 (en) 2001-03-19 2001-03-19 Electrochemical process for obtaining of highly dispersed copper and installation for realization thereof

Country Status (1)

Country Link
MD (1) MD2197C2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110042425A (en) * 2019-04-23 2019-07-23 博罗县华盈科技有限公司 A kind of heavy process for copper of alkaline etching waste liquid for producing direct electrowinning

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Витязь П.А., Капцевич В.М., Косторнов А.Г. и др. Формирование структуры и свойств пористых порошковых материалов, Москва, Металлургия, 1993, с. 17-18 *
Практикум по прикладной электрохимии. Под ред. В.Н. Варыпаева, Ленинград, Химия, 1990, с. 132-140 *

Also Published As

Publication number Publication date
MD2197B2 (en) 2003-06-30
MD20010159A (en) 2003-03-31

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Legal Events

Date Code Title Description
KA4A Patent for invention lapsed due to non-payment of fees (with right of restoration)
MM4A Patent for invention definitely lapsed due to non-payment of fees