LU80214A1 - PROCESS FOR MANUFACTURING A THIN, COPPER-COATED COMPOSITE ELEMENT - Google Patents
PROCESS FOR MANUFACTURING A THIN, COPPER-COATED COMPOSITE ELEMENTInfo
- Publication number
- LU80214A1 LU80214A1 LU80214A LU80214A LU80214A1 LU 80214 A1 LU80214 A1 LU 80214A1 LU 80214 A LU80214 A LU 80214A LU 80214 A LU80214 A LU 80214A LU 80214 A1 LU80214 A1 LU 80214A1
- Authority
- LU
- Luxembourg
- Prior art keywords
- copper
- thin
- manufacturing
- composite element
- coated composite
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2202/00—Metallic substrate
- B05D2202/40—Metallic substrate based on other transition elements
- B05D2202/45—Metallic substrate based on other transition elements based on Cu
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2401/00—Form of the coating product, e.g. solution, water dispersion, powders or the like
- B05D2401/30—Form of the coating product, e.g. solution, water dispersion, powders or the like the coating being applied in other forms than involving eliminable solvent, diluent or dispersant
- B05D2401/32—Form of the coating product, e.g. solution, water dispersion, powders or the like the coating being applied in other forms than involving eliminable solvent, diluent or dispersant applied as powders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/1355—Powder coating of insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Laminated Bodies (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB7836381A GB2031022B (en) | 1978-09-11 | 1978-09-11 | Copper foilplastic compsites |
LU80214A LU80214A1 (en) | 1978-09-11 | 1978-09-11 | PROCESS FOR MANUFACTURING A THIN, COPPER-COATED COMPOSITE ELEMENT |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB7836381A GB2031022B (en) | 1978-09-11 | 1978-09-11 | Copper foilplastic compsites |
LU80214A LU80214A1 (en) | 1978-09-11 | 1978-09-11 | PROCESS FOR MANUFACTURING A THIN, COPPER-COATED COMPOSITE ELEMENT |
Publications (1)
Publication Number | Publication Date |
---|---|
LU80214A1 true LU80214A1 (en) | 1979-10-29 |
Family
ID=26268817
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
LU80214A LU80214A1 (en) | 1978-09-11 | 1978-09-11 | PROCESS FOR MANUFACTURING A THIN, COPPER-COATED COMPOSITE ELEMENT |
Country Status (2)
Country | Link |
---|---|
GB (1) | GB2031022B (en) |
LU (1) | LU80214A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2557497A1 (en) * | 1983-12-29 | 1985-07-05 | Demeure Loic | POLYPROPYLENE-BASED METALLIC SUPPORT AND METHOD FOR MANUFACTURING THE SAME |
-
1978
- 1978-09-11 LU LU80214A patent/LU80214A1/en unknown
- 1978-09-11 GB GB7836381A patent/GB2031022B/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2557497A1 (en) * | 1983-12-29 | 1985-07-05 | Demeure Loic | POLYPROPYLENE-BASED METALLIC SUPPORT AND METHOD FOR MANUFACTURING THE SAME |
Also Published As
Publication number | Publication date |
---|---|
GB2031022B (en) | 1982-12-01 |
GB2031022A (en) | 1980-04-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATA40179A (en) | METHOD FOR PRODUCING A FILTER ELEMENT | |
ATA102477A (en) | METHOD FOR PRODUCING A RETRORE-REFLECTING COATING MATERIAL | |
ATE6232T1 (en) | PROCESS FOR MANUFACTURING A THREE-DIMENSIONAL LAMINATE. | |
AT370397B (en) | METHOD FOR PRODUCING A LIGHTWEIGHT MATERIAL | |
AT351325B (en) | PROCESS FOR MANUFACTURING FITTED PIPE | |
ATA296079A (en) | METHOD FOR PRODUCING THE NEW 17ALPHAETHINYL-1,3-DIBENZOYLOXY-7ALPHA-METHYL-1,3,5 (10) OESTRATRIEN-17BETA-OLS | |
AT362887B (en) | METHOD FOR PRODUCING A NEW 1,5DISUBSTITUTED-2-PYRROLIDONE COMPOUND | |
AT362789B (en) | METHOD FOR PRODUCING NEW N-ARYL-1,3OXAZOLIDIN-2,4-DIONES | |
ATE4638T1 (en) | PROCESS FOR MAKING AN INSULIN. | |
LU80214A1 (en) | PROCESS FOR MANUFACTURING A THIN, COPPER-COATED COMPOSITE ELEMENT | |
AT378175B (en) | METHOD FOR PRODUCING A LIGHTWEIGHT MATERIAL | |
ATA922578A (en) | METHOD FOR MANUFACTURING LAMINATE | |
AT367771B (en) | METHOD FOR PRODUCING THE NEW CHLORMETHYL -17ALPHA-ACETOXY-9ALPHA-FLUOR-11BETA-HYDROXY -16BETA-METHYL-3-OXOANDROSTA-1,4-DIEN-17BETA-CARBOXYLATE | |
AT361527B (en) | METHOD FOR PRODUCING A COMPOSITE | |
DD139335A3 (en) | METHOD FOR PRODUCING A FREELAGUE-PROOFING LIME-MAGNESIUM LIGHTWEIGHT AGENT | |
AT376685B (en) | METHOD FOR PRODUCING NEW PHOSPHOBETAINES | |
ATA282779A (en) | METHOD FOR PRODUCING A HETEROCICAL CONNECTION | |
AT376683B (en) | METHOD FOR PRODUCING NEW 1-OXA-4-AZA-2,6-DISILACYCLOHEXANES | |
ATA966076A (en) | METHOD FOR MANUFACTURING A PARTICULAR PANEL-SHAPED LIGHTWEIGHT MATERIAL | |
AT350502B (en) | PROCESS FOR PRODUCING A NEW, FINE-GRAY, LIGHT-GREEN BASIC COPPER (II) - SULPHATE | |
ATE17450T1 (en) | PROCESS FOR MAKING A FLAT COMPOSITE MATERIAL. | |
ATE17911T1 (en) | PROCESS FOR MANUFACTURE OF A HEATING ELEMENT. | |
DD136367A1 (en) | METHOD FOR PRODUCING A COMPOSITE | |
AT368139B (en) | METHOD FOR PRODUCING 2-ALKOXY-4,6-DICHLOR-S-TRIAZINES | |
AT367417B (en) | METHOD FOR PRODUCING A NEW 3,4DIHYDROXYZIMTALDEHYDE DERIVATIVE |