KR980701133A - Wet Chemical Treatment Installation - Google Patents

Abstract

Apparatus 20 for chemical wet treatment of an engine 25 in a tank 21 containing a processing fluid 23 comprising at least one substrate carrier 17 and a lifting device 1 for inserting and discharging substrates ), continuous ejection and insertion is achieved by the lifting device comprising a first transport carriage for the substrate 25 and a second transport carriage for the substrate carrier 17 .

Description

Wet Chemical Treament Installation

Since this content is a publicly disclosed case, the full text is not included.

Currently, automatic wet processing equipment includes a number of vessels or tanks for a series of chemical wet processing. After completion of the chemical treatment sequence or between treatment steps, a substrate, for example a silicon wafer arranged in a cassette, is immersed in a cleaning tank and then dried.

For example, drying of the substrate may be performed by a centrifuge while slowly withdrawing the substrate from the cleaning tank.

EP 0 385 536 discloses a drying method in which, in addition to slowly withdrawing the substrate, vapor generated from a bath is applied to the substrate and the vapor diffuses into a liquid without condensing on the substrate. A concentration gradient is formed at the meniscus on the substrate surface to form a surface tension gradient, which causes the liquid to move away from the substrate and thus dry the substrate without residue. During the chemical wet process, i.e. each cleaning and drying, the substrate is fixed in a carrier called a wafer cassette, the slot of which is formed on the inner surface of the sidewall of the cassette. Such standard carriers have a relatively large surface, especially with edges and corners, so that a relatively large amount of chemical is transferred from one treatment tank to another and each from one bath to another, so that the drying treatment is not possible. make it difficult The edge and large surface area of conventional carriages prolong the time of each cleaning, cleaning and drying step during processing, because relatively large amounts of liquid adhere to surfaces, edges and corners and removal of chemicals by cleaning is difficult. Because it's more complicated. However, if the carrier does not have side guides, it does not provide side guides for the substrate during lifting. In the known device, the side carrier guide is used to hold the substrate when lifting the substrate from the bath in order to prevent the substrate from turning over when lifting the substrate from the carrier.

From Japanese Application No. 5-27 06 60(A), an apparatus of the above-mentioned kind having a lifting member with a transfer carriage for inserting and withdrawing a substrate and a carrier into and out of the container for chemical wet processing is known. In the case of insertion and ejection described in connection with the apparatus of European application 0 385 536A, the substrate is held in the carrier for ejection and insertion together with the carrier.

No. 5,299,901 discloses a substrate manipulator in which a first transfer carriage moves a carrier for a substrate and a second transfer carrier moves the substrate relative to the carrier. Insertion and ejection of substrates, substrate carriers for containers for chemical wet processing of substrates, and related requirements and difficulties are not described.

No. 5,299,901 discloses a substrate manipulator in which a first transfer carriage moves a carrier for a substrate and a second transfer carrier moves the substrate relative to the carrier. Insertion and ejection of substrates, substrate carriers for containers for chemical wet processing of substrates, and related requirements and difficulties are not described.

U.S. Patent No. 4,963,069 discloses a substrate handling device in which a substrate carrier is raised and lowered by means of a lifting device and a piston-cylinder unit having an engagement portion for a lifting rod is provided for disengaging the substrate carrier from the lifting movement.

German Patent No. 34 25 267 discloses a substrate transport and substrate handling device in which a substrate in a substrate carrier can be lifted and the substrate can be lifted out of the carrier.

U.S. Patent No. 3,493,093 shows and discloses a conveying and manipulating organ by which an object can be lifted and conveyed such that a control curve is used.

The present invention relates to an apparatus for chemically wet processing a substrate in a tank containing a processing fluid, comprising at least one substrate carrier and a lifting device for inserting and withdrawing a substrate, and a drying method using a lifting member.

1 is a rear view of an embodiment of a lifting device for a drying system of the present invention;

Fig. 2 is a side view of the lifting device of Fig. 1;

Fig. 3 is a cross-sectional view of a drying apparatus for chemical wet treatment, at the same time showing the first stage of the drying method of the present invention.

Figure 4 shows the second stage of the drying method of the present invention.

Figure 5 shows a third stage of the drying method of the present invention.

6 shows a fourth step of the drying method of the present invention.

7 shows a fifth step of the drying method of the present invention.

Figure 8 shows the sixth step of the drying method of the present invention.

9 shows a seventh step of the drying method of the present invention.

Figure 10 shows an eighth step of the drying method of the present invention.

11 shows an embodiment of the device according to the invention schematically showing the drip plate in the larynx;

12 shows another embodiment of the device according to the invention with a drip protection device in the form of a collar surrounding the hood;

Fig. 13 is a plan view of the embodiment according to Fig. 12;

14 is a side view of an embodiment of the device according to the invention with a cleaning opening in the tank;

Fig. 15 is a cross-sectional view taken along line I-I in Fig. 14;

16 is a schematic diagram of a hood embodiment with an ionizer.

It is an object of the present invention to provide an apparatus and method for chemical wet processing for cleaning and/or drying which enables a continuous stable upward downward movement of a substrate.

The above object is achieved by the present invention by providing a lifting device having a transport carriage for substrates and a transport carriage for substrate carriers, wherein the transport carriages are connected to each other by means of joint connections. In this embodiment, separate lifting control for the substrate and the substrate carrier and thereby optimal adjustment of the movement for each process are possible. This combination with the possibility of the relative movement of the carriages with respect to one another results in an optimal steering of the movement of the two carriages and thus the movement of the substrate and the substrate carrier. The features and methods of the present invention provide for continuous ejection of and from a carrier holding a substrate during the entire process without stopping and undue reduction of the carrier to be lifted, in particular during the transition between movement of the carrier itself relative to the movement of the substrate relative to the carrier. Enables subsequent lifting of the substrate. In wafer carrier processing, it is very important that no stalling occurs during lifting of the wafer from the processing, cleaning or cleaning bath, because if it is stopped during lifting, in the region of the transition from liquid to space on the surface of the liquid, particles are Because it can be attached. Because of the stroke difference on the carrier and the substrate provided by the present invention, continuous movement of the substrate out of the liquid is possible, especially while passing through the liquid surface.

Preferred embodiments of the invention are described in the dependent claims.

Preferably, the first transport carriage is connected to the drive device. The second transport carriage is not driven independently but is instead coupled to the first transport carriage.

According to another preferred embodiment of the invention, the splicing portion comprises two legs, a first leg connected to a first transport carriage and a second leg pivotally connected to a second transport carriage. The ends of the legs abutting away from the transport carriage are pivotally connected to each other by pins.

Preferably, the protrusion of the pin connecting the two legs runs along the control curve. Accordingly, the control curve determines the movement path of the connection point of the two legs. By suitably choosing the control curve, it is possible to influence the movement of the first and second transport carriages one another or independently. This implements a stroke difference in which the substrate carrier and the substrate initially move with each other at the same speed and stop the movement of the substrate carrier while the substrate moves more. Due to the connection of the substrate carrier without side guides, known as the low weight carrier or the small carrier due to the difference in the lifting mechanism as above, the fixedly installed substrate carrier compartment in the container was required in the conventional carrier, but is no longer required in the present invention.

Preferably, the control curve comprises an adjacent curved portion connected to a straight portion extending parallel to the direction of movement.

According to a preferred embodiment of the present invention, the distance between the first transport carriage and the second transport carriage, and thus the spacing between the substrate and the substrate carrier, is increased as the pin moves along the curved portion. Due to the increased spacing between the substrate and the substrate carrier, the substrate is lifted from the substrate carrier.

Preferably, the shape of the curved portion is selected such that the distance between the first and second transport carriages is constantly increased. This ensures a constant lifting speed of the substrate so that dry spots and particle adhesion occurring on the substrate due to uncoordinated movement or settling can be reliably prevented.

Preferably, the formation of the curved part at the end part is chosen such that the second transport carriage is braked slowly until it comes to a complete stop. The point at which the second transport carriage stops is selected such that the second transport carriage preferably stops when the substrate is driven against the guide outside the substrate carrier, but so that the substrate carrier does not collide with the substrate guide located outside the tank.

Preferably, the first transport carriage is provided with a braided lifting member, simply called a braid, which supports the substrate at one point such that only one point contact occurs. These substrate contact points ensure that no fluid remains during lifting. The braid shape has the advantage that the fluid remaining at this position on the substrate can be easily deflected by the braid, the pointed shape. The braid is provided with a notch to prevent sliding of the substrate.

For convenience, the braided lifting member and the substrate carrier are lifted at the same speed as the pin moves along the straight portion of the control curve. This is when the substrate is still received in the substrate carrier during lifting. The second transport carriage is only stopped when the substrate engages the guide external to the substrate carrier.

It is particularly advantageous if the hood is to be placed over the container, especially during the drying process, if guides are provided on the inner side of the hood. The hood provided primarily to cover the vessel and tank also serves to guide the substrate when the substrate is no longer engaged by the substrate carrier. Preferably, the top of the hood is connected to a diffusion plate to generate an isopropyl alcohol (IPA)/N2 atmosphere to improve the drying process.

Preferably, the lifting device of the present invention is provided with a releasable and lockable locking mechanism, said locking mechanism securely connecting the first and second transport carriages. The rigid connection between the first and second transport carriages coincides with the movement of the pins of the splicing joint along a straight part of the control curve parallel to the direction of movement. When the locking mechanism is locked, the substrate carrier is completely out of the tank together with the substrate, for example when the transport position of the substrate carrier is located in the upper part of the tank, in particular when the substrate carrier with the substrate is inserted into or lifted from the tank. can be lifted. Preferably, a cylinder is provided which locks or unlocks said locking mechanism for simple control, especially when used as a module in a processing system to be automatically loaded. A releasable locking mechanism allows the transport carriages to be moved together for loading and unloading into an upper position but detachable for lifting the substrate from the substrate carrier.

Another object of the present invention is to increase the manufacturing yield of semiconductor chips and/or wafers by said apparatus for simplifying the sequence of methods and improving product quality.

The object is achieved in connection with the device for a system in which a hood is provided above the tank and a drip protection device is provided in the hood. In conventional devices, where problems arise during insertion or ejection of wet substrates and/or substrate carriers, especially when at least two or more tanks for processing substrates are placed adjacent to each other, droplets fall into the hood of adjacent processing tanks. Next time the hood is moved over the tank, for example to drain the substrates and/or substrate carriers dried in the tank from the tank, there is a high risk that small water droplets will fall along the hood and onto the already dried substrates. do. This disadvantage is overcome by the present invention in which the hood is provided with a drip protection device.

Preferably, the drip protection hood comprises a drip plate in the form of a collar connected to the upper side of the hood or connected to the periphery of the hood. The arrangement of the drip plate and collar depends on the space condition and is selected according to the available space.

According to a preferred embodiment of the present invention, the plate and collar protrude beyond the outer diameter of the hood, so that, according to a preferred embodiment of the present invention, the drip plate and/or collar are downwardly to the side of the hood on which the hood is disposed upon opening of the tank. will be inclined In this way, no liquid drips or drips into the tank on the side of the hood being moved between the open tanks, which means that the drip plate and collar protrude beyond the sidewall of the hood and always extend upwards from the sidewall and top surface of the hood. This is because the liquid cannot drip. The liquid present on the hood and the droplets falling onto the collar along the side wall are guided by the drip plate and collar at an inclination relative to the side of the hood which is not placed over the open tank during the opening and closing of the tank.

The above object is also achieved in connection with the device and system described above by providing a cleaning opening in the tank. During processing of substrates, particularly wafers in tanks, during wafer processing or during wafer handling, wafers are broken or partly crushed and left in the tank. These residues have to be removed from the top in a complicated manner. By means of the present invention in which the tank is provided with a clean opening, the removal of residues or broken wafers is facilitated. Thus, the cleaning opening is detachable and preferably screwable, said cleaning opening being preferably connected to one side of the tank at or near the bottom of the tank. Direct access to the residues and wafer fragments in the tank is thus simple and fast.

The above object may also be achieved in connection with the above described device by providing an ionizing device that prevents electrostatic charging in the vapor region. Because of the charge generated in the vapor region and during processing and while flowing a processing fluid such as distilled water, ions are present in the processing space in the hood closing the tank above and above the wafer surface, which causes electrostatic charge and damage to the substrate. causes Because of the electrostatic charge, it is possible to have very high electrostatic voltages that break through and damage the substrate. By generating ions, electrostatic charge is reduced and wafer damage caused by electrostatic charge is no longer generated. Nitrogen and/or isopropyl alcohol is preferably present in the vapor zone.

According to a preferred system embodiment, an ionizer is provided in the vapor region, said ionizer comprising at least one ionizing rod on at least one inner wall of the hood. Preferably, the ionizer comprises at least one counter electrode, which is preferably arranged on the inner wall of the hood at selected intervals for the ionizing rods, each ionizing rod. The counter electrode is preferably connected to ground and a high voltage source terminal, the other terminal being connected to the ionizing rod.

The ionizing rod is preferably applied with a high voltage of 5 to 25 kV, more preferably 10 to 15 kV.

According to a preferred embodiment of the present invention, the high voltage is a pulse. The pulse preferably has a pulse length of 10 to 100 ms, more preferably 10 to 40 ms. Preferably, the pulse duty ratio of the pulses is in the range of 1:8 to 1:12 and preferably about 1:10.

An improvement in product quality can be achieved by means of the device described above provided with at least one measuring probe for monitoring the gas concentration, gas mixing ratio and/or gas content and gas mixture content in the vapor region. Preferably, the data measured by the measuring probe is used to control the gas concentration, gas mixing ratio and/or gas content and gas mixture content in the vapor region. In this way, it is possible to maintain an optimum condition for the entire manufacturing and processing sequence within the vacuum zone and high manufacturing quality and low disposal rates are achieved.

Adequate product quality in accordance with the implementation of the device described above may be achieved by placing a flow meter that determines the throughput of the processing fluid in the line from which the processing fluid is withdrawn. It is thus possible to quickly determine the variation in throughput and/or use the data measured by the flowmeter to control the amount of fluid to be drawn in or withdrawn. It is preferred to provide valves, in particular motor control valves, in the inlet and/or outlet lines, said motors and valves being controlled as a function of the measured data of the flow meter.

Manufacturing costs in the device described above are minimized by regenerating the treatment fluid flowing out of the tank in the regeneration device according to the present invention. This not only reduces manufacturing costs, but also increases the environmental satisfaction of the process. The regenerated fluid is preferably reused in the fluid tank. The entire regeneration fluid or a portion thereof may also be discharged into the used sewage system after regeneration. This is particularly desirable when the fluid is distilled water generated from the drying process of the substrate, which can be introduced into the common sewage system without any problems.

Preferably, the lifting device of the present invention is used in the drying process. Here, the substrate is lifted out of the cleaning and the substrate carrier remains in the tank. The liquid level is then lowered below the substrate carrier, which can be affected, for example, by opening the outlet. The dry substrate is then lowered back into the dry substrate carrier. When substrate drying occurs while lifting the substrate from the tank, the substrate carrier dries by lowering the liquid level of the cleaning fluid.

Hereinafter, the present invention will be described with reference to the accompanying drawings.

1 and 2 a lifting device 1 of a device 20 according to the invention for drying a wafer 25 according to FIG. 3 is shown. The lifting device (1) has a first transport carriage (2) with a support arm (14) for a blade-like lifting member (16) and a support arm (15) for a substrate carrier (17) connected by a joint (4) and a second transport carriage (3). The joint connection part (4) includes a first leg (5) and a second leg (6) connecting the first transport carriage (2) and the second transport carriage (3) by a seam. The two legs 5 , 6 are connected to each other by means of pins 7 . The first transport carriage 2 is driven by a motor not shown and pulls the second transport carriage 3 upwards 10 along the guide track 10 while lifting through the joint 4 . The pin 7 moves along a control curve 11 with a straight portion 12 and a curved portion 13 . When the pin 7 moves along the straight part 12 , the joint 4 forms a solid connection between the first and second transport carriages 2 , 3 . In this state, the substrate carrier 917 accommodating the wafer 25 is lifted, and the blade-like lifting member 16 is not yet in contact with the wafer 25 . At the beginning of the portion 13 of the control curve 11 , the second transport carriage 3 gradually softens the first transport carriage 3 with respect to the first transport carriage 2 . Thus, the blade-like lifting member 16 contacts the wafer 25 and lifts the wafer 25 from its support in the substrate carrier 17 . In this respect the wafer 25 is already supported by guides 39 in the hood 22 , which is illustrated in FIG. 5 , which will be explained below. However, the transport carriage 3 does not come to a complete stop but follows the movement of the first transport carriage 2 along the curve of the curved part 13 , in which the legs 5 , 6 move about the pin 7 . Because it can rotate, it continuously expands the angle between the legs. The stopping point of the second conveying carriage 3 is a curved portion 13 in which a radius corresponding to the distance between the axis of the pin and the axis of rotation of the connection point between the second leg and the second conveying carriage 3 is provided for the transition to the arc. ) when the position is reached.

The radius of the area of the curved portion 13 located between the straight portion 12 and the point at which the stop occurs is greater than the radius of the area of the curved portion 13 following said point at which the stop occurs.

3 to 10 , the drying process sequence is shown using a lifting device 1 , which is not shown in these figures. 3 to 10, like reference numerals denote like members.

According to FIG. 3 , the device 20 of the present invention comprises a vessel or tank 21 , between which a hood 22 can be moved laterally. A blade-like lifting member 16 supported by a substrate arm 14 within the tank 21 is shown. The substrate carrier 17 on which the wafer 25 is placed is placed by means of a device adjuster 24 above the lifting device 1 disposed at its lowest end position. The cleaning fluid 23 flows into the tank 23 from the bottom and into the outer container 29 through the spillway edge 28 . Since the lifting device 1 is placed in the lowest end position, the wafer 25 is completely submerged in the cleaning fluid 23 .

The substrate carrier 17 comprises two parallel side plates, of which only one 30 is shown in FIG. 3 . Four rods 31 , 32 , 33 , 34 having transverse slots for receiving wafers 25 are connected between the side plates. A detailed description of the low-weight carrier is disclosed in German Publication No. 44 28 169, the description of which is combined in order to avoid repetition.

Gas flows into the hood 22 from the top, and the gas is discharged into the drying space through the water-through opening of the tank.

The introduction of the gas provided for drying is through the longitudinal tube in the upper cover portion of the hood 22 . A confirmation plate disposed between the longitudinal tube and the interior volume of the sheath includes an array of apertures, the aperture arrangement distributing gas uniformly throughout the width and length of the sheath. When a plurality of substrate carriers 17 are simultaneously processed in the drying apparatus 20, a partition is provided in the lid at the front of the wafer package to evenly distribute the gas over the entire space within the hood 22 for the fastening wafer package. do. Preferably, the gas is a mixture of IPA/N ₂ . Otherwise, different flow conditions may occur, causing individual wafers 25 in the package to produce different drying results. Guide slots 39 are provided for guiding the wafer 25 on the inner surface disposed on either side. The guide slot 39 in the hood 22 is inclined at about 5 degrees. Accordingly, the substrate carrier 17 is lowered toward the tank 21 by the angle of inclination. Thus, the wafer 25 position is defined during the entire drying process, and the drying of the substrate carrier is also improved.

The device of the invention according to FIG. 4 differs from the device of FIG. 3 only in that the hood 22 is moved between the tanks 21 . As a result, the substrate carrier 17 with the wafer 25 is lifted.

Due to the driving of the first transport carriage 2 , the pin 7 follows a straight part 12 of the control curve 11 .

In FIG. 5 , a point of movement is reached where the pin 7 leaves the straight part 12 of the control curve 11 and enters the curved part 13 of the control curve 11 . The shape and size of the control curve 11 reaches this point when the wafer 25 engages the side guides 39 of the hood 22 so that the substrate carrier 17 no longer needs to guide the wafer 25 . chosen to do The wafer 25 is lifted by a plated lifting member 16 .

After discharging the wafer 25 from the cleaning fluid 23 , the wafer 25 is dried. The drying process is supported by the IPA/N ₂ environment above the tank 21 as the gas mixes with the cleaning fluid 23 above the substrate 25 and because of the gradients present in the surface tension of the substrate 25 . This is because it prevents a liquid film from remaining on the phase.

In FIG. 6 , the substrate carrier 17 is gradually smoothed downward with respect to the blade-like lifting member 16 . Thus, the blade-like lifting member 16 further lifts the wafer 25 from the tank 21 .

7, the substrate carrier 17 position is shown in which the substrate carrier 17 is completely stopped and only the blade-like lifting member 16 is moved upward. Accordingly, the substrate carrier 17 is not pushed against the guide 39 side of the hood 22 , otherwise it will damage the guide and also break the substrate carrier 17 .

FIG. 8 shows the end of the drying process of the substrate 25 . The wafer 25 has reached its highest point of movement and is no longer lifted to a position above the liquid level 27 . The liquid level is lowered by opening the outlet to dry the substrate carrier 17 . Wafer 25 and substrate carrier 17 are now in an IPA/N ₂ environment.

In FIG. 9 , the liquid level 27 of the cleaning fluid 23 is lower than the substrate carrier 17 . In the meantime, the movements already described with respect to FIGS. 4 to 7 are performed in reverse sequence to bring the substrate arm 14 and carrier arm 15 back to their lower distal position. Wafer 25 and substrate carrier 17 are now dry.

In FIG. 10 , the hood 22 is laterally displaced so that the substrate carrier 917 with the wafer 25 can be discharged from the tank 21 by the apparatus manipulator 24 .

In the embodiment shown in FIG. 11 for an apparatus for chemically treating a substrate, on the upper wall 41 of the hood 42, a drip protection device in the form of a drip plate 43 is provided, which is for example a hood ( 42) at an angle of 5° to the upper wall 41. The cover plate 43 extends beyond the sidewalls 46 , 47 of the hood 42 by its lateral ends 44 , 45 . In particular when at least two treatment tanks are adjacent to each other, the substrate and substrate carrier wetted with liquid are transferred between the hoods 42 so that the liquid drips onto the hoods 42 and on the drip plate 43 according to the invention. can be prevented Without the drip plate 43 , this liquid flows along the sides 46 , 47 of the hood 42 and when the hood 42 is opened, for example by moving to the left, at the side wall 47 the tank ( 48) (shown schematically only). The tank contains other processing fluids or pre-dried substrates and/or substrate carriers that contaminate the processing fluid, or the presence of dried substrates and/or substrate carriers contaminates the processing fluid, or The substrate carrier will get wet again. Disadvantages caused thereby, such as frequent exchange of processing fluids or the disposal of large numbers of products due to the re-wetting of the wafer, are avoided by the drip plate 43 . The drip plate 43 prevents small water droplets from flowing along the side walls 46 , 47 of the hood 42 , and in particular between the open tanks 48 , move the hood 42 to the left to open the tank 48 . It prevents small water droplets from flowing along the sides 47 when moving. Due to the inclined downward direction of the dripping plate 43 in the lateral direction in which the hood 42 is moved, the liquid cannot flow or drip from the dripping plate 43 into the area outside the tank, thereby contaminating the tank 48 .

In this embodiment, the additional tank loading slope 49 is connected above the tank rim 50 on the tank side, and between the tank sides, the hood 42 moves when the tank is opened, and above the loading slope 49 through the tank side. The dripping liquid cannot escape and reach the tank rim 50 .

In the embodiment shown in FIGS. 12 and 13 , the drip protection device is formed in the form of a collar 61 surrounding the hood in at least a region of the sidewalls 46 and 47 in a portion of the sidewalls 46 and 47 of the hood 42 . It differs from the embodiment of FIG. 11 only in that it is 11, because of the protruding areas 62, 63 of the collar 61, when opening the tank by moving the hood 42 to the left with respect to the drawing, the liquid falling into the hood 42 from the top The side walls 46 , 47 cannot be reached and cannot fall into the open tank 48 . The inclined portion 49 shown in Fig. 12 is almost identical to the inclined portion of Fig. 11 and has the same function.

In the embodiment shown in FIGS. 14 and 15 a tank 71 is provided with a cleaning opening 73 on its narrow side 72 , which is cut at its lower end near the bottom of the tank.

15 , the cleaning opening 73 may be closed by a movable flange 74 and connected to the tank 71 by a screw 75 . An intermediate flange 76 is provided between the flange 74 and the tank 71 in this embodiment. To seal the edges of the flange 74 and/or the intermediate flange 76 , a peripheral seal 77 is provided.

The cleaning opening 73 of the tank 71 allows for simple cleaning of the tank bottom and easy discharge of residues or damaged substrates.

The embodiment shown in FIG. 16 shows an ionizer having ionizing rods 91 , 92 on both sides 46 , 47 of the hood 42 , which in this embodiment is fixed at the upper edge portion of the hood 42 . It is secured by means of devices 93 and 94 .

At selected intervals below the ionizing rods 91 , 92 counter electrodes 95 , 96 are provided, which are for example grounded or connected to the mass.

By applying a high voltage between each ionizing rod 91 , 92 and the associated electrode 95 , 96 , ions are generated that prevent electrostatic charging of the substrate, substrate carrier, and/or processing device component. In this way, problems associated with electrostatic charges such as break-throughs or sparks do not occur and damage to the substrate does not occur.

The present invention has been described with reference to preferred embodiments. However, it will be apparent to those skilled in the art that various modifications and changes can be made without departing from the basic spirit of the present invention. For example, according to each space requirement, a drip protection device in the form of a drip plate 43 or collar 61 is placed on the hood 42 at a slightly higher or slightly lower position, or the size of the inclination according to each requirement. It is possible to choose It is also possible, for example, to provide multiple ionizing rods 91 , 92 and multiple counter electrodes 95 , 96 to distribute them throughout the processing chamber to provide optimal uniform ionization within the hood 42 . do.

Claims (47)

Apparatus 20 for chemical wet treatment of substrates 25 in a tank 21 containing a processing fluid 23 comprising at least one substrate carrier 17 and a lifting device 1 for inserting and discharging substrates ), wherein the lifting device (1) comprises a first transport carriage (2) for a substrate (25) and a second transport carriage (3) for a substrate carrier (17), the first transport carriage and the second transport carriage (3) Chemical wet treatment device, characterized in that the two transport carriages are connected to each other by a joint (4). The chemical wet processing apparatus according to claim 1, characterized in that the first and second transport carriages (2, 3) are moved along a vertical guide track (10). Device according to claim 1 or 2, characterized in that the first transport carriage (2) is connected to a drive device. 4. The joint (4) according to any one of the preceding claims, wherein the joint (4) comprises two legs (5, 6), a first leg (5) connected to a first transport carriage (2) and a first A second leg (6) is pivotally connected to a second transport carriage (3), and the first and second legs (5, 6) far abutting the transport carriage (2, 3) are pivotally pinned. (7) A chemical wet processing apparatus, characterized in that it is connected through. 5. The chemical wet processing apparatus according to claim 4, characterized in that the protruding part of the pin connecting the two legs (5, 6) moves along a control curve (11). 6. The control curve according to claim 5, characterized in that the control curve (11) comprises a straight section (12) extending parallel to the direction of movement of the transport carriage (2, 3) and a curved section (13) connected to the straight section. chemical wet processing equipment. 7. A chemical wet processing apparatus according to claim 6, characterized in that the spacing between the first and second transport carriages (2, 3) is constant when the pin (7) moves along a straight section (12). 8. Apparatus according to claim 6 or 7, characterized in that the distance between the first and second transfer carriages (2, 3) is constant as the pin (7) moves along the curved portion (13). Chemical wetness according to any one of claims 6 to 8, characterized in that the shape of the curved portion (13) is selected such that the distance between the first and second transport carriages (2, 3) increases constantly. processing unit. 10. A chemical wet processing apparatus according to claim 6 or 9, characterized in that the end shape of the curved portion (13) is selected such that the second transport carriage (3) is gently stopped. 11. A chemical wet processing apparatus according to any one of the preceding claims, characterized in that the first transport carriage (2) is connected to a blade-like lifting member (16). 12. The method according to claim 11, characterized in that the blade-like lifting member (16) and the substrate carrier (17) are lifted at the same speed when the pin (7) moves along the straight part (12) of the control curve (11). chemical wet processing equipment. 13. Chemical wetness according to any one of the preceding claims, characterized in that the second transport carriage (3) is stopped when the substrate (25) is engaged with the outer guide (39) of the substrate carrier (17). processing unit. 14. A chemical wet processing apparatus according to claim 13, characterized in that the guide is formed in the hood (22) above the tank (21). 15. Chemical wet treatment according to any one of claims 11 to 14, characterized in that the lifting of the substrate (25) after stopping of the second transfer carriage (3) is carried out by means of a blade-like lifting member (16). Device. 16. A chemical wet processing apparatus according to any one of the preceding claims, characterized in that the apparatus (20) cleans or dries the substrate (25). 17. Apparatus according to any one of the preceding claims, characterized in that the substrate or substrate carrier is exposed to a gas, in particular a mixture of isopropyl alcohol and nitrogen gas, during the drying process. 18. Chemical wet treatment according to any one of the preceding claims, characterized in that a locking and releasable locking mechanism is provided, said locking mechanism rigidly connecting the first and second transport carriages (2,3). Device. 19. The chemical wet processing apparatus of claim 18, wherein a cylinder locking or unlocking the locking mechanism is provided. 20. Chemical wetness according to any one of the preceding claims, characterized in that a hood (42) is provided above the tank (48), said hood (42) comprising a drip protection device (43, 61). processing unit. 21. A chemical wet processing apparatus according to claim 20, characterized in that the drip protection device is a drip plate (43). The chemical wet processing apparatus according to claim 21, characterized in that the drip plate (43) is disposed on the upper surface of the hood (42). Device according to claim 20, characterized in that the drip protection device (43,61) is a collar (61) arranged around the hood (42). 24. A chemical wet processing apparatus according to any one of claims 20 to 23, characterized in that the drip plate (43) and the collar (61) project outwardly from the hood (42). 25. The drip plate (43) and collar (61) according to any one of claims 20 to 24, wherein the drip plate (43) and the collar (61) are inclined downwardly to the side surface (45) of the hood (42), and when the tank (48) is opened, the Chemical wet processing apparatus, characterized in that the hood (42) is moved in the direction. 27. Chemical wet treatment according to any one of claims 20 to 25, characterized in that, on the rim (50) of the tank (58) on which the hood (42) is not moved, a rim unloading inclined portion (49) is provided. Device. 27. A wet processing apparatus according to any one of the preceding claims, characterized in that the tank (71) comprises a cleaning opening (73). 28. A chemical wet processing apparatus according to claim 27, characterized in that the cleaning opening (73) is closed by at least one flange. 29. A chemical wet treatment apparatus according to claim 27 or 28, characterized in that the cleaning opening (73) is provided on the side (72) of the tank (71) near the bottom of the tank. 30. A chemical wet processing apparatus according to any one of the preceding claims, characterized in that an ionizer is provided. 31. A chemical wet processing apparatus according to claim 30, characterized in that said ionizer is provided in a hood (42) above said tank (48). 32. Apparatus according to claim 30 or 31, characterized in that the ionizer is provided in a vapor region in which the substrate discharged from the tank is exposed to a gas, preferably nitrogen or isopropyl alcohol. . 34. Chemical according to any one of claims 30 to 33, characterized in that the ionizer comprises at least one ionizing rod (91, 92) in at least part of the inner wall (46, 47) of the device hood (42). Wet processing unit. 34. Apparatus according to any one of claims 30 to 33, characterized in that the ionizer comprises at least one counter electrode (55, 56). 35. A chemical wet processing apparatus according to claim 34, characterized in that the counter electrode (95, 96) is connected to the mass. 36. A chemical wet processing apparatus according to any one of claims 30 to 35, characterized in that a high voltage of 5 to 25 kV, preferably 10 to 15 kV, is applied to the ionizer. The chemical wet processing apparatus according to any one of claims 30 to 35, characterized in that the high voltage is a pulse, the pulse having a pulse length of 1 to 10 ms, preferably 10 to 40 ms. 38. The chemical wet processing apparatus according to claim 36 or 37, wherein the high voltage pulse duty ratio is in the range of 1:8 to 1:12, and preferably has a pulse duty ratio of about 1:10. 39. Apparatus according to any one of the preceding claims, characterized in that at least one probe is provided for monitoring the gas concentration, gas mixture ratio or gas content and gas mixture content in the vapor region. 40. The chemical wet processing apparatus according to claim 39, wherein the measurement data detected by the measurement probe is used to control a gas concentration, a gas mixture ratio or a gas content and a gas mixture content in the vapor region. 41. A chemical wet processing apparatus according to any one of the preceding claims, characterized in that a flow meter is provided in the line through which the processing fluid is discharged for detecting the throughput of the processing fluid. 42. The chemical wet treatment apparatus according to claim 41, wherein the measured data detected by the flow meter is used to control the amount of fluid flowing in or out. 43. The chemical wet treatment apparatus according to claim 41 or 42, characterized in that the control of the amount of fluid flowing in or out is performed by a valve, in particular a valve driven by a motor. 43. The chemical wet treatment apparatus according to any one of claims 1 to 42, wherein the fluid discharged from the tank is regenerated in a regenerator. 45. The chemical wet processing apparatus of claim 44, wherein the regeneration fluid is reused in a tank. 46. The chemical wet treatment apparatus of claim 44 or 45, wherein the regeneration fluid is supplied partially to the molar sewage line. a lifting device for inserting and ejecting at least one substrate carrier 17 and substrates, the lifting device comprising a first transport carriage 2 for the substrate 25 and a second transport carriage 3 for the substrate carrier 17 ( A drying method using 1) lifting a substrate from a cleaning fluid (23) and leaving a substrate carrier (17) in a tank (21): lowering the cleaning fluid (23) under the substrate carrier (17) and lowering the substrate (25) onto the substrate carrier (17) after completing the steps and drying process. ※ Note: It is disclosed according to the contents of the initial application.