KR980005391U - Double die bonding device - Google Patents

Double die bonding device

Info

Publication number
KR980005391U
KR980005391U KR2019960017962U KR19960017962U KR980005391U KR 980005391 U KR980005391 U KR 980005391U KR 2019960017962 U KR2019960017962 U KR 2019960017962U KR 19960017962 U KR19960017962 U KR 19960017962U KR 980005391 U KR980005391 U KR 980005391U
Authority
KR
South Korea
Prior art keywords
die bonding
bonding device
double die
double
die
Prior art date
Application number
KR2019960017962U
Other languages
Korean (ko)
Other versions
KR200150606Y1 (en
Inventor
이동헌
Original Assignee
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업주식회사 filed Critical 현대전자산업주식회사
Priority to KR2019960017962U priority Critical patent/KR200150606Y1/en
Publication of KR980005391U publication Critical patent/KR980005391U/en
Application granted granted Critical
Publication of KR200150606Y1 publication Critical patent/KR200150606Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
KR2019960017962U 1996-06-27 1996-06-27 Dual die bonding apparatus KR200150606Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019960017962U KR200150606Y1 (en) 1996-06-27 1996-06-27 Dual die bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019960017962U KR200150606Y1 (en) 1996-06-27 1996-06-27 Dual die bonding apparatus

Publications (2)

Publication Number Publication Date
KR980005391U true KR980005391U (en) 1998-03-30
KR200150606Y1 KR200150606Y1 (en) 1999-07-01

Family

ID=19459788

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019960017962U KR200150606Y1 (en) 1996-06-27 1996-06-27 Dual die bonding apparatus

Country Status (1)

Country Link
KR (1) KR200150606Y1 (en)

Also Published As

Publication number Publication date
KR200150606Y1 (en) 1999-07-01

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20080320

Year of fee payment: 10

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