KR970076901A - Conductive paste composition - Google Patents

Conductive paste composition Download PDF

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Publication number
KR970076901A
KR970076901A KR1019960014843A KR19960014843A KR970076901A KR 970076901 A KR970076901 A KR 970076901A KR 1019960014843 A KR1019960014843 A KR 1019960014843A KR 19960014843 A KR19960014843 A KR 19960014843A KR 970076901 A KR970076901 A KR 970076901A
Authority
KR
South Korea
Prior art keywords
conductive paste
weight
paste composition
powder
additive
Prior art date
Application number
KR1019960014843A
Other languages
Korean (ko)
Other versions
KR100196399B1 (en
Inventor
김한성
Original Assignee
조희재
Lg 전자부품 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 조희재, Lg 전자부품 주식회사 filed Critical 조희재
Priority to KR1019960014843A priority Critical patent/KR100196399B1/en
Publication of KR970076901A publication Critical patent/KR970076901A/en
Application granted granted Critical
Publication of KR100196399B1 publication Critical patent/KR100196399B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

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  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)

Abstract

본 발명에 은 분말, 팔라듐(palladium)분말, 무기 바인더(binder) 및 셀룰로즈아세테이트부티레이트(cellulose acetate butyrate)와 첨가제와 용매로 조성된 유기 바인더가 배합되어 조성된 도전성 페이스트 조성물에 관한 것으로서, 은 분말의 입자 형태 및 그 양과 유기 바인더의 고형성분 종류 및 그 조성비가 조절되어 디핑작업에 적합한 점도와 요변성 지수를 가지기 때문에 디핑방법이 적용되는 각종 부품에 이용할 수 있는 효과가 있다.The present invention relates to a conductive paste composition comprising silver powder, a palladium powder, an inorganic binder and cellulose acetate butyrate, and an organic binder composed of an additive and a solvent, The particle type and amount thereof, the kind of the solid component of the organic binder, and the composition ratio thereof are adjusted to have a viscosity and a thixotropic index suitable for the dipping operation, so that the present invention can be used for various parts to which the dipping method is applied.

Description

도전성 페이스트 조성물Conductive paste composition

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

제1도는 저항 측정용 인쇄패턴을 나타내는 도면.1 is a view showing a print pattern for resistance measurement;

Claims (5)

은 분말, 팔라듐(palladium)분말, 무기 바인더(binder) 및 셀룰로즈아세테이트부티레이트(cellulose acetate butyrate)와 첨가제와 용매로 조성된 유기 바인더가 배합되어 조성된 것을 특징으로 하는 도전성 페이스틀 조성물.Wherein the conductive paste composition is composed of silver powder, palladium powder, an inorganic binder and cellulose acetate butyrate, and an organic binder composed of an additive and a solvent. 제1항에 있어서, 상기 은 분말 60∼80중량%, 상기 필라듐 분말 0.1∼2중량%, 상기 무기 바인더 1∼10중량% 및 상기 유기 바인더 8∼38.9중량%가 배합되어 조성된 것을 특징으로 하는 도전성 페이스트 조성물.[3] The method of claim 1, wherein the silver powder comprises 60 to 80% by weight of the powder, 0.1 to 2% by weight of the filler powder, 1 to 10% by weight of the inorganic binder, and 8 to 38.9% By weight. 제1항 또는 제2항에 있어서, 상기 유기 바인더는 상기 셀룰로즈아세테이트부티레이트 10∼20중량%, 상기 첨가제 3.2∼13중량% 및 상기 용매 62∼86.8중량%가 배합되어 조성된 것을 특징으로 하는 도전성 페이스트 조성물.The conductive paste according to claim 1 or 2, wherein the organic binder comprises 10 to 20% by weight of the cellulose acetate butyrate, 3.2 to 13% by weight of the additive, and 62 to 86.8% Composition. 제3항에 있어서, 상기 첨가제는 스테버라이트로진, 디하이드레이트캐스터오일 및 디스퍼빅(dispwrbyk)습윤 분산제인 것을 특징으로 하는 도전성 페이스트 조성물.The conductive paste composition according to claim 3, wherein the additive is steviolite, dihydrated castor oil, and dispwrbyk wet dispersant. 제3항에 있어서, 상기 용매는 톨루엔, 티피네올, 메틸이소부틸케톤, 에톡시에톡시에틸아세테이트, 부톡시에틸아세테이트 중 하나 이상이 혼합되어 조성된 것을 특징으로 하는 도전성 페이스트 조성물.The conductive paste composition according to claim 3, wherein the solvent is a mixture of at least one of toluene, triphenol, methyl isobutyl ketone, ethoxyethoxy ethyl acetate, and butoxy ethyl acetate. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: It is disclosed by the contents of the first application.
KR1019960014843A 1996-05-07 1996-05-07 Composites of conductive paste KR100196399B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960014843A KR100196399B1 (en) 1996-05-07 1996-05-07 Composites of conductive paste

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960014843A KR100196399B1 (en) 1996-05-07 1996-05-07 Composites of conductive paste

Publications (2)

Publication Number Publication Date
KR970076901A true KR970076901A (en) 1997-12-12
KR100196399B1 KR100196399B1 (en) 1999-06-15

Family

ID=19457925

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960014843A KR100196399B1 (en) 1996-05-07 1996-05-07 Composites of conductive paste

Country Status (1)

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KR (1) KR100196399B1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100709724B1 (en) * 2007-01-30 2007-04-24 (주)이그잭스 Metal paste for forming conductive layers
KR100711505B1 (en) * 2007-01-30 2007-04-27 (주)이그잭스 Silver paste for forming conductive layers
KR100800509B1 (en) * 2006-12-18 2008-02-04 전자부품연구원 Conductive paste and multi-layer ceramic substrate

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100800509B1 (en) * 2006-12-18 2008-02-04 전자부품연구원 Conductive paste and multi-layer ceramic substrate
KR100709724B1 (en) * 2007-01-30 2007-04-24 (주)이그잭스 Metal paste for forming conductive layers
KR100711505B1 (en) * 2007-01-30 2007-04-27 (주)이그잭스 Silver paste for forming conductive layers
WO2008093915A1 (en) * 2007-01-30 2008-08-07 Exax Inc. A metal paste for forming a conductive layer
WO2008093913A1 (en) * 2007-01-30 2008-08-07 Exax Inc. A silver paste for forming conductive layers
US8070986B2 (en) 2007-01-30 2011-12-06 Exax Inc. Silver paste for forming conductive layers
US8088307B2 (en) 2007-01-30 2012-01-03 Exax Inc. Metal paste for forming a conductive layer

Also Published As

Publication number Publication date
KR100196399B1 (en) 1999-06-15

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