KR970067832A - A wafer on which an electrostatic protection metal pattern is formed - Google Patents
A wafer on which an electrostatic protection metal pattern is formed Download PDFInfo
- Publication number
- KR970067832A KR970067832A KR1019960006497A KR19960006497A KR970067832A KR 970067832 A KR970067832 A KR 970067832A KR 1019960006497 A KR1019960006497 A KR 1019960006497A KR 19960006497 A KR19960006497 A KR 19960006497A KR 970067832 A KR970067832 A KR 970067832A
- Authority
- KR
- South Korea
- Prior art keywords
- metal pattern
- electrostatic protection
- protection metal
- chips
- wafer
- Prior art date
Links
Landscapes
- Dicing (AREA)
Abstract
본 발명은 정전기 보호 금속 패턴이 형성되어 있는 웨이퍼에 관한 것이다. 상기 다수의 칩을 서로 전기적으로 연결시키는 기능을 갖는 정전기 보호 금속 패턴이 상기 다수의 칩 교차 부분에 형성되어 있으며,상기 정전기 보호 금속 패턴은 섬모양으로 상기 다수의 칩과 부분적으로 연결되게 형성되어 있다. 따라서, 방전시 어느 한 칩으로 정전기가 흐르지 않고 다수의 칩으로 분산되므로 접합이 파괴되는 현상을 방지할 수 있으며, 다수의 칩을 각각 분리시킬 때는 정전기 보호 금속 패턴 상부에 절단선을 따라 절단할 때 절단이 용이하며 절단 부위도 깨끗하게 된다.The present invention relates to a wafer on which an electrostatic protection metal pattern is formed. An electrostatic protection metal pattern having a function of electrically connecting the plurality of chips to each other is formed on the plurality of chip intersections, and the electrostatic protection metal pattern is partially connected to the plurality of chips in an island shape . Therefore, it is possible to prevent breakage of the junction due to dispersion of the chip into a plurality of chips without causing static electricity to flow to the one chip at the time of discharge, and when cutting off a plurality of chips, when cutting along the cut line on the electrostatic protection metal pattern It is easy to cut and the cutting area is clean.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.
제2도는 본 발명의 실시 예에 따른 정전기 보호 금속 패턴이 형성되어 있는 웨이퍼를 나타낸 도면이다.FIG. 2 is a view showing a wafer on which an electrostatic protection metal pattern according to an embodiment of the present invention is formed.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960006497A KR970067832A (en) | 1996-03-12 | 1996-03-12 | A wafer on which an electrostatic protection metal pattern is formed |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960006497A KR970067832A (en) | 1996-03-12 | 1996-03-12 | A wafer on which an electrostatic protection metal pattern is formed |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR970067832A true KR970067832A (en) | 1997-10-13 |
Family
ID=66215964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019960006497A KR970067832A (en) | 1996-03-12 | 1996-03-12 | A wafer on which an electrostatic protection metal pattern is formed |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR970067832A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040108556A (en) * | 2003-06-05 | 2004-12-24 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | Device and method for scribing substrate of brittle material |
-
1996
- 1996-03-12 KR KR1019960006497A patent/KR970067832A/en not_active Application Discontinuation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040108556A (en) * | 2003-06-05 | 2004-12-24 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | Device and method for scribing substrate of brittle material |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1753109A3 (en) | Electrostatic discharge protection circuit | |
| ATE128657T1 (en) | CUTTING INSERT. | |
| DE68928320D1 (en) | Surface mount type edge mount package for semiconductor integrated circuit devices | |
| KR950007059A (en) | integrated circuit | |
| KR970705804A (en) | SUPPORT ELEMENT | |
| KR940027181A (en) | Semiconductor integrated substrate and semiconductor device | |
| TW375839B (en) | Single-chip system having electrostatic discharge (ESD) protective circuitry | |
| DE69422463D1 (en) | Semiconductor arrangement with a semiconductor chip with backside electrode | |
| TW345733B (en) | Integrated semiconductor circuit | |
| KR970008550A (en) | Semiconductor device with electrostatic discharge protection circuit | |
| KR970067832A (en) | A wafer on which an electrostatic protection metal pattern is formed | |
| KR930003237A (en) | Semiconductor wafer | |
| KR950015679A (en) | Semiconductor devices | |
| KR930001362A (en) | Semiconductor devices | |
| KR950020965A (en) | Semiconductor devices | |
| WO2000048252A3 (en) | Electrostatic discharge protection of integrated circuits | |
| KR970063502A (en) | Body-contact structure of semiconductor devices | |
| KR970060479A (en) | Semiconductor device | |
| KR950012613A (en) | Semiconductor device and manufacturing method thereof | |
| KR970053834A (en) | Semiconductor device with electrostatic discharge protection device | |
| KR900001020A (en) | Semiconductor integrated circuit device | |
| KR0123058Y1 (en) | Semiconductor device | |
| KR970705180A (en) | SEMICONDUCTOR DEVICE | |
| KR940010281A (en) | Semiconductor device | |
| KR920000126A (en) | Chip Carrier for Microwave Semiconductor Components |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| N231 | Notification of change of applicant | ||
| WITN | Withdrawal due to no request for examination |