KR970065634A - Epoxy resin composition for sealing semiconductor devices - Google Patents
Epoxy resin composition for sealing semiconductor devices Download PDFInfo
- Publication number
- KR970065634A KR970065634A KR1019960006695A KR19960006695A KR970065634A KR 970065634 A KR970065634 A KR 970065634A KR 1019960006695 A KR1019960006695 A KR 1019960006695A KR 19960006695 A KR19960006695 A KR 19960006695A KR 970065634 A KR970065634 A KR 970065634A
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy resin
- bismaleimide
- resin composition
- weight
- parts
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract 10
- 239000003822 epoxy resin Substances 0.000 title claims abstract 7
- 229920000647 polyepoxide Polymers 0.000 title claims abstract 7
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 238000007789 sealing Methods 0.000 title 1
- 239000004372 Polyvinyl alcohol Substances 0.000 claims abstract 4
- 239000003795 chemical substances by application Substances 0.000 claims abstract 4
- 229920002451 polyvinyl alcohol Polymers 0.000 claims abstract 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract 3
- 150000001875 compounds Chemical class 0.000 claims abstract 3
- 229920001084 poly(chloroprene) Polymers 0.000 claims abstract 3
- 229920001296 polysiloxane Polymers 0.000 claims abstract 3
- 229920005989 resin Polymers 0.000 claims abstract 3
- 239000011347 resin Substances 0.000 claims abstract 3
- 239000007822 coupling agent Substances 0.000 claims abstract 2
- 239000011256 inorganic filler Substances 0.000 claims abstract 2
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract 2
- 239000005011 phenolic resin Substances 0.000 claims abstract 2
- 229920003192 poly(bis maleimide) Polymers 0.000 claims 6
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical group O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims 5
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims 3
- LNAIBNHJQKDBNR-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)-2-methylphenyl]pyrrole-2,5-dione Chemical compound CC1=C(N2C(C=CC2=O)=O)C=CC=C1N1C(=O)C=CC1=O LNAIBNHJQKDBNR-UHFFFAOYSA-N 0.000 claims 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000011342 resin composition Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 abstract 1
- 230000035939 shock Effects 0.000 abstract 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
- C08K5/5477—Silicon-containing compounds containing nitrogen containing nitrogen in a heterocyclic ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/16—Homopolymers or copolymers of alkyl-substituted styrenes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L29/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical; Compositions of hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Compositions of derivatives of such polymers
- C08L29/02—Homopolymers or copolymers of unsaturated alcohols
- C08L29/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
본 발명은 반도체 장치의 신뢰성을 높이기 위하여 내열충격성 및 내크랙성이 향상된 반도체 밀봉용 에폭시 수지 조성물에 관한 것으로, 에폭시 수지, 페놀 수지, 이미드 변성 실리콘 화합물, 무기 충진제, 경화 촉진제 및 커플링제를 포함하는 에폭시 수지 조성물에 있어서, 폴리비닐알콜, 폴리클로로프린, 페놀 및 알킬스티렌 수지중에서 선택되는 적어도 2종의 혼합물로 이루어지는 접착력 부여제를 더 포함한다.The present invention relates to an epoxy resin composition for semiconductor encapsulation having improved thermal shock resistance and crack resistance in order to improve the reliability of a semiconductor device, and includes an epoxy resin, a phenol resin, an imide-modified silicone compound, an inorganic filler, a curing accelerator and a coupling agent And an adhesive strength-imparting agent comprising a mixture of at least two selected from the group consisting of polyvinyl alcohol, polychloroprene, phenol and alkylstyrene resin.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960006695A KR0177305B1 (en) | 1996-03-13 | 1996-03-13 | Epoxy resin composition for encapsulating semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960006695A KR0177305B1 (en) | 1996-03-13 | 1996-03-13 | Epoxy resin composition for encapsulating semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR970065634A true KR970065634A (en) | 1997-10-13 |
| KR0177305B1 KR0177305B1 (en) | 1999-05-15 |
Family
ID=19453001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019960006695A KR0177305B1 (en) | 1996-03-13 | 1996-03-13 | Epoxy resin composition for encapsulating semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0177305B1 (en) |
-
1996
- 1996-03-13 KR KR1019960006695A patent/KR0177305B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR0177305B1 (en) | 1999-05-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant | ||
| FPAY | Annual fee payment |
Payment date: 20011025 Year of fee payment: 4 |
|
| LAPS | Lapse due to unpaid annual fee |