KR970058494A

KR970058494A - Automated loading of parts of sequencer

Info

Publication number: KR970058494A
Application number: KR1019950055820A
Authority: KR
Inventors: 최병희
Original assignee: 배순훈; 대우전자 주식회사
Priority date: 1995-12-23
Filing date: 1995-12-23
Publication date: 1997-07-31

Abstract

본 발명은 인쇄회로기판상에 실장되는 저항, 콘덴서 및 다이오드 등과 같은 전자부품의 기능을 검사하는 시퀀서 머신의 부품 자동 적재장치에 간한 것으로 그 기술적인 구성은, 적재장치(1)의 본체부(2)상에 테이핑된 전자부품(3)이 공급되는 가이드 롤러(4)가 설치되고, 상기 본체부(2) 상측에는 링크(5)를 개재하여 그 일측으로 회전 구동하는 회전판(6)이 설치되며, 상기 링크(5)의 일단에는 가이드 롤러(4)의 일측으로 하향 입설된 부품 투입부(7)와 힌지축(8)으로 연설되고, 상기 부품 투입부(7) 하측인 본체부(2)의 하측에는 부품 받침대(9)가 횡설되어 하측에 연설된 승하강 실린더(10)를 통해 승하강토록 설치되며, 상기 적개장치 본체부(2) 양측에는 압착실린더(11)가 각각 설치되어 부품 투입부(7)의 좌우 이송에 의해 그 하측에 위치된 적재박스(12)내에 테이핑 전자부품(3)의 양단부를 구부려 적재토록 하는 것이다.The present invention is directed to a component automatic loading device of a sequencer machine that checks the function of electronic components such as resistors, capacitors, and diodes mounted on a printed circuit board. A guide roller 4 to which the tapered electronic component 3 is supplied is installed, and a rotating plate 6 is rotatably driven to one side of the main body 2 via a link 5. In one end of the link 5, the main body part 2, which is extended to the side of the guide roller 4, is inserted into the component input part 7 and the hinge shaft 8, and is lower than the component input part 7. In the lower side of the component support (9) is installed so as to raise and lower through the elevating cylinder (10), which is rolled out to the lower side, and the pressing cylinder (11) is installed on both sides of the host device (2), respectively, the component input In the storage box 12 located below the table by the left and right transport of the section 7 Both ends of the electronic part (3) to ever bending load.

이에 따라서, 테이핑된 상태로 길게 연이어 이송되는 전자부품의 적재작업을 자동적으로 손쉽고 용이하게 수행토록 하며, 적재박스 내에 전자부품을 능률적으로 적재토록 함은 물론, 차기 공정인 전자부품 공급기내에 적재된 전자부품을 효과적으로 공급토록 하며, 부품 적재장치의 간단한 구성에 의해 제작 및 설치가 용이하게 이루어지면서도 전자부품의 휘어짐을 방지시킬 수 있는 것이다.Accordingly, it is possible to automatically and easily carry out the stacking operation of the electronic components that are continuously transported in a taped state, and to efficiently load the electronic components in the stacking box, as well as the electronics loaded in the next electronic component feeder. It is possible to supply parts effectively, and by the simple configuration of the component stacking device is easy to manufacture and install, while preventing the bending of the electronic components.

Description

Automated loading of parts of sequencer

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제2도는 본 발명에 따른 시퀀서의 부품 자동 적재장치의 정단면 구성도.Figure 2 is a front cross-sectional view of the automatic component loading device of the sequencer according to the present invention.

제3도는 본 발명인 전자부품 적재용 박스의 정단면 구조도.3 is a front sectional structural view of an electronic component stacking box according to the present invention.

Claims

A guide roller 4 to which the tapered electronic component 3 is supplied is installed on the main body portion 2 of the stacking device 1, and on one side thereof via a link 5 above the main body portion 2. Rotating plate (6) for driving rotation is installed, and one end of the link (5) is addressed by the component inserting portion (7) and the hinge shaft (8) installed downward to one side of the guide roller (4), the component inserting portion (7) The lower part of the main body 2, which is the lower side, is installed so as to raise and lower through the elevating cylinder 10, which is laid out and laid down on the lower side. The cylinders 11 are respectively installed and configured to bend and load both ends of the taping electronic component 3 in the stacking box 12 located below by the left and right transport of the component inlet 7. Automated loading of parts in sequencer.

2. The apparatus of claim 1, wherein the component support (9) is installed inside the loading box (12) on which the electronic component (3) is bent and loaded to move up and down.

※ Note: The disclosure is based on the initial application.