KR970053274A - Frame in Frame Overlay Vernier Pattern Structure and Overlay Measurement Method - Google Patents
Frame in Frame Overlay Vernier Pattern Structure and Overlay Measurement Method Download PDFInfo
- Publication number
- KR970053274A KR970053274A KR1019950069611A KR19950069611A KR970053274A KR 970053274 A KR970053274 A KR 970053274A KR 1019950069611 A KR1019950069611 A KR 1019950069611A KR 19950069611 A KR19950069611 A KR 19950069611A KR 970053274 A KR970053274 A KR 970053274A
- Authority
- KR
- South Korea
- Prior art keywords
- frame
- overlay
- chip
- predetermined width
- outer frame
- Prior art date
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- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
본 발명은 마스트 공정 후 감광막에 인쇄된 패턴의 손상이나 결함에 관계없이 오버레이를 정확하게 판별할 수 있는 프레임 인 프레임 오버레이 버어니어 구조를 제공하는 것을 목적으로 한다. 이와 같은 목적을 달성하기 위한 본 발명의 오버레이 버어니어 구조는 칩과 칩을 분할하는 스크라이브 라인의 하부층에 형성되어 소정의 폭을 가진 사각형의 프레임으로 된 외부 프레임과, 외부 프레임 내에 소정의 폭을 가진 사각형의 프레임으로 된 내부 프레임을 포함하여 구성된 것을 특징으로 한다.An object of the present invention is to provide a frame-in-frame overlay vernier structure that can accurately determine the overlay regardless of damage or defect of the pattern printed on the photosensitive film after the mast process. The overlay vernier structure of the present invention for achieving the above object is formed on the lower layer of the chip and the scribe line for dividing the chip into an outer frame of a rectangular frame having a predetermined width, and having a predetermined width in the outer frame It characterized in that it comprises an internal frame consisting of a rectangular frame.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제3도는 본 발명의 실시예에 따른 프레임 인 프레임 버어니어 패턴의 구성도3 is a block diagram of a frame in frame vernier pattern according to an embodiment of the present invention
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950069611A KR970053274A (en) | 1995-12-30 | 1995-12-30 | Frame in Frame Overlay Vernier Pattern Structure and Overlay Measurement Method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950069611A KR970053274A (en) | 1995-12-30 | 1995-12-30 | Frame in Frame Overlay Vernier Pattern Structure and Overlay Measurement Method |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970053274A true KR970053274A (en) | 1997-07-31 |
Family
ID=66638744
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950069611A KR970053274A (en) | 1995-12-30 | 1995-12-30 | Frame in Frame Overlay Vernier Pattern Structure and Overlay Measurement Method |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970053274A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100618689B1 (en) * | 2000-11-20 | 2006-09-06 | 주식회사 하이닉스반도체 | Method for forming overlay vernier in semiconductor device |
-
1995
- 1995-12-30 KR KR1019950069611A patent/KR970053274A/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100618689B1 (en) * | 2000-11-20 | 2006-09-06 | 주식회사 하이닉스반도체 | Method for forming overlay vernier in semiconductor device |
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WITN | Withdrawal due to no request for examination |