KR970053161A - Semiconductor Devices with Inclined Bonding Pads - Google Patents
Semiconductor Devices with Inclined Bonding Pads Download PDFInfo
- Publication number
- KR970053161A KR970053161A KR1019950047323A KR19950047323A KR970053161A KR 970053161 A KR970053161 A KR 970053161A KR 1019950047323 A KR1019950047323 A KR 1019950047323A KR 19950047323 A KR19950047323 A KR 19950047323A KR 970053161 A KR970053161 A KR 970053161A
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- bonding
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- semiconductor device
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Abstract
본 발명은 와이어가 본딩되는 영역인 본딩패드를 경사지게 형성하여 소자의 소형화를 이루고 와이어의 본딩력을 최대화 할 수 있도록 구성한 반도체 패캐이지를 개시한다.The present invention discloses a semiconductor package configured to incline a bonding pad, which is an area to which wires are bonded, to achieve miniaturization of the device and to maximize the bonding force of the wires.
본 발명은 소자 제조공정을 거친 실리콘 기판상에 다수의 접합층을 형성하고 각 접합층 양측에 절연층을 형성한 후 각 접합층의 상부에는 도전성의 금속이 증착된 다수의 본딩 패드가 형성되며, 각 본딩 패드의 양측의 절연층 상부에는 보호층이 구성된 반도체 소자의 각 접합층을 상부면이 경사진 상태로 구성하고 경사진 각 접합층 표면에 도전성의 금속을 균일하게 증착시켜 상부면이 경사진 상태의 다수의 본딩 패드를 구성하였다.According to the present invention, after forming a plurality of bonding layers on the silicon substrate subjected to the device manufacturing process and forming an insulating layer on both sides of each bonding layer, a plurality of bonding pads on which conductive metals are deposited are formed on the bonding layers. Each bonding layer of the semiconductor element having the protective layer is formed on the inclined top surface, and the conductive metal is uniformly deposited on the inclined surface of each bonding layer, and the top surface is inclined on the insulating layers on both sides of each bonding pad. A plurality of bonding pads in a state were configured.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제3도는 본 발명에 따른 반도체 소자의 본딩 패드의 부분 단면도.3 is a partial cross-sectional view of a bonding pad of a semiconductor device according to the present invention.
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950047323A KR970053161A (en) | 1995-12-07 | 1995-12-07 | Semiconductor Devices with Inclined Bonding Pads |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950047323A KR970053161A (en) | 1995-12-07 | 1995-12-07 | Semiconductor Devices with Inclined Bonding Pads |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970053161A true KR970053161A (en) | 1997-07-29 |
Family
ID=66593714
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950047323A KR970053161A (en) | 1995-12-07 | 1995-12-07 | Semiconductor Devices with Inclined Bonding Pads |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970053161A (en) |
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1995
- 1995-12-07 KR KR1019950047323A patent/KR970053161A/en not_active Application Discontinuation
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