KR970048507U - High density printed circuit board - Google Patents
High density printed circuit boardInfo
- Publication number
- KR970048507U KR970048507U KR2019950051825U KR19950051825U KR970048507U KR 970048507 U KR970048507 U KR 970048507U KR 2019950051825 U KR2019950051825 U KR 2019950051825U KR 19950051825 U KR19950051825 U KR 19950051825U KR 970048507 U KR970048507 U KR 970048507U
- Authority
- KR
- South Korea
- Prior art keywords
- circuit board
- printed circuit
- high density
- density printed
- board
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019950051825U KR0135191Y1 (en) | 1995-12-29 | 1995-12-29 | High density printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019950051825U KR0135191Y1 (en) | 1995-12-29 | 1995-12-29 | High density printed circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970048507U true KR970048507U (en) | 1997-07-31 |
KR0135191Y1 KR0135191Y1 (en) | 1999-04-15 |
Family
ID=19441320
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019950051825U KR0135191Y1 (en) | 1995-12-29 | 1995-12-29 | High density printed circuit board |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR0135191Y1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200446009Y1 (en) * | 2009-05-13 | 2009-09-17 | (주) 대영부스터펌프 | A module for installating electromagnetic switches |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100663265B1 (en) * | 2005-05-10 | 2007-01-02 | 삼성전기주식회사 | Multilayer substrate and the manufacturing method thereof |
-
1995
- 1995-12-29 KR KR2019950051825U patent/KR0135191Y1/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200446009Y1 (en) * | 2009-05-13 | 2009-09-17 | (주) 대영부스터펌프 | A module for installating electromagnetic switches |
Also Published As
Publication number | Publication date |
---|---|
KR0135191Y1 (en) | 1999-04-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
LAPS | Lapse due to unpaid annual fee |