KR970046769U - Molding and forming equipment for semiconductor manufacturing equipment - Google Patents

Molding and forming equipment for semiconductor manufacturing equipment

Info

Publication number
KR970046769U
KR970046769U KR2019950055213U KR19950055213U KR970046769U KR 970046769 U KR970046769 U KR 970046769U KR 2019950055213 U KR2019950055213 U KR 2019950055213U KR 19950055213 U KR19950055213 U KR 19950055213U KR 970046769 U KR970046769 U KR 970046769U
Authority
KR
South Korea
Prior art keywords
equipment
molding
semiconductor manufacturing
forming
manufacturing equipment
Prior art date
Application number
KR2019950055213U
Other languages
Korean (ko)
Other versions
KR0136818Y1 (en
Inventor
한철우
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019950055213U priority Critical patent/KR0136818Y1/en
Publication of KR970046769U publication Critical patent/KR970046769U/en
Application granted granted Critical
Publication of KR0136818Y1 publication Critical patent/KR0136818Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
KR2019950055213U 1995-12-30 1995-12-30 Molding and forming apparatus of semiconductor manufacturing equipment KR0136818Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950055213U KR0136818Y1 (en) 1995-12-30 1995-12-30 Molding and forming apparatus of semiconductor manufacturing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950055213U KR0136818Y1 (en) 1995-12-30 1995-12-30 Molding and forming apparatus of semiconductor manufacturing equipment

Publications (2)

Publication Number Publication Date
KR970046769U true KR970046769U (en) 1997-07-31
KR0136818Y1 KR0136818Y1 (en) 1999-03-20

Family

ID=19443639

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950055213U KR0136818Y1 (en) 1995-12-30 1995-12-30 Molding and forming apparatus of semiconductor manufacturing equipment

Country Status (1)

Country Link
KR (1) KR0136818Y1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100366662B1 (en) * 2000-06-30 2003-01-09 최록일 A transfer device of semiconductorchip molding press

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100366662B1 (en) * 2000-06-30 2003-01-09 최록일 A transfer device of semiconductorchip molding press

Also Published As

Publication number Publication date
KR0136818Y1 (en) 1999-03-20

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