KR970026476U - 반도체 패키지의 히트싱크 구조 - Google Patents

반도체 패키지의 히트싱크 구조

Info

Publication number
KR970026476U
KR970026476U KR2019950034075U KR19950034075U KR970026476U KR 970026476 U KR970026476 U KR 970026476U KR 2019950034075 U KR2019950034075 U KR 2019950034075U KR 19950034075 U KR19950034075 U KR 19950034075U KR 970026476 U KR970026476 U KR 970026476U
Authority
KR
South Korea
Prior art keywords
heat sink
semiconductor package
sink structure
package
semiconductor
Prior art date
Application number
KR2019950034075U
Other languages
English (en)
Other versions
KR0137770Y1 (ko
Inventor
신원선
Original Assignee
아남산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아남산업주식회사 filed Critical 아남산업주식회사
Priority to KR2019950034075U priority Critical patent/KR0137770Y1/ko
Publication of KR970026476U publication Critical patent/KR970026476U/ko
Application granted granted Critical
Publication of KR0137770Y1 publication Critical patent/KR0137770Y1/ko

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR2019950034075U 1995-11-17 1995-11-17 반도체 패키지의 히트싱크 구조 KR0137770Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950034075U KR0137770Y1 (ko) 1995-11-17 1995-11-17 반도체 패키지의 히트싱크 구조

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950034075U KR0137770Y1 (ko) 1995-11-17 1995-11-17 반도체 패키지의 히트싱크 구조

Publications (2)

Publication Number Publication Date
KR970026476U true KR970026476U (ko) 1997-06-20
KR0137770Y1 KR0137770Y1 (ko) 1999-05-15

Family

ID=19429299

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950034075U KR0137770Y1 (ko) 1995-11-17 1995-11-17 반도체 패키지의 히트싱크 구조

Country Status (1)

Country Link
KR (1) KR0137770Y1 (ko)

Also Published As

Publication number Publication date
KR0137770Y1 (ko) 1999-05-15

Similar Documents

Publication Publication Date Title
DE69614195D1 (de) Vielchip pre-kontaktierter Halbleiter
KR970011736U (ko) 반도체 패키지의 히트싱크 구조
KR970019772U (ko) 반도체 패키지의 히트싱크 구조
KR970019773U (ko) 반도체 패키지의 히트싱크 구조
KR970019775U (ko) 반도체 패키지의 히트싱크 구조
KR970026476U (ko) 반도체 패키지의 히트싱크 구조
KR970048637U (ko) 반도체패키지용 방열판 구조
KR970048636U (ko) 반도체패키지용 히트싱크 구조
KR970019776U (ko) 반도체의 방열판 구조
KR980005470U (ko) 반도체 패키지의 열방출 구조
KR970059872U (ko) 반도체 패키지의 방열판
KR960026362U (ko) 반도체 패키지 제조용 히트싱크구조
KR960006698U (ko) 반도체패키지의 외부돌출형 히트싱크
KR970003770U (ko) 반도체 소자의 방열판
KR960033133U (ko) 반도체소자의 방열용 히트싱크 체결구조
KR960026368U (ko) 전력용 반도체소자의 방열판 구조
KR970011225U (ko) 반도체 패키지의 리드프레임 구조
KR960025485U (ko) 반도체 패키지의 히트스프레더 구조
KR970046894U (ko) 멀티칩 반도체패키지
KR950021466U (ko) 방열판 반도체 패키지
KR960039078U (ko) 전력용 반도체소자의 방열판 구조
KR960029743U (ko) 반도체 소자의 패키지
KR960015934U (ko) 반도체 소자의 방열판 접합구조
KR970046979U (ko) 반도체패키지 구조
KR970046976U (ko) 반도체패키지용 리드프레임 구조

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
LAPS Lapse due to unpaid annual fee