KR970024192A - Semiconductor device and manufacturing method thereof - Google Patents

Semiconductor device and manufacturing method thereof Download PDF

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Publication number
KR970024192A
KR970024192A KR1019950039001A KR19950039001A KR970024192A KR 970024192 A KR970024192 A KR 970024192A KR 1019950039001 A KR1019950039001 A KR 1019950039001A KR 19950039001 A KR19950039001 A KR 19950039001A KR 970024192 A KR970024192 A KR 970024192A
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KR
South Korea
Prior art keywords
film
semiconductor device
bpsg
oxide film
manufacturing
Prior art date
Application number
KR1019950039001A
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Korean (ko)
Inventor
박영우
최창식
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950039001A priority Critical patent/KR970024192A/en
Publication of KR970024192A publication Critical patent/KR970024192A/en

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

본 발명은 반도체장치 및 그 제조방법에 관해 개시한다. 본 발명의 반도장치는 BPSG막을 한 구성요소로 구비하는 반도체장치에 있어서, 상기 BPSG막의 양쪽면과 접하는 서로 연결되지 않은 도전막중 어느 한 도전막에 전기적으로 안정한 상기 BPSG이외의 다른 절연막을 구비한다.The present invention relates to a semiconductor device and a manufacturing method thereof. A semiconductor device comprising a BPSG film as one component of the present invention comprises an insulating film other than the BPSG that is electrically stable on any one of the conductive films that are not connected to each other in contact with both surfaces of the BPSG film.

본 발명에 의하면, 상기 BPSG막의 어느 한 면에 절연막을 구비함으로 인해 상기 BPSG 막의 핀 홀(Pinhole)에 의한 그 상, 하부의 도전막간의 숏을 방지할 수 있고, 상기 BPSG막의 불순물 도핑농도가 감소되는 것을 막을 수 있다.According to the present invention, by providing an insulating film on one surface of the BPSG film, it is possible to prevent a short between the upper and lower conductive films due to the pinhole of the BPSG film, and the impurity doping concentration of the BPSG film is reduced. Can be prevented.

Description

반도체 장치 및 그 제조방법Semiconductor device and manufacturing method thereof

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 종래 기술에 의한 반도체장치의 단면도,1 is a cross-sectional view of a semiconductor device according to the prior art,

제2도는 본 발명에 의한 반도체장치의 단면도,2 is a cross-sectional view of a semiconductor device according to the present invention;

제3도는 내지 제5도는 본 발명에 의한 반도체장치의 제조방법을 단계별로 나타낸 도면들이다.3 to 5 are steps illustrating a method of manufacturing a semiconductor device according to the present invention step by step.

Claims (7)

BPSG막을 한 구성요소로 구비하는 반도체장치에 있어서, 상기 BPSG막의 양쪽면과 접하는 서로 연결되지 않은 도전막중 어느 한 도전막에 전기적으로 안정한 상기 BPSG이외의 다른 절연막을 구비하는 것을 특징으로 하는 반도체장치.A semiconductor device comprising a BPSG film as a component, wherein the semiconductor device is provided with an insulating film other than the BPSG that is electrically stable on any of the conductive films that are not connected to each other in contact with both surfaces of the BPSG film. 제1항에 있어서, 상기 절연막은 산화막인 것을 특징으로 하는 반도체장치.The semiconductor device according to claim 1, wherein said insulating film is an oxide film. 반도체기판에 형성된 금속막의 일부 또는 전면에 BPSG막을 형성하는 단계를 포함하는 반도체장치의 제조 방법에 있어서, 상기 BPSG막을 형성하는 단계 전, 후에 상기 BPSG막 상에 전기적으로 안정한 상기 BPSG막 이외의 절연막을 형성하는 단계를 포함하는 것을 특징으로 하는 반도체장치의 제조방법.A method of manufacturing a semiconductor device comprising forming a BPSG film on a portion or the entire surface of a metal film formed on a semiconductor substrate, wherein an insulating film other than the electrically stable BPSG film is formed on the BPSG film before and after forming the BPSG film. A manufacturing method of a semiconductor device comprising the step of forming. 제3항에 있어서, 상기 절연막은 산화막으로 형성하는 것을 특징으로 하는 반도체장치의 제조방법.The method of manufacturing a semiconductor device according to claim 3, wherein said insulating film is formed of an oxide film. 제4항에 있어서, 상기 산화막은 상기 BPSG막이 형성되기 전에 형성되는 플레이트 노드(plate node)를 증착한 다음, 패터닝하기 전 또는 후에 형성하는 것을 특징으로 하는 반도체 장치의 제조방법.The method of claim 4, wherein the oxide film is formed before or after patterning a plate node formed before the BPSG film is formed. 제5항에 있어서, 상기 산화막은 상기 플레이트 노드를 산화시켜 형성한 열산화막, 고온열산화막(HTO), 저온산화막 및 LTTEOS로 이루어진 일군중 선택된 어느 하나로 형성하는 것을 특징으로 하는 반도체장치의 제조방법.The method of claim 5, wherein the oxide film is formed by any one selected from a group consisting of a thermal oxide film, a high temperature thermal oxide film (HTO), a low temperature oxide film, and an LTTEOS formed by oxidizing the plate node. 제4항에 있어서. 상기 산화막은 50~1,000Å의 두께로 형성하는 것을 특징으로 하는 반도체 장치의 제조방법.The method of claim 4. The oxide film is a semiconductor device manufacturing method characterized in that formed to a thickness of 50 ~ 1,000 50. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950039001A 1995-10-31 1995-10-31 Semiconductor device and manufacturing method thereof KR970024192A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950039001A KR970024192A (en) 1995-10-31 1995-10-31 Semiconductor device and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950039001A KR970024192A (en) 1995-10-31 1995-10-31 Semiconductor device and manufacturing method thereof

Publications (1)

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KR970024192A true KR970024192A (en) 1997-05-30

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KR1019950039001A KR970024192A (en) 1995-10-31 1995-10-31 Semiconductor device and manufacturing method thereof

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