KR970023951A - EM test pattern of metallization layer in semiconductor device - Google Patents
EM test pattern of metallization layer in semiconductor device Download PDFInfo
- Publication number
- KR970023951A KR970023951A KR1019950038992A KR19950038992A KR970023951A KR 970023951 A KR970023951 A KR 970023951A KR 1019950038992 A KR1019950038992 A KR 1019950038992A KR 19950038992 A KR19950038992 A KR 19950038992A KR 970023951 A KR970023951 A KR 970023951A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor device
- test pattern
- metal
- metal interconnection
- metallization layer
- Prior art date
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Abstract
반도체장치의 금속배선층의 EM 테스트 패턴이 개시되어 있다. 본 발명은 반도체장치의 테스트 패턴에 있어서, 실제의 반도체장치와 동일한 표면요철을 갖는 반도체기판 상에 서로 최소 디자인 룰에 의한 간격을 유지하면서 배치된 복수의 제1 금속배선; 및 상기 복수의 제1금속배선층에 적어도 하나의 제1 금속배선 상부에 배치된 제2 금속배선을 포함하는 것을 특징으로 하는 반도체장치의 금속배선층의 EM 테스트 패턴을 제공한다.An EM test pattern of a metal wiring layer of a semiconductor device is disclosed. The present invention relates to a test pattern of a semiconductor device, comprising: a plurality of first metal wires arranged on a semiconductor substrate having the same surface irregularities as an actual semiconductor device while maintaining a distance according to a minimum design rule from each other; And a second metal interconnection disposed on at least one first metal interconnection on the plurality of first metal interconnection layers. The EM test pattern of the metal interconnection layer of the semiconductor device is provided.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제1도는 본 발명에 의한 EM 테스트 패턴의 평면도이다.1 is a plan view of an EM test pattern according to the present invention.
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950038992A KR970023951A (en) | 1995-10-31 | 1995-10-31 | EM test pattern of metallization layer in semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950038992A KR970023951A (en) | 1995-10-31 | 1995-10-31 | EM test pattern of metallization layer in semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970023951A true KR970023951A (en) | 1997-05-30 |
Family
ID=66584352
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950038992A KR970023951A (en) | 1995-10-31 | 1995-10-31 | EM test pattern of metallization layer in semiconductor device |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970023951A (en) |
-
1995
- 1995-10-31 KR KR1019950038992A patent/KR970023951A/en not_active Application Discontinuation
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