KR970023904A - Strip of semiconductor package - Google Patents

Strip of semiconductor package Download PDF

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Publication number
KR970023904A
KR970023904A KR1019950036139A KR19950036139A KR970023904A KR 970023904 A KR970023904 A KR 970023904A KR 1019950036139 A KR1019950036139 A KR 1019950036139A KR 19950036139 A KR19950036139 A KR 19950036139A KR 970023904 A KR970023904 A KR 970023904A
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KR
South Korea
Prior art keywords
strip
substrate
package
hole
semiconductor package
Prior art date
Application number
KR1019950036139A
Other languages
Korean (ko)
Other versions
KR100258604B1 (en
Inventor
이무응
배동주
Original Assignee
황인길
아남산업주식회사
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Application filed by 황인길, 아남산업주식회사 filed Critical 황인길
Priority to KR1019950036139A priority Critical patent/KR100258604B1/en
Publication of KR970023904A publication Critical patent/KR970023904A/en
Application granted granted Critical
Publication of KR100258604B1 publication Critical patent/KR100258604B1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

본 발명은 반도체 패키지의 스트립에 관한 것으로, 특히 패키지를 제조하기 위한 제조작업에 있어 패키지로 제조되는 수개의 P. C. B 판넬을 반도에 제조장비가 이송 및 위치를 인식할 수 있도록 하기 위해 사용되는 스트립을 반영구적으로 재활용할 수 있도록 하기 위해 반도체 제조장비에게 P. C. B 기판(16)을 패키지로 가공하는데 있어, 이송 및 위치를 정확히 인식시킬 수 있도록 하기 위해 제작되는 반도체 패키지의 스트립(10)에 있어서, 표면에 수개의 사각형상인 관통공(11)을 중앙에 길이 방향으로 동간격을 유지하도록 형성하고 상기 외곽 사방 일정부위로는 패키지를 제작시 발생되는 스트레스로 부터 P. C. B 기판(16)을 보호하기 위한 그리드공(14)이 형성되어 있으며, 상기 관통공(11)과 그리드공(14) 사이의 일정 부위로는 양면접착테이프(17a)를 일체로 부착한 보조스트립(10)을 형성하며, 상기 관통공(11) 보다 다소 큰 형상을 취하는 별개의 P. C. B 기판(10)을 상기 보조스트립(10)의 상부에 부착된 양면접착테이프(17a)에 착탈가능토록 부착구성함을 특징으로 하는 반도체 패키지의 스트립.The present invention relates to a strip of a semiconductor package, and more particularly to a strip used to allow a manufacturing equipment to recognize the transport and position of several PC B panels manufactured as a package in a manufacturing operation for manufacturing the package. In the process of processing a PC B substrate 16 into a package to a semiconductor manufacturing equipment for semi-permanent recycling, the strip 10 of the semiconductor package manufactured to be able to accurately recognize the transfer and position, Grid holes for protecting the PC B substrate 16 from stresses generated during fabrication of the package are formed in the center in the longitudinal direction to form a plurality of rectangular through-holes 11 in the longitudinal direction. 14 is formed, and the double-sided adhesive tape 17a is integrally formed as a predetermined portion between the through hole 11 and the grid hole 14. A separate PC B substrate 10 having a shape larger than the through hole 11 is formed on the double-sided adhesive tape 17a attached to the upper portion of the auxiliary strip 10. A strip of semiconductor package, characterized in that it is detachably attached.

Description

반도체 패키지의 스트립Strip of semiconductor package

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제2도는 본 발명의 실시예를 나타내는 분해사시도,2 is an exploded perspective view showing an embodiment of the present invention,

제3도는(가)(나)(다) 본 발명의 다른 실시예를 나타내는 단면도.3 is a cross-sectional view showing another embodiment of the present invention (a) (b) (c).

Claims (5)

반도체 제조장비에게 P. C. B 기판(16)을 패키지로 가공하는데 있어, 이송 및 위치를 정확히 인식시킬 수 있도록 하기 위해 제작되는 반도체 패키지의 스트립(10)에 있어서, 표면에 수개의 사각형상인 관통공(11)을 중앙에 길이방향으로 동간격을 유지하도록 형성하고 상기 외곽 사방 일정부위로는 패키지를 제작시 발생되는 스트레스로 부터 P.C.B 기판(16)을 보호하기 위한 그리드공(14)이 형성되어 있으며, 상기 관동공(11)과 그리드공(14) 사이의 일정 부위로는 양면접착테이프(17a)를 일체로 부착한 보조스트립(10)을 형성하며, 상기 관통공(11) 보다 다소 큰 형상을 취하는 별개의 P.C.B 기판(16)을 상기 보조스트립(10)의 상부에 부착된 양면접착 테이프(17a)에 착탈가능토록 부착구성 함을 특징으로 하는 반도체 패키지의 스트립.In the process of processing a PC B substrate 16 into a package to a semiconductor manufacturing equipment, the strip 10 of the semiconductor package is manufactured so that the transfer and position can be accurately recognized. ) Is formed to maintain the same distance in the center in the longitudinal direction in the center and the grid hole 14 for protecting the PCB substrate 16 from the stress generated during the manufacturing of the package to a certain portion of the outer corner is formed, A predetermined portion between the Kanto hole 11 and the grid hole 14 forms an auxiliary strip 10 to which the double-sided adhesive tape 17a is integrally attached, and takes a shape slightly larger than the through hole 11. The strip of semiconductor package, characterized in that the PCB substrate 16 is attached to the detachable double-sided adhesive tape (17a) attached to the upper portion of the auxiliary strip (10). 제1항에 있어서, 상기 패키지로 제작된 P. C. B 기판(16)을 보조스트립(10)의 표면 중앙에 형성된 관통공(11) 상부로 안착시키되 접착테이프(17b)를 상기 P.C.B기판(16)의 외측 상면으로 부터 보조스트립(10) 표면에 수개 연결 부착시켜 상호결합되도록 구성함을 특징으로 하는 반도체 패키지의 스트립 구조.The method of claim 1, wherein the PC B substrate 16 made of the package is seated on top of the through hole 11 formed in the center of the surface of the auxiliary strip 10, the adhesive tape 17b of the PCB substrate 16 A strip structure of a semiconductor package, characterized in that it is configured to be connected to each other by attaching and attached to the surface of the auxiliary strip (10) from the outer upper surface. 제1항에 있어서, 보조스트립(10)의 표면 중앙에 P. G. B 기판(16)보다 다소 큰 함몰부(15)를 길이방향으로 수개 형성하여 상기 함몰부(15)의 내측 P. C. B 기판(16)을 안치시킨 후 접착테이프(17b)를 상기 P. C. B 기판(16) 외측 상면과 보조스트립(10)의 표면에 수개 연결되도록 접착시켜 상호 결합되도록 구성함을 특징으로 하는 반도체 패키지의 스트립 구조.The inner PC B substrate 16 of claim 1, wherein a plurality of depressions 15 somewhat larger than the PG B substrate 16 are formed in the longitudinal direction at the center of the surface of the auxiliary strip 10. Stripping structure of the semiconductor package characterized in that the adhesive tape (17b) is bonded to the surface of the outer surface of the PC B substrate (16) and the surface of the auxiliary strip (10) to be bonded to each other after being placed therein. 제1항에 있어서, 보조스트립(10)의 표면 중앙에 P. C. B 기판(18) 보다 다소 각 관통공(11)을 길이방향으로 수개 형성하여, 상기 관통공(11) 내측으로 P.C.B기판(16)을 안치시킨 후 접착테이프(17)를 상기 P.C.B기판(16) 외측 상하면으로 보조스트립(10)과 상호결합되도록 구성함을 특징으로 하는 반도체 패키지의 스트립 구조.The PCB 16 is formed in the through hole 11 by forming a plurality of through holes 11 in the longitudinal direction rather than the PC B substrate 18 in the center of the surface of the auxiliary strip 10. The structure of the strip of the semiconductor package, characterized in that the adhesive tape 17 is configured to be bonded to the auxiliary strip 10 to the upper and lower surfaces of the outer side of the PCB substrate 16 after being placed therein. 제1항에 있어서, 상기 보조스트립(10)의 재질을 구리 알루미늄, 스테인레스, 플라스틱으로 형성함을 특징으로 하는 반도체 패키지의 스트립 구조.The strip structure of claim 1, wherein the auxiliary strip (10) is made of copper aluminum, stainless steel, or plastic. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950036139A 1995-10-19 1995-10-19 Strip of semiconductor package KR100258604B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950036139A KR100258604B1 (en) 1995-10-19 1995-10-19 Strip of semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950036139A KR100258604B1 (en) 1995-10-19 1995-10-19 Strip of semiconductor package

Publications (2)

Publication Number Publication Date
KR970023904A true KR970023904A (en) 1997-05-30
KR100258604B1 KR100258604B1 (en) 2000-06-15

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Application Number Title Priority Date Filing Date
KR1019950036139A KR100258604B1 (en) 1995-10-19 1995-10-19 Strip of semiconductor package

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100285917B1 (en) * 1999-03-22 2001-03-15 한효용 semiconductor package strip and forming method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100285917B1 (en) * 1999-03-22 2001-03-15 한효용 semiconductor package strip and forming method thereof

Also Published As

Publication number Publication date
KR100258604B1 (en) 2000-06-15

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