KR970020336U - Heat sink for easy fixing of substrate - Google Patents

Heat sink for easy fixing of substrate

Info

Publication number
KR970020336U
KR970020336U KR2019950031462U KR19950031462U KR970020336U KR 970020336 U KR970020336 U KR 970020336U KR 2019950031462 U KR2019950031462 U KR 2019950031462U KR 19950031462 U KR19950031462 U KR 19950031462U KR 970020336 U KR970020336 U KR 970020336U
Authority
KR
South Korea
Prior art keywords
substrate
heat sink
easy fixing
fixing
easy
Prior art date
Application number
KR2019950031462U
Other languages
Korean (ko)
Other versions
KR0134479Y1 (en
Inventor
양귀견
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR2019950031462U priority Critical patent/KR0134479Y1/en
Publication of KR970020336U publication Critical patent/KR970020336U/en
Application granted granted Critical
Publication of KR0134479Y1 publication Critical patent/KR0134479Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
KR2019950031462U 1995-10-31 1995-10-31 Heat sink simplicity printed circuit board for fixing KR0134479Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950031462U KR0134479Y1 (en) 1995-10-31 1995-10-31 Heat sink simplicity printed circuit board for fixing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950031462U KR0134479Y1 (en) 1995-10-31 1995-10-31 Heat sink simplicity printed circuit board for fixing

Publications (2)

Publication Number Publication Date
KR970020336U true KR970020336U (en) 1997-05-26
KR0134479Y1 KR0134479Y1 (en) 1999-04-15

Family

ID=19427635

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950031462U KR0134479Y1 (en) 1995-10-31 1995-10-31 Heat sink simplicity printed circuit board for fixing

Country Status (1)

Country Link
KR (1) KR0134479Y1 (en)

Also Published As

Publication number Publication date
KR0134479Y1 (en) 1999-04-15

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20011004

Year of fee payment: 4

LAPS Lapse due to unpaid annual fee