KR970013250A - Constant temperature holding device of semiconductor device - Google Patents

Constant temperature holding device of semiconductor device Download PDF

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Publication number
KR970013250A
KR970013250A KR1019950024411A KR19950024411A KR970013250A KR 970013250 A KR970013250 A KR 970013250A KR 1019950024411 A KR1019950024411 A KR 1019950024411A KR 19950024411 A KR19950024411 A KR 19950024411A KR 970013250 A KR970013250 A KR 970013250A
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KR
South Korea
Prior art keywords
temperature
semiconductor
thermocouple
chip
temperature holding
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KR1019950024411A
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Korean (ko)
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KR0177393B1 (en
Inventor
정태성
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문정환
엘지반도체 주식회사
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Priority to KR1019950024411A priority Critical patent/KR0177393B1/en
Publication of KR970013250A publication Critical patent/KR970013250A/en
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Publication of KR0177393B1 publication Critical patent/KR0177393B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/02—Means for indicating or recording specially adapted for thermometers
    • G01K1/026—Means for indicating or recording specially adapted for thermometers arrangements for monitoring a plurality of temperatures, e.g. by multiplexing

Abstract

본 발명은 반도체칩이 상면에 안착된 칩 다이와, 반도체칩과 칩다이를 보호하기 위하여, 반도체칩과 칩다이를 에워싸도록 형성시킨 보호막과, 칩다이 하단에 연결된 리드로 이루어진 반도체 디바이스의 항온유지장치에 있어서, 반도체 디바이스의 항온을 유지시키기 위한 온도유지부와, 디바이스의 온도를 제어하기 위한 온도제어부와, 디바이스의 온도를 감지하기 위한 온도감지부를 포함하여 이루어지는 반도체 디바이스의 항온유지장치에 관한 것이다.The present invention provides a constant temperature maintenance of a semiconductor device including a chip die on which a semiconductor chip is mounted on an upper surface, a protective film formed to surround the semiconductor chip and the chip die, and a lead connected to the lower end of the chip die in order to protect the semiconductor chip and the chip die. An apparatus, comprising: a temperature holding unit for maintaining a constant temperature of a semiconductor device, a temperature control unit for controlling a temperature of the device, and a temperature sensing unit for sensing a temperature of the device. .

Description

반도체 디바이스의 항온유지장치Constant temperature holding device of semiconductor device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제2도는 본 발명의 반도체 디바이스의 항온유지장치를 도시한 도면.2 is a diagram showing a constant temperature holding apparatus of a semiconductor device of the present invention.

Claims (7)

반도체칩이 상면에 안착된 칩 다이와, 상기 반도체칩과 상기 칩다이를 보호하기 위하여, 상기 반도체칩과 상기 칩다이를 에워싸도록 형성시킨 보호막과, 상기 칩다이 하단에 연결된 리드로 이루어진 반도체 디바이스의 항온유지장치에 있어서, 상기 디바이스의 항온을 유지시키기 위한 온도유지부와, 상기 디바이스의 온도를 감지하기 위한 온도감지와, 상기 온도감지부에서 상기 디바이스의 온도를 감지하면 상기 디바이스의 냉각 또는 가열시그널을 발생시키는 차등전압을 발생시켜서 상기 온도유지부로 입력되도록 하는 온도제어부를 포함하여 이루어지는 반도체 디바이스의 항온유지장치.A semiconductor device comprising a chip die having a semiconductor chip mounted on an upper surface thereof, a protective film formed to surround the semiconductor chip and the chip die to protect the semiconductor chip and the chip die, and a lead connected to a lower end of the chip die. In the constant temperature holding apparatus, a temperature holding unit for maintaining a constant temperature of the device, a temperature sensing unit for sensing the temperature of the device, and if the temperature sensing unit senses the temperature of the device cooling or heating signal of the device And a temperature control unit for generating a differential voltage for generating a differential voltage and inputting the differential voltage to the temperature holding unit. 제1항에 있어서, 상기 온도유지부와 상기 온도감지부는 상기 디바이스에 내장되어 형성되고, 상기 온도제어부는 디바이스의 외부에 형성하는 것을 특징으로 하는 반도체 디바이스의 항온유지장치.The apparatus of claim 1, wherein the temperature holding part and the temperature sensing part are formed in the device, and the temperature control part is formed outside the device. 제1항 또는 제2항에 있어서, 상기 온도유지부는 상기 반도체칩과 상기 칩다이 사이에 형성시켜, 상기 디바이스의 온도를 일정하게 유지시켜 주기 위한 온도조절판으로 이루어지는 것을 특징으로 하는 반도체 디바이스의 항온유지장치.3. The constant temperature holding of a semiconductor device according to claim 1 or 2, wherein the temperature holding part is formed between the semiconductor chip and the chip die to form a temperature control plate for maintaining a constant temperature of the device. Device. 제3항에 있어서, 상기 온도감지부는 상기 반도체칩과 상기 온도조절판 사이에 형성되어, 디바이스의 온도변화를 감지하는 온도감지센터로 이루어지는 것을 특징으로 하는 반도체 디바이스의 항온유지장치.4. The apparatus of claim 3, wherein the temperature sensing unit is formed between the semiconductor chip and the temperature control plate and comprises a temperature sensing center configured to sense a temperature change of the device. 제3항 또는 제4항에 있어서, 상기 온도조절판으로는 냉각된 디바이스의 온도를 상승시키기 위한 냉각열전대와, 가열된 디바이스의 온도를 하강시키기 위한 가열열전대를 포함하여 디바이스가 항온을 유지하도록 이루어지는 것을 특징으로 하는 반도체 디바이스의 항온유지장치.The device according to claim 3 or 4, wherein the temperature control plate comprises a cooling thermocouple for raising the temperature of the cooled device and a heating thermocouple for lowering the temperature of the heated device. A constant temperature holding apparatus for a semiconductor device. 제4항에 있어서, 상기 온도조절판의 상기 냉각열전대와 상기 가열열전대는 등간격의 나선형으로 형성하여 반도체칩에 균일하게 열을 공급하여, 디바이스가 일정한 온도를 유지하도록 이루어지는 것을 특징으로 하는 반도체 디바이스의 항온유지장치.5. The semiconductor device according to claim 4, wherein the cooling thermocouple and the heating thermocouple of the temperature control plate are formed in a spiral at equal intervals to uniformly supply heat to the semiconductor chip so that the device maintains a constant temperature. Thermostat. 제1항 또는 제2항에 있어서, 상기 온도제어부는 디바이스가 가장 효율적으로 동작하는 온도와 비교하여 차등전압을 발생시키는 시그널비교기와, 상기 시그널비교기에서 발생된 차등전압으로부터 디바이스의 냉각 및 가열 시그널을 만들어 상기 온도유지부에 명령을 주는 콘트롤러와, 상기 온도유지부에 전원을 공급하여 주기위한 열전대 공급전원과, 상기 온도유지부와 열전대공급전원을 연결시켜 주기 위한 커넥터와, 상기 디바이스의 동작온도를 임의로 세팅할 수 있는 온도세팅원으로 이루어지는 것을 특징으로 하는 반도체 디바이스의 항온유지장치.The signal comparator according to claim 1 or 2, wherein the temperature controller is configured to generate a differential voltage in comparison with a temperature at which the device operates most efficiently, and to provide cooling and heating signals of the device from the differential voltage generated in the signal comparator. A controller for making a command to the temperature holding part, a thermocouple supply power for supplying power to the temperature holding part, a connector for connecting the temperature holding part and a thermocouple supply power, and an operating temperature of the device. A constant temperature holding apparatus for a semiconductor device, comprising a temperature setting source that can be arbitrarily set.
KR1019950024411A 1995-08-08 1995-08-08 Chamber control apparatus of semiconductor device KR0177393B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950024411A KR0177393B1 (en) 1995-08-08 1995-08-08 Chamber control apparatus of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950024411A KR0177393B1 (en) 1995-08-08 1995-08-08 Chamber control apparatus of semiconductor device

Publications (2)

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KR970013250A true KR970013250A (en) 1997-03-29
KR0177393B1 KR0177393B1 (en) 1999-03-20

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KR1019950024411A KR0177393B1 (en) 1995-08-08 1995-08-08 Chamber control apparatus of semiconductor device

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101132772B1 (en) * 2010-02-05 2012-04-06 한국표준과학연구원 Thermostatic bath module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101132772B1 (en) * 2010-02-05 2012-04-06 한국표준과학연구원 Thermostatic bath module

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KR0177393B1 (en) 1999-03-20

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