KR970007692U - Transistor assembly structure of electronic products - Google Patents

Transistor assembly structure of electronic products

Info

Publication number
KR970007692U
KR970007692U KR2019950017474U KR19950017474U KR970007692U KR 970007692 U KR970007692 U KR 970007692U KR 2019950017474 U KR2019950017474 U KR 2019950017474U KR 19950017474 U KR19950017474 U KR 19950017474U KR 970007692 U KR970007692 U KR 970007692U
Authority
KR
South Korea
Prior art keywords
assembly structure
electronic products
transistor assembly
transistor
products
Prior art date
Application number
KR2019950017474U
Other languages
Korean (ko)
Other versions
KR0131108Y1 (en
Inventor
김기돈
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to KR2019950017474U priority Critical patent/KR0131108Y1/en
Publication of KR970007692U publication Critical patent/KR970007692U/en
Application granted granted Critical
Publication of KR0131108Y1 publication Critical patent/KR0131108Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR2019950017474U 1995-07-15 1995-07-15 Assembly structure transistor of electronic equipment KR0131108Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950017474U KR0131108Y1 (en) 1995-07-15 1995-07-15 Assembly structure transistor of electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950017474U KR0131108Y1 (en) 1995-07-15 1995-07-15 Assembly structure transistor of electronic equipment

Publications (2)

Publication Number Publication Date
KR970007692U true KR970007692U (en) 1997-02-21
KR0131108Y1 KR0131108Y1 (en) 1999-04-15

Family

ID=19418319

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950017474U KR0131108Y1 (en) 1995-07-15 1995-07-15 Assembly structure transistor of electronic equipment

Country Status (1)

Country Link
KR (1) KR0131108Y1 (en)

Also Published As

Publication number Publication date
KR0131108Y1 (en) 1999-04-15

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20050830

Year of fee payment: 8

LAPS Lapse due to unpaid annual fee