KR970005620A - Melamine chip board with pattern piece and manufacturing method - Google Patents

Melamine chip board with pattern piece and manufacturing method Download PDF

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Publication number
KR970005620A
KR970005620A KR1019960051784A KR19960051784A KR970005620A KR 970005620 A KR970005620 A KR 970005620A KR 1019960051784 A KR1019960051784 A KR 1019960051784A KR 19960051784 A KR19960051784 A KR 19960051784A KR 970005620 A KR970005620 A KR 970005620A
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KR
South Korea
Prior art keywords
melamine resin
pattern
impregnated paper
melamine
resin impregnated
Prior art date
Application number
KR1019960051784A
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Korean (ko)
Other versions
KR0177019B1 (en
Inventor
심응문
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심응문
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Priority to KR1019960051784A priority Critical patent/KR0177019B1/en
Publication of KR970005620A publication Critical patent/KR970005620A/en
Application granted granted Critical
Publication of KR0177019B1 publication Critical patent/KR0177019B1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B29/00—Layered products comprising a layer of paper or cardboard
    • B32B29/06—Layered products comprising a layer of paper or cardboard specially treated, e.g. surfaced, parchmentised
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
    • B32B21/02—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board the layer being formed of fibres, chips, or particles, e.g. MDF, HDF, OSB, chipboard, particle board, hardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
    • B32B21/04—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B21/08—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/028—Paper layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/04—Time
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/12—Pressure

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  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Laminated Bodies (AREA)

Abstract

본 발명은 파티클 보드나 중밀도 섬유판(M.D.F)의 표면에 부착되어지는 멜라민 수지 함침지에 소정의 다른 무늬가 다양하게 형성되도록 한 것으로서, 특히 파티클 보드나 중밀도 섬유판의 표면에 부착되면서 단일무늬로 된 멜라민 수지 함침지에 형성된 소정 형상의 무늬편 삽입공에, 제1 멜라민 수지 함침지와 다른 단일무늬로 형성된 제2 멜라민 수지 함침지에서따내어진 소정 형상의 무늬편이 정교하게 삽입되어 독특한 심미감을 나타낼수 있도록 구성된 무늬편이 삽입된 멜라민 칩보드 및 그 제조방법에 관한 것이다. 단일 무늬로된 멜라민 수지 함침지중 임의로 선택한 제1 멜라민 수지 함침지(1)와 제1 멜라민 수지 함침지(1)와는 다른단일 무늬를 갖는 제2 멜라민 수지 함침지에 레이저광 출사장치에 의해서 원하는 소정의 동일 형상의 무늬편을 따내는 제2공정과 ;According to the present invention, a different pattern is formed on a melamine resin-impregnated paper that is attached to the surface of a particle board or a medium density fiber board (MDF), and in particular, a single pattern is attached to the surface of the particle board or a medium density fiber board (MDF). Into the pattern piece insertion hole of the predetermined shape formed in the melamine resin impregnated paper, the pattern piece of the predetermined shape derived from the second melamine resin impregnated paper formed of a single pattern different from the first melamine resin impregnated paper is precisely inserted to exhibit a unique aesthetic sense. The present invention relates to a melamine chip board having a patterned piece inserted therein and a method of manufacturing the same. The predetermined predetermined melamine resin impregnated paper (1) and the first melamine resin impregnated paper (1), which are randomly selected among the single-lined melamine resin impregnated papers, have a predetermined pattern desired by a laser beam emitting device. A second step of picking out a pattern piece of the same shape;

상기 파티클 보드에 소정 형상의 무늬편이 따내어진 제1 멜라민 수지 함침지(1)를 올려놓고, 제1 멜라민 수지 함침지(1)의 무늬편 삽입공(1a)에 대응하는 상기 제1 멜라민 수지 함침지(1)와는 다른 단일무늬를 가진 멜라민 수지 함침지에서 따낸 무늬편(1a')을 각각 삽입시키는 제3공정과 ; 상기 소정의 형상의 무늬편(1a')들이 각각 삽입된 멜라민 수지 함침지가 놓여진 파티클 보드를 175℃∼185℃의 온도와 20∼30Kg/㎠의 압력으로 약 30초∼1분 30초 동안 동시에 열압 프레싱 작동을 실시하여 멜라민 칩보드(3)를 얻는 제4공정에의해서 제조하는 것을 특징으로 하고 있으며, 생산성 향상이 됨은 물론 정교하면서 미적 조화를 이룰수 있으며, 심미감이있는 효과가 있다.The first melamine resin-impregnated paper 1, from which a pattern piece of a predetermined shape was obtained, was placed on the particle board, and the first melamine resin-impregnated corresponding to the pattern piece insertion hole 1a of the first melamine resin-impregnated paper 1 was placed. A third step of inserting the pattern pieces 1a 'respectively obtained from the melamine resin impregnated paper having a single pattern different from the paper 1; Particle board on which the melamine resin impregnated paper into which the pattern pieces 1a 'of the predetermined shape are inserted is placed at a temperature of 175 ° C. to 185 ° C. and a pressure of 20 to 30 Kg / cm 2 simultaneously for about 30 seconds to 1 minute 30 seconds. It is characterized in that the manufacturing by the fourth step of obtaining the melamine chipboard (3) by pressing the operation, can improve productivity as well as achieve a delicate and aesthetic harmony, there is an aesthetic effect.

Description

무늬편이 삽입된 멜라민 칩보드 및 그 제조방법Melamine chip board with pattern piece and manufacturing method

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명이 적용된 의장의 정면도, 제2도는 제1도의 A부 횡단면도이다.1 is a front view of a design to which the present invention is applied, and FIG. 2 is a cross-sectional view of portion A of FIG.

Claims (4)

멜라민 수지 함침지가 파티클 보드, 중밀도 섬유판에 겹쳐진 상태에서 열압 프레스 가공에 의하여 멜라민칩보드를 제조함에 있어서, 단일 무늬가 형성된 제1 멜라민 수지 함침지(1)에 형성된 무늬편 삽입공(1a)들에, 이 무늬편삽입공(1a)들에 대응하는 상기 제1 멜라민 수지 함침지(1)와 다른 단일무늬가 형성된 제2 멜라민 수지 함침지로부터 얻은무늬편(1a')들이 밀착되게 삽입되어 파티클 보드와 함께 가열 압착되어서 형성된 것을 특징으로 하는 무늬편이 삽입된 멜라민 칩보드.In manufacturing a melamine chip board by hot-press press processing in which the melamine resin impregnated paper is superimposed on a particle board and a medium density fiber board, the pattern piece insertion holes 1a formed in the 1st melamine resin impregnated paper 1 in which a single pattern was formed. The first piece of the melamine resin-impregnated paper 1 corresponding to the patterned piece insertion holes 1a and the pattern piece 1a 'obtained from the second melamine resin-impregnated paper formed with a different single pattern are inserted in close contact with the particles. Melamine chip board is inserted into the pattern piece, characterized in that formed by heating and pressing together with the board. 제1항에 있어서, 삽입되는 무늬편(1a')들은 한종류 이상의 멜라민 수지 함침지로부터 따내어서 사용할수있도록 구성된 것을 특징으로 하는 무늬편이 삽입된 멜라민 칩보드.The patterned melamine chipboard according to claim 1, wherein the patterned pieces (1a ') to be inserted are configured to be used after being extracted from at least one type of melamine resin impregnated paper. 제1항에 있어서, 제1 멜라민 수지 함침지(1)에 무늬편 삽입공이 형성되지 않은 상태에서 서로 다른 단일무늬의 멜라민 수지 함침지로부터 따내어진 무늬편(1a')이 상기 제1 멜라민 수지 함침지(1)의 표면에 위치한 상태에서 파티클 보드(2)와 함께 가열 압착되어서 형성된 것을 특징으로 하는 멜라민 칩보드.The patterned piece 1a 'obtained from different single-pattern melamine resin-impregnated papers in a state where no pattern piece insertion hole is formed in the first melamine resin-impregnated paper 1 is impregnated with the first melamine resin. Melamine chipboard, characterized in that formed by heating and pressing together with the particle board (2) in the state located on the surface of the paper (1). 서로 다른 단일 무늬로된 멜라민 수지 함침지중 임의로 선택한 제1 멜라민 수지 함침지(1)와 제1 멜라민수지 함침지(1)와는 다른 단일무늬를 갖는 제2 멜라민 수지 함침지에서 레이저광 출사장치에 의해서 원하는 소정의 동일형상의 무늬편(1a')을 따내는 제2공정과 ; 상기 파티클 보드(2)에 소정 형상의 무늬편(1a')들이 따내어진 제1 멜라민 수지 함침지(1)를 올려놓고, 제1 멜라민 수지 함침지(1)의 무늬편 삽입공(1a')에 이 무늬편 삽입공(1a)들에 대응하는 상기제1 멜라민 수지 함침지(1)와 다른 단일 무늬를 가진 제2 멜라민 수지 함침지에서 따낸 무늬편(1a')을 각각 삽입시키는제3공정과 ; 상기 소정의 형상의 무늬편(1a')들이 각각 삽입된 멜라민 수지 함침지가 놓여진 파티클 보드(2)를 175℃∼185℃의 온도와 20∼30kg/㎠의 압력으로 약 30초∼1분 30초 동안 동시에 열압 프레싱 작동을 실시하여 멜라민 칩보드(3)를 얻는 제 4공정에 의해서 제조하는 것을 특징으로 하는 무늬편이 삽입된 멜라민 칩보드의 제조방법.By means of a laser beam exiting device in a second melamine resin impregnated paper having a single pattern different from the first melamine resin impregnated paper 1 and the first melamine resin impregnated paper 1 arbitrarily selected among different single patterned melamine resin impregnated papers. A second step of picking out desired predetermined same-shaped pattern pieces 1a '; The first melamine resin-impregnated paper 1, from which the pattern pieces 1a 'of a predetermined shape are obtained, is placed on the particle board 2, and the pattern piece insertion hole 1a' of the first melamine resin-impregnated paper 1 is placed. And a third step of inserting the pattern piece 1a 'obtained from the first melamine resin impregnated paper 1 corresponding to the pattern piece insertion holes 1a and the second melamine resin impregnated paper having a different single pattern. And; The particle board 2 on which the melamine resin-impregnated paper into which the pattern pieces 1a 'of the predetermined shape are inserted is placed is about 30 seconds to 1 minute 30 seconds at a temperature of 175 ° C to 185 ° C and a pressure of 20 to 30kg / cm 2. A method of manufacturing a melamine chipboard having a pattern piece inserted therein, characterized in that it is manufactured by a fourth step of simultaneously performing hot-pressing operation to obtain a melamine chipboard (3).
KR1019960051784A 1996-11-04 1996-11-04 Melamine chip board with pattern piece and manufacturing method KR0177019B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960051784A KR0177019B1 (en) 1996-11-04 1996-11-04 Melamine chip board with pattern piece and manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960051784A KR0177019B1 (en) 1996-11-04 1996-11-04 Melamine chip board with pattern piece and manufacturing method

Publications (2)

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KR970005620A true KR970005620A (en) 1997-02-19
KR0177019B1 KR0177019B1 (en) 1999-04-01

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