KR970004042A - Highly Integrated EPIROM Device Manufacturing Method - Google Patents

Highly Integrated EPIROM Device Manufacturing Method Download PDF

Info

Publication number
KR970004042A
KR970004042A KR1019950019121A KR19950019121A KR970004042A KR 970004042 A KR970004042 A KR 970004042A KR 1019950019121 A KR1019950019121 A KR 1019950019121A KR 19950019121 A KR19950019121 A KR 19950019121A KR 970004042 A KR970004042 A KR 970004042A
Authority
KR
South Korea
Prior art keywords
epirom
device manufacturing
highly integrated
highly
integrated
Prior art date
Application number
KR1019950019121A
Other languages
Korean (ko)
Other versions
KR0148331B1 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to KR1019950019121A priority Critical patent/KR0148331B1/en
Publication of KR970004042A publication Critical patent/KR970004042A/en
Application granted granted Critical
Publication of KR0148331B1 publication Critical patent/KR0148331B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604—Chemical etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/32055—Deposition of semiconductive layers, e.g. poly - or amorphous silicon layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Semiconductor Memories (AREA)
  • Non-Volatile Memory (AREA)
KR1019950019121A 1995-06-30 1995-06-30 High integrated eeprom device KR0148331B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950019121A KR0148331B1 (en) 1995-06-30 1995-06-30 High integrated eeprom device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950019121A KR0148331B1 (en) 1995-06-30 1995-06-30 High integrated eeprom device

Publications (2)

Publication Number Publication Date
KR970004042A true KR970004042A (en) 1997-01-29
KR0148331B1 KR0148331B1 (en) 1998-10-15

Family

ID=19419481

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950019121A KR0148331B1 (en) 1995-06-30 1995-06-30 High integrated eeprom device

Country Status (1)

Country Link
KR (1) KR0148331B1 (en)

Also Published As

Publication number Publication date
KR0148331B1 (en) 1998-10-15

Similar Documents

Publication Publication Date Title
KR960012575A (en) Semiconductor device manufacturing method
KR960012574A (en) Semiconductor device manufacturing method
KR970004015A (en) Semiconductor device and manufacturing method thereof
NO963184D0 (en) Compressor device
BR9601233A (en) Transaction-evidencing device manufacturing process
DE69622983D1 (en) CHIP COIL
IT1283799B1 (en) SEMICONDUCTURE DEVICE AND ITS MANUFACTURING PROCESS
FI954241A (en) Semiconductor device manufacturing method
DE69625007T2 (en) A semiconductor device manufacturing method
DE69528047D1 (en) Positioning device
DE69620944T2 (en) Semiconductor test method
DE69601454D1 (en) Positioning device
DE69621560D1 (en) positioning device
KR970004042A (en) Highly Integrated EPIROM Device Manufacturing Method
DE69534487D1 (en) Manufacturing method for compression semiconductor device
KR970004171A (en) Semiconductor device and manufacturing method
DE19681578T1 (en) Positioning device
BR9602326A (en) Electronic device
KR970003418A (en) Highly Integrated Semiconductor Device Manufacturing Method
KR970000127U (en) Kimbab forming device
DE29519019U1 (en) Electronic device
KR970046731U (en) Flattening device for semiconductor device manufacturing
DE29513787U1 (en) Electronic logbook
DE29520159U1 (en) Electronic device
DE29516050U1 (en) Electronic device

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20060502

Year of fee payment: 9

LAPS Lapse due to unpaid annual fee