KR970003886A - Heater cartridge device for semiconductor mold die - Google Patents
Heater cartridge device for semiconductor mold die Download PDFInfo
- Publication number
- KR970003886A KR970003886A KR1019950015045A KR19950015045A KR970003886A KR 970003886 A KR970003886 A KR 970003886A KR 1019950015045 A KR1019950015045 A KR 1019950015045A KR 19950015045 A KR19950015045 A KR 19950015045A KR 970003886 A KR970003886 A KR 970003886A
- Authority
- KR
- South Korea
- Prior art keywords
- mold die
- resistance
- heater cartridge
- wire
- length
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
본 발명은 반도체 모울드 다이용 히터 카트리지 장치에 관한 것으로, 각각 저항값을 달리하는 3 부분의 저항선(12a, 12b,12c)으로 이루어진 발열저항체(12)를 히터 카트리지에 내장시키고, 이 히터 카트리지 본체를 모울드 다이에 삽입하여 발열작용을 수행할 때 모울드 다이 주변부위에 대응한 저항선(12c)의 발열량이 가장 많게 되도록 저항선의 굵기 및 길이를설정하여 모울드 다이 표면온도를 그 중심부와 주변부에서 온도편차 없이 일정하게 유지할 수 있게 됨으로써, 반도체장치의 몰딩시에 불량율을 저하시키고 품질을 보다 향상시킬 수 있는 장점이 있다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heater cartridge device for a semiconductor mold die, and includes a heat generating resistor (12) consisting of three portions of resistance wires (12a, 12b, 12c) having different resistance values in a heater cartridge, The thickness and length of the resistance wire are set so that the heating value of the resistance wire 12c corresponding to the peripheral part of the mold die is maximized when the heating is inserted into the mold die so that the mold die surface temperature is constant without temperature deviation at the center and the peripheral part thereof. By being able to maintain it, it is advantageous to lower the defect rate and improve the quality at the time of molding the semiconductor device.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제4도는 본 발명에 따른 히터 카트리지의 구성을 나타낸 개략도.4 is a schematic view showing a configuration of a heater cartridge according to the present invention.
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950015045A KR0145996B1 (en) | 1995-06-08 | 1995-06-08 | A device for heating periphery of semiconductor mold die |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950015045A KR0145996B1 (en) | 1995-06-08 | 1995-06-08 | A device for heating periphery of semiconductor mold die |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970003886A true KR970003886A (en) | 1997-01-29 |
KR0145996B1 KR0145996B1 (en) | 1998-08-01 |
Family
ID=19416660
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950015045A KR0145996B1 (en) | 1995-06-08 | 1995-06-08 | A device for heating periphery of semiconductor mold die |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR0145996B1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100829032B1 (en) * | 2007-02-26 | 2008-05-16 | (주)대호테크 | Heater block structure |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20230010985A (en) | 2021-07-13 | 2023-01-20 | 경북보건대학교 산학협력단 | Flexible hose band plier coupled with motor |
-
1995
- 1995-06-08 KR KR1019950015045A patent/KR0145996B1/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100829032B1 (en) * | 2007-02-26 | 2008-05-16 | (주)대호테크 | Heater block structure |
Also Published As
Publication number | Publication date |
---|---|
KR0145996B1 (en) | 1998-08-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20060420 Year of fee payment: 9 |
|
LAPS | Lapse due to unpaid annual fee |