KR970003849Y1 - Combination structure of substrate and deco-plate of electronic device - Google Patents
Combination structure of substrate and deco-plate of electronic device Download PDFInfo
- Publication number
- KR970003849Y1 KR970003849Y1 KR92017431U KR920017431U KR970003849Y1 KR 970003849 Y1 KR970003849 Y1 KR 970003849Y1 KR 92017431 U KR92017431 U KR 92017431U KR 920017431 U KR920017431 U KR 920017431U KR 970003849 Y1 KR970003849 Y1 KR 970003849Y1
- Authority
- KR
- South Korea
- Prior art keywords
- substrates
- decorative plate
- product body
- plate
- substrate
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
- H05K5/0243—Mechanical details of casings for decorative purposes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
- H05K7/08—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses on perforated boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/12—Resilient or clamping means for holding component to structure
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Connection Of Plates (AREA)
Abstract
내용없음No content
Description
제1도는 (a)는 본 고안의 사시도1 is a perspective view of the present invention (a)
(b)는 본 고안의 조립단면도이다.(b) is an assembled cross-sectional view of the present invention.
제2도는 (a)와 (b)는 종래의 결합장치 조립단면도이다.2 is a cross-sectional view of a conventional coupling device assembly (a) and (b).
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
10 : 전자제품 본체 12 : 장식판 및 기판류10: main body of electronic products 12: decorative plates and substrates
12a : 돌기부 14 : 융착부12a: projection 14: fusion
16 : 걸림턱 18 : 후크편16: engaging jaw 18: hook piece
20 : 결속구 20a : 걸림턱20: binding hole 20a: locking jaw
22 : 걸림홈 24 : 핀홀(pin hole)22: locking groove 24: pin hole
본 고안은 전자제품류의 장식판 및 기판류를 제품본체에 결합시키는 결합구조에 관한 것으로서, 특히 걸림편을 형성하는 결속구를 이용하여 전자제품류의 장식판 또는 기판류를 견고하고 용이하게 결합시키는 전자제품류의 장식과 기판류 결합구조에 관한 것이다.The present invention relates to a coupling structure for coupling decorative plates and substrates of electronic products to the product body, and in particular, it is possible to firmly and easily combine decorative plates or substrates of electronic products by using fasteners forming fastening pieces. The present invention relates to a decoration and a substrate-type coupling structure.
일반적인 종래의 장식판 및 기판류를 전자제품본체에 결합시키는 결합구조를 보면 제품본체에 장식판 및 기판류를 결합후 융착시키는 방법과 걸림턱을 형성하는 제품본체에 끼워 고정결합시키는 구조로 되어있다.In general, the coupling structure for joining the decorative plate and the substrates to the electronic product body is a method of bonding the decorative plate and the substrate to the product body after fusion and the structure to be fixed to the product body to form a locking jaw.
상기와 같은 구조로 이루어지는 종래의 전자제품 장식판 및 기판류의 결합구조는 제2도의 (a)에서 보는 바와 같이 장식판 및 기판류(12)가 제품본체(10)에 결합되어질 위치에 핀홀(24)을 형성하고 장식판 및 기판류(12)에는 제품본체(10)의 핀홀(24)에 결합 시킬 수 있는 돌기부(12a)를 형성하며 장식판 및 기판류(12)에 형성된 돌기부(12a)를 제품본체(10)의 핀홀(24)에 끼운 후 제품본체(10) 안쪽으로 돌출된 장식판 및 기판류(12)의 돌기부(12a)를 융착열에 의해 유착시켜 장식판 및 기판류(12)를 제품본체(10)에 결합시키는 방법과 제2도의 (b)에서 보는 바와 같이 제품본체(l0)에 장식판 및 기판류(12)가 체결될 수 있도록 하는 걸림턱(16)을 본체 안쪽에 형성하고 기판류 및 장식판 및 기판류(12)에는 제품본체(10)의 걸림턱(16)에 체결될 수 있도록 하는 후크편(18)이 형성되어진다.In the coupling structure of the conventional electronic decorative plate and substrates having the structure as described above, as shown in (a) of FIG. 2, the pinhole 24 is positioned at the position where the decorative plate and the substrate 12 are to be coupled to the product body 10. Form a projection 12a which can be coupled to the pinhole 24 of the product body 10 in the decorative plate and the substrates 12, and the projections 12a formed in the decoration plate and the substrates 12 are formed in the product body ( 10) and then the decorative plate and the substrate (12) of the decorative plate protruding into the product body 10 and the projections (12a) of the substrates 12 by the heat of fusion to bond the decorative plate and substrates (12) to the product body (10) As shown in (b) of FIG. 2 and in FIG. 2, the locking projection 16 is formed inside the main body so that the decorative plate and the substrates 12 can be fastened to the product body 10. Substrate 12 is formed with a hook piece 18 to be fastened to the locking step 16 of the product body 10 The.
상기와 같이 구성된 장식판 및 기판류(12)를 제품본체(10)에 끼워넣어 장식판 및 기판류(12)의 후크편(l8)이 제품본체(10)의 걸림턱(16)에 걸려 결합되는 구조로 되는 방법이 있다.The decorative plate and substrates 12 configured as described above are inserted into the product body 10 so that the hook pieces l8 of the decorative plate and substrates 12 are hooked to the engaging jaw 16 of the product body 10. There is a way.
상기와 같은 구조로 이루어진 결합구조중 융착에 의한 방법은 장식판 및 기판류가 제품본체에 완전밀착이 어렵고 융착작업시 독한 가스의 발생으로 작업환경이 저하되어 환경오염의 문제가 있으며, 또한 걸림턱에 의한 방법은 장식판 및 기판류를 제품본체에 결합시 장식판 및 기판류의 후크편이 본체의 외부와 접촉하므로 본체 외부에 흠집이 발생하고 후크편의 장력에 의하여 결합시 무리한 장력에 의해 후크편의 복원이 않되어 결합불량의 문제점이 있었다.The method by fusion of the bonding structure composed of the above structure is difficult to completely adhere the decorative plates and substrates to the product body, and the working environment is degraded due to the generation of poisonous gas during fusion operation, there is a problem of environmental pollution, When the decorative plate and boards are joined to the product body, the hook pieces of the decorative plate and boards come into contact with the outside of the main body. Thus, scratches occur on the outside of the main body and the hook pieces are not restored due to unreasonable tension when combined by the tension of the hook piece. There was a problem of poor coupling.
본 고안은 상기와 같은 문제점을 보완하고져 전자제품류의 장식판 및 기판류를 결합시 결합구를 이용하여 결합을 용이하게 하면서 제품의 품질을 향상시키는 것으로 본 고안을 첨부된 도면과 함께 상세히 설명한다.The present invention will be described in detail with the accompanying drawings to improve the quality of the product to facilitate the coupling by using a coupler when coupling the decorative plate and substrates of the electronic products to the above-described problems.
제1도의 (a)와 (b)에서 보는 바와 같이 통상적으로 전자제품의 본체에 장식판 및 기판류를 끼워 고정시키는 전자제품 장식판 및 기판류의 결합구조에 있어서, 장식판 및 기판류(12)를 체결시킬 수 있는 결속구(20)에 마름모형상의 걸림홈(22)을 갖는 둥근형상의 걸림편(20a)을 형성하여 구성하고 제품본체(10)에는 장식판 및 기판류(12)가 끼워질 수 있도록 하는 결속위치에 핀홀(24)을 형성하여 준다.As shown in (a) and (b) of FIG. 1, the decorative plate and the substrates 12 are fastened in a coupling structure of the decorative plate and the substrates of the electronics in which the decorative plate and the substrates are fixed to the main body of the electronic product. It is formed by forming a round locking piece (20a) having a locking groove 22 of the rhombus shape in the binding hole (20) that can be made and the decorative plate and the substrates (12) can be fitted to the product body (10) A pinhole 24 is formed at the binding position.
또한 장식판 및 기판류(12)에는 돌기부(12a)를 형성하여 상기 돌기부(12a)를 제품본체(10)의 핀홀(24)에 끼운후 제품본체(10) 안쪽으로 돌출된 장식판 및 기판류(12)의 돌기부(12a)에 준비된 결속구(20)의 걸림편(20a) 안에 형성된 마름모형상의 걸림홈(22)에 끼워 장식판 및 기판류(12)를 제품본체(10)에 결합시키는 구조로 된 것으로 상기되어진 결속구(20)는 마름모형상의 걸림홈(22)을 갖는 둥근형상의 걸림편(20a)으로 구성되어진 것으로 제1도의 (b)에서 보는 바와 같이 장식판 및 기판류(12)를 제품본체(10)에 결합시키기 위해 돌기부(12a)와 걸림홈(22)을 맞추어 체결하게 되며 이때 걸림편(20a)은 체결하기 위해 가하는 힘의 방향으로 볼록한 형상이었다가 결속구(20)에 힘을 가하여 제품본체(10)에서 돌출된 돌기부(12a)에 끼우게 되면 상기 걸림편(20a)의 둥근형상은 반대방향으로 형성되고 반대방향으로 형성되어진 상기 걸림편(20a)에 초기 결속구(20)를 끼우던 방향의 힘이 작용하면 걸림편(20a)에 장력이 발생하여 장식판 및 기판류(12)가 제품본체(10)에서 빠지지 않도록 되는 것으로 종래의 유착에 의한 결합시 발생되는 문제점을 해결하여 걸림편에 발생되는 장력에 의해 장식판 및 기판류와 제품본체를 완전히 밀착시킬 수 있게 되었으며 융착시 발생되는 가스가 발생되지 않아 작업환경 및 환경오염의 문제점을 해결하게 되었다.In addition, the decorative plate and substrates 12 are provided with protrusions 12a to insert the protrusions 12a into the pinholes 24 of the product body 10, and then the decorative plates and substrates 12 protruding into the product body 10. It is designed to couple the decorative plate and the substrates 12 to the product body 10 by inserting into the rhombus engaging groove 22 formed in the engaging piece 20a of the binding hole 20 prepared in the projection 12a of The binding hole 20 described above is composed of a round locking piece 20a having a locking groove 22 of a rhombus shape, and as shown in FIG. The protrusion 12a and the locking groove 22 are fitted together to be coupled to the 10, and the locking piece 20a has a convex shape in the direction of the force applied to the fastening, and then applies a force to the binding hole 20. When it is inserted into the projection 12a protruding from the product body 10, the rounded shape of the engaging piece 20a is opposite When the force in the direction in which the initial binding port 20 was inserted into the engaging piece 20a formed in the opposite direction and formed in the opposite direction acts, tension is generated in the engaging piece 20a, and the decorative plate and the substrates 12 are the product body. (10) solved the problem caused by the conventional coalescing to prevent it from coming out to be able to completely adhere to the decorative plate, substrates and the product body by the tension generated on the engaging piece and the gas generated during fusion It did not solve the problem of working environment and environmental pollution.
또한 걸림턱에 의한 결합시 본체 외부에 생기는 홈집이 발생되지 않고 후크편의 복원불량으로 인한 형합불량이 해결되었으며, 상기 결속구를 이용하게 되어 별개의 고정구를 이용하여 체결하는 부품류에 적용이 가능하게 되었다.In addition, when the coupling due to the locking jaw does not generate grooves generated outside the main body, the mold failure due to the restoration of the hook piece is solved, and it is possible to apply to the parts to be fastened by using a separate fastener by using the binding tool. .
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR92017431U KR970003849Y1 (en) | 1992-09-15 | 1992-09-15 | Combination structure of substrate and deco-plate of electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR92017431U KR970003849Y1 (en) | 1992-09-15 | 1992-09-15 | Combination structure of substrate and deco-plate of electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR940008974U KR940008974U (en) | 1994-04-21 |
| KR970003849Y1 true KR970003849Y1 (en) | 1997-04-24 |
Family
ID=19340055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR92017431U KR970003849Y1 (en) | 1992-09-15 | 1992-09-15 | Combination structure of substrate and deco-plate of electronic device |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR970003849Y1 (en) |
-
1992
- 1992-09-15 KR KR92017431U patent/KR970003849Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR940008974U (en) | 1994-04-21 |
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