KR970001147A - Lead Wire Automatic Bending Device - Google Patents
Lead Wire Automatic Bending Device Download PDFInfo
- Publication number
- KR970001147A KR970001147A KR1019950018222A KR19950018222A KR970001147A KR 970001147 A KR970001147 A KR 970001147A KR 1019950018222 A KR1019950018222 A KR 1019950018222A KR 19950018222 A KR19950018222 A KR 19950018222A KR 970001147 A KR970001147 A KR 970001147A
- Authority
- KR
- South Korea
- Prior art keywords
- cylinder
- lead wire
- fixed
- plate
- automatic bending
- Prior art date
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title claims abstract description 14
- 238000005452 bending Methods 0.000 title claims abstract description 11
- 230000003993 interaction Effects 0.000 claims abstract 4
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F1/00—Bending wire other than coiling; Straightening wire
- B21F1/004—Bending wire other than coiling; Straightening wire by means of press-type tooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F11/00—Cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F23/00—Feeding wire in wire-working machines or apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0092—Treatment of the terminal leads as a separate operation
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Wire Processing (AREA)
Abstract
본 발명은 기판과 같은 전자부품에 장착되는 리드선을 자동으로 밴딩(Bending)시켜주는 장치에 관한 것으로써, 로울러(5)(5-1)의 안내를 받아 유입된 리드선(40)을 실린더(6)(10)(16)의 상호작용에 의해 이송시키도록하는 이송부(1-1)와, 이송유입된 리드선(4)의 선행부가 실린더(29)의 펀치(3)에 연접되어질때 카터(23)(24)에 의해 적정길이로 절단시키는 절단부(1-2)와, 절단된 리드선(40)의 선행부를 실린더(26)(29)(32)의 상호작용에 의해 2단절곡시키도록 하는 절곡부(1-3)로 된 것인 바, 리드선(40)의 유입과 컷팅 및 2단절곡을 자동으로 실시하므로 제품이 균일하여 품질이 양호하고 생산성이 향상되며, 특히 자동화라인에 적용할 수 있다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for automatically bending a lead wire mounted on an electronic component such as a substrate. The present invention relates to a cylinder (6) for introducing a lead wire (40) guided by a roller (5) (5-1). (1) for conveying by the interaction of (10) and (16) and when the leading part of the feed lead (4) is connected to the punch (3) of the cylinder (29), the carter (23) Bending to cut the cutting part 1-2 and cutting the leading part of the cut lead wire 40 by the interaction of the cylinders 26, 29 and 32 by the (24). It is a part (1-3), the inflow and cutting of the lead wire 40 and the two-stage bending automatically, so that the product is uniform, the quality is good and the productivity is improved, in particular can be applied to the automation line .
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제1도는 밴딩된 리드선을 사용하는 상태의 일예시도, 제2도는 본 발명에 따른 자동밴딩장치에서 이송부를 보인 사시도, 제3도는 (가)(나)도는 본 발명에 따른 자동밴딩장치의 평면도 및 정면도.1 is an exemplary view of a state using a bent lead wire, Figure 2 is a perspective view showing a transfer unit in the automatic bending device according to the present invention, Figure 3 (a) (b) is a plan view of the automatic bending device according to the present invention And front view.
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950018222A KR0168591B1 (en) | 1995-06-29 | 1995-06-29 | Lead wire bending device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950018222A KR0168591B1 (en) | 1995-06-29 | 1995-06-29 | Lead wire bending device |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970001147A true KR970001147A (en) | 1997-01-21 |
KR0168591B1 KR0168591B1 (en) | 1999-01-15 |
Family
ID=19418800
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950018222A KR0168591B1 (en) | 1995-06-29 | 1995-06-29 | Lead wire bending device |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR0168591B1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20240020102A (en) | 2022-08-05 | 2024-02-14 | 권영민 | unmanned automatic bending device |
-
1995
- 1995-06-29 KR KR1019950018222A patent/KR0168591B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR0168591B1 (en) | 1999-01-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
LAPS | Lapse due to unpaid annual fee |