KR960702943A - Logical THREE-DIMENSIONAL INTERCONNECTIONS BETWEEN INTEGRATED CIRCUIT CHIPS USING A TWO-DIMENSIONAL MULTI-CHIP MODULE PACKAGE - Google Patents

Logical THREE-DIMENSIONAL INTERCONNECTIONS BETWEEN INTEGRATED CIRCUIT CHIPS USING A TWO-DIMENSIONAL MULTI-CHIP MODULE PACKAGE

Info

Publication number
KR960702943A
KR960702943A KR1019950705101A KR19950705101A KR960702943A KR 960702943 A KR960702943 A KR 960702943A KR 1019950705101 A KR1019950705101 A KR 1019950705101A KR 19950705101 A KR19950705101 A KR 19950705101A KR 960702943 A KR960702943 A KR 960702943A
Authority
KR
South Korea
Prior art keywords
dimensional
logical
integrated circuit
chip module
circuit chips
Prior art date
Application number
KR1019950705101A
Other languages
Korean (ko)
Other versions
KR100360074B1 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of KR960702943A publication Critical patent/KR960702943A/en
Application granted granted Critical
Publication of KR100360074B1 publication Critical patent/KR100360074B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
    • H03K19/173—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components
    • H03K19/177—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components arranged in matrix form
    • H03K19/17704—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components arranged in matrix form the logic functions being realised by the interconnection of rows and columns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5386—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0652—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
KR1019950705101A 1994-03-15 1995-01-20 Logical three-dimensional interconnection between integrated circuit chips using two-dimensional multichip module packages KR100360074B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US21314694A 1994-03-15 1994-03-15
US08/213,146 1994-03-15

Publications (2)

Publication Number Publication Date
KR960702943A true KR960702943A (en) 1996-05-23
KR100360074B1 KR100360074B1 (en) 2003-01-24

Family

ID=22793918

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950705101A KR100360074B1 (en) 1994-03-15 1995-01-20 Logical three-dimensional interconnection between integrated circuit chips using two-dimensional multichip module packages

Country Status (3)

Country Link
EP (1) EP0698294A1 (en)
KR (1) KR100360074B1 (en)
WO (1) WO1995025348A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5894565A (en) * 1996-05-20 1999-04-13 Atmel Corporation Field programmable gate array with distributed RAM and increased cell utilization
US6407576B1 (en) 1999-03-04 2002-06-18 Altera Corporation Interconnection and input/output resources for programmable logic integrated circuit devices
EP1705798B1 (en) * 1999-03-04 2015-10-21 Altera Corporation Interconnection and input/output resources for programmable logic integrated circuit devices
US6351144B1 (en) * 1999-07-15 2002-02-26 Altera Corporation Programmable logic device with unified cell structure including signal interface bumps
WO2001093426A1 (en) * 2000-05-30 2001-12-06 Koninklijke Philips Electronics N.V. Integrated circuit with a matrix of programmable logic cells

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02161754A (en) * 1988-12-14 1990-06-21 Nec Corp Semiconductor integrated circuit of building block system
DE69004414T2 (en) * 1989-09-22 1994-02-24 Renishaw Plc MODULAR CLAMPING SYSTEM FOR MACHINE TOOLS.
JP3002512B2 (en) * 1990-09-10 2000-01-24 株式会社日立製作所 Integrated circuit device
US5432708A (en) * 1992-10-08 1995-07-11 Aptix Corporation Multichip module integrated circuit device having maximum input/output capability

Also Published As

Publication number Publication date
WO1995025348A1 (en) 1995-09-21
EP0698294A1 (en) 1996-02-28
KR100360074B1 (en) 2003-01-24

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