KR960035639U - P.l.c.c 반도체 패키지의 리드포밍장치 - Google Patents

P.l.c.c 반도체 패키지의 리드포밍장치

Info

Publication number
KR960035639U
KR960035639U KR2019950007967U KR19950007967U KR960035639U KR 960035639 U KR960035639 U KR 960035639U KR 2019950007967 U KR2019950007967 U KR 2019950007967U KR 19950007967 U KR19950007967 U KR 19950007967U KR 960035639 U KR960035639 U KR 960035639U
Authority
KR
South Korea
Prior art keywords
semiconductor package
forming device
lead forming
package lead
semiconductor
Prior art date
Application number
KR2019950007967U
Other languages
English (en)
Other versions
KR0120548Y1 (ko
Inventor
이영화
박종문
Original Assignee
아남산업주식회사
아남정공주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아남산업주식회사, 아남정공주식회사 filed Critical 아남산업주식회사
Priority to KR2019950007967U priority Critical patent/KR0120548Y1/ko
Publication of KR960035639U publication Critical patent/KR960035639U/ko
Application granted granted Critical
Publication of KR0120548Y1 publication Critical patent/KR0120548Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR2019950007967U 1995-04-19 1995-04-19 P.l.c.c 반도체 패키지의 리드포밍장치 KR0120548Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950007967U KR0120548Y1 (ko) 1995-04-19 1995-04-19 P.l.c.c 반도체 패키지의 리드포밍장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950007967U KR0120548Y1 (ko) 1995-04-19 1995-04-19 P.l.c.c 반도체 패키지의 리드포밍장치

Publications (2)

Publication Number Publication Date
KR960035639U true KR960035639U (ko) 1996-11-21
KR0120548Y1 KR0120548Y1 (ko) 1998-07-01

Family

ID=19411616

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950007967U KR0120548Y1 (ko) 1995-04-19 1995-04-19 P.l.c.c 반도체 패키지의 리드포밍장치

Country Status (1)

Country Link
KR (1) KR0120548Y1 (ko)

Also Published As

Publication number Publication date
KR0120548Y1 (ko) 1998-07-01

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