KR960032760U - Package pickup device - Google Patents

Package pickup device

Info

Publication number
KR960032760U
KR960032760U KR2019950004627U KR19950004627U KR960032760U KR 960032760 U KR960032760 U KR 960032760U KR 2019950004627 U KR2019950004627 U KR 2019950004627U KR 19950004627 U KR19950004627 U KR 19950004627U KR 960032760 U KR960032760 U KR 960032760U
Authority
KR
South Korea
Prior art keywords
pickup device
package pickup
package
pickup
Prior art date
Application number
KR2019950004627U
Other languages
Korean (ko)
Other versions
KR0121170Y1 (en
Inventor
장정상
Original Assignee
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업주식회사 filed Critical 현대전자산업주식회사
Priority to KR2019950004627U priority Critical patent/KR0121170Y1/en
Publication of KR960032760U publication Critical patent/KR960032760U/en
Application granted granted Critical
Publication of KR0121170Y1 publication Critical patent/KR0121170Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
KR2019950004627U 1995-03-16 1995-03-16 Package pick-up machine KR0121170Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950004627U KR0121170Y1 (en) 1995-03-16 1995-03-16 Package pick-up machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950004627U KR0121170Y1 (en) 1995-03-16 1995-03-16 Package pick-up machine

Publications (2)

Publication Number Publication Date
KR960032760U true KR960032760U (en) 1996-10-24
KR0121170Y1 KR0121170Y1 (en) 1998-07-01

Family

ID=19409356

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950004627U KR0121170Y1 (en) 1995-03-16 1995-03-16 Package pick-up machine

Country Status (1)

Country Link
KR (1) KR0121170Y1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100473582B1 (en) * 2002-10-15 2005-03-08 주식회사 신한오피에스 Angle auto punching system for steel tower manufacture

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102521632B1 (en) * 2016-05-02 2023-04-13 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 Method of pick and place

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100473582B1 (en) * 2002-10-15 2005-03-08 주식회사 신한오피에스 Angle auto punching system for steel tower manufacture

Also Published As

Publication number Publication date
KR0121170Y1 (en) 1998-07-01

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
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Payment date: 20040326

Year of fee payment: 7

LAPS Lapse due to unpaid annual fee