KR960032688A

KR960032688A - Chip cutting method and device

Info

Publication number: KR960032688A
Application number: KR1019950001995A
Authority: KR
Inventors: 이재호
Original assignee: 김광호; 삼성전자 주식회사
Priority date: 1995-02-04
Filing date: 1995-02-04
Publication date: 1996-09-17

Abstract

메탈 패턴이 형성된 웨이퍼와, 이 웨이퍼로부터 칩을 절단하는 칩 절단 방법 및 절단 장치가 상기 웨이퍼를 캐비티 방향인 Y축 방향으로 상기 메탈 패턴 사이에 이들을 구획하는 구획패턴을 형성하고 상기 웨이퍼의 가장자리의 매탈 페턴 사이에 X축 방향으로 스크래치를 형성하며, 상기 제1단계에 의해 형성된 상기 메탈 사이를 구획하는 패턴에 소정의 간격 또는 연속적으로 스크래치를 형성하고, 상기 웨이퍼를 X축 방향으로 절단하여 바를 제작하며, 상기 제4단계에 의해 제작된 바를 소정의 간격으로 가압하여 Y축 방향으로 스크래치된 부분을 절단하는 것에 특징이 있으며, 이는 절단에 따른 생산성의 향상을 도모할 수 있는 이점을 가진다.A wafer having a metal pattern formed thereon, and a chip cutting method and a cutting device for cutting a chip from the wafer form a partition pattern for partitioning the wafer between the metal patterns in the Y-axis direction in the cavity direction and embedding the edges of the wafer. Scratch is formed in the X-axis direction between the patterns, and scratches are formed at predetermined intervals or continuously in the pattern partitioning the metal formed by the first step, and the bar is cut by cutting the wafer in the X-axis direction. , By pressing the bar produced by the fourth step at a predetermined interval to cut a portion scratched in the Y-axis direction, which has an advantage of improving productivity due to cutting.

Description

Chip cutting method and device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제4도 내지 제7도는 본 발명에 따른 칩 절단 방법을 순차적으로 나타내 보인 평면도.4 to 7 are plan views showing sequentially the chip cutting method according to the present invention.

Claims

A method of cutting a wafer having a metal pattern formed on an upper surface thereof, and a chip cutting method for cutting a chip from the wafer, the method comprising: forming a partition pattern for partitioning the wafer between the metal patterns in the Y-axis direction in the cavity direction; And forming a scratch in the X-axis direction between the metal patterns of the edges of the wafer, and forming scratches at predetermined intervals or continuously in a partition pattern partitioning the metal formed by the first step. Step 3, a fourth step of cutting the wafer in the X-axis direction to produce a bar, and a fifth step of pressing the bar produced by the fourth step at a predetermined interval to cut a portion scratched in the Y-axis direction Chip cutting method comprising the.

The chip cutting method according to claim 1, wherein in the fifth step, the cutting by pressing the bar presses the partition pattern so that the weak part of the bar is cut.

A roller member formed in a longitudinal direction on the outer circumferential surface thereof and provided with a pressing portion for protruding from the outer circumferential surface to discontinuously press the bar cut from the wafer; and a support member for rotatably installing the rotating shaft of the roller member and supporting the roller member. Scratch is formed between the metal pattern by the pressing portion of the rotating roller member, the chip cutting device characterized in that to produce a chip by cutting the bar cut from the wafer.

The chip cutting device according to claim 2, wherein the return rod-shaped protrusion formed in the longitudinal direction on the outer peripheral surface of the roller member is continuously formed along the outer peripheral surface of the roller member.

5. The chip cutting device according to claim 4, wherein the pitch of the protrusions is formed equal to the scratch pitch of the metal pattern of the bar.

※ Note: The disclosure is based on the initial application.