KR960032666A - Transfer Method of Printed Board - Google Patents

Transfer Method of Printed Board Download PDF

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Publication number
KR960032666A
KR960032666A KR1019950002586A KR19950002586A KR960032666A KR 960032666 A KR960032666 A KR 960032666A KR 1019950002586 A KR1019950002586 A KR 1019950002586A KR 19950002586 A KR19950002586 A KR 19950002586A KR 960032666 A KR960032666 A KR 960032666A
Authority
KR
South Korea
Prior art keywords
transfer
printed board
printed
transferring
conveyor
Prior art date
Application number
KR1019950002586A
Other languages
Korean (ko)
Other versions
KR0155450B1 (en
Inventor
조국렬
Original Assignee
김규용
주식회사 덕우인터내셔널
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=19408025&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR960032666(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 김규용, 주식회사 덕우인터내셔널 filed Critical 김규용
Priority to KR1019950002586A priority Critical patent/KR0155450B1/en
Publication of KR960032666A publication Critical patent/KR960032666A/en
Application granted granted Critical
Publication of KR0155450B1 publication Critical patent/KR0155450B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

본 발명은 프린트 기판의 이송방법에 관한 것으로서, 공급대로부터 공급이송장치에 프린트 기판이 이송되는 한편, 인출이송장치로부터 인출대로 프린트 기판이 이송되는 전자부품 삽입기에 있어서, 삽입장치(51)의 콘베어(63)에 의해 상기 공급이송장치(53)로부터 상기 삽입장치(51)에 프린트 기판(Pa)을 이송시키는 제1이송공정과, 상기 삽입장치(51)의 콘베어(63)에 의해 상기 삽입장치(51)로부터 상기 인출이송장치(55)에 프린트 기판(Pb)을 이송시키는 제2이송공정으로 이루어지는 것을 특징으로 하며, 이와 같은 프린트 기판의 이송방법에 의하면, 상기 프린트 기판의 손상 및 불량을 방지함과 동시에 생산성을 향상시킬 수 있다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of transferring a printed board, comprising: a conveyor of an inserting device (51) in an electronic part inserter in which a printed board is transported from a supply stand to a supply transport device, and a printed board is transported from a drawer transport device to a drawer. A first transfer step of transferring a printed circuit board (Pa) from the supply transfer device (53) to the insertion device (51) by (63), and the insertion device by the conveyor (63) of the insertion device (51). And a second transfer step of transferring the printed board Pb from the 51 to the takeout and transfer device 55. According to the transfer method of the printed board, damage and defects of the printed board can be prevented. At the same time, productivity can be improved.

Description

프린트 기판의 이송방법Transfer Method of Printed Board

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제4도는 본 발명의 일실시예에 의한 프린트 기판의 이송방법의 적용된 전자부품 삽입기를 나타내는 정면구성도4 is a front configuration diagram showing an electronic component inserter applied to a method of transferring a printed board according to an embodiment of the present invention.

Claims (3)

공급대로부터 공급이송장치에 프린트 기판이 이송되는 한편, 인출이송장치로부터 인출대로 프린트 기판이 이송되는 전자부품 삽입기에 있어서, 삽입장치(51)의 콘베어(63)에 의해 상기 공급이송장치(53)로부터 상기 삽입장치(51)에 프린트 기판(Pa)을 이송시키는 제1이송공정과, 상기 삽입장치(51)의 콘베어(63)에 의해 상기 삽입장치(51)로부터 상기 인출이송장치(55)에 프린트 기판(Pb)을 이송시키는 제2이송공정으로 이루어지는 것을 특징으로 하는 프린트 기판의 이송방법In the electronic component inserter in which the printed board is transferred from the supply stand to the feed transfer device, while the printed board is transferred from the takeout and transfer device to the withdrawal unit, the feed transfer device 53 is carried out by the conveyor 63 of the inserting device 51. And a first transfer step of transferring the printed circuit board Pa to the insertion apparatus 51 from the insertion apparatus 51 to the takeout and transfer apparatus 55 by the conveyor 63 of the insertion apparatus 51. A transfer method of a printed board comprising a second transfer step of transferring the printed board Pb. 제1항에 있어서, 상기 공급이송장치(53)와 삽입장치(51) 및 인출이송장치(55)는 서로 하나로 연결되어 한 개의 콘베어에 의해 프린트 기판(Pa, Pb)을 이송시키는 것을 특징으로 하는 프린트 기판의 이송방법The method of claim 1, wherein the feed transfer device 53, the insertion device 51 and the take-out and transfer device 55 is connected to each other to transfer the printed boards (Pa, Pb) by a single conveyor Transfer Method of Printed Board 제1항에 있어서, 상기 공급이송장치(53)와 인출이송장치(55)의 각각에서는 실린더 또는 콘베어에 의해 프린트 기판(Pa, Pb)을 이송시키는 것을 특징으로 하는 프린트 기판의 이송방법The method of transferring a printed circuit board according to claim 1, wherein each of the supply and transfer apparatuses 53 and the take-out and transfer apparatus 55 transfers the printed boards Pa and Pb by a cylinder or a conveyor. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950002586A 1995-02-13 1995-02-13 Transferring method for printed circuit board KR0155450B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950002586A KR0155450B1 (en) 1995-02-13 1995-02-13 Transferring method for printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950002586A KR0155450B1 (en) 1995-02-13 1995-02-13 Transferring method for printed circuit board

Publications (2)

Publication Number Publication Date
KR960032666A true KR960032666A (en) 1996-09-17
KR0155450B1 KR0155450B1 (en) 1998-12-01

Family

ID=19408025

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950002586A KR0155450B1 (en) 1995-02-13 1995-02-13 Transferring method for printed circuit board

Country Status (1)

Country Link
KR (1) KR0155450B1 (en)

Also Published As

Publication number Publication date
KR0155450B1 (en) 1998-12-01

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