KR960026534A - Chip Dispersion Alignment - Google Patents

Chip Dispersion Alignment Download PDF

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Publication number
KR960026534A
KR960026534A KR1019940040328A KR19940040328A KR960026534A KR 960026534 A KR960026534 A KR 960026534A KR 1019940040328 A KR1019940040328 A KR 1019940040328A KR 19940040328 A KR19940040328 A KR 19940040328A KR 960026534 A KR960026534 A KR 960026534A
Authority
KR
South Korea
Prior art keywords
chip
cam
rocking
chips
jig
Prior art date
Application number
KR1019940040328A
Other languages
Korean (ko)
Other versions
KR0167804B1 (en
Inventor
한윤흥
Original Assignee
이형도
삼성전기 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이형도, 삼성전기 주식회사 filed Critical 이형도
Priority to KR1019940040328A priority Critical patent/KR0167804B1/en
Publication of KR960026534A publication Critical patent/KR960026534A/en
Application granted granted Critical
Publication of KR0167804B1 publication Critical patent/KR0167804B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Feeding Of Articles To Conveyors (AREA)

Abstract

칩 분산 정렬장치가 개시되는바, 이는 칩들을 상·하, 좌·우로 요동시키면서 회전되는 요동부재와, 이 요동 부재를 구비하는 캠과 캠 폴로워를 구비한 것으로서, 캠과 캠 폴로워에 의한 상·하, 좌·우 운동이 칩들을 가지런히 하게 함으로써 사람이 일일이 칩을 분산 정렬하는 것에 비해 작업시간을 훨씬 경감시킬 수 있어 제품의 생산량을 향상시킬 수 있는 것이다.A chip dispersing alignment apparatus is disclosed, which includes a rocking member that rotates while swinging chips up, down, left, and right, a cam and a cam follower including the rocking member, and the cam and cam follower. The up, down, left and right movements help to keep the chips aligned, which can reduce the working time much more than humans sorting the chips.

Description

칩 분산 정렬장치Chip Dispersion Alignment

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 이 발명에 따른 칩 분산 정렬장치를 개략적으로 나타낸 사시도, 제2도는 제1도에 도시된 요동부재의 단면도이다.1 is a perspective view schematically showing the chip dispersing alignment device according to the present invention, and FIG. 2 is a cross-sectional view of the rocking member shown in FIG.

Claims (2)

벌크상태의 칩들을 적재한 지그를 지지하고, 상기 지그를 좌·우, 상·하로 요동시키면서 회전시키기 위한 요동부재와; 상기 요동되는 칩의 상면과 접촉되어 상기 칩을 가지런히 정렬하기 위한 평활용 커버 및; 상기 요동부재를 구동하기 위한 구동수단으로 구성하여서 된 칩 분산 정렬장치.A rocking member for supporting a jig in which chips in a bulk state are loaded, and rotating the jig while rocking the jig left, right, up and down; A smoothing cover in contact with an upper surface of the rocking chip for aligning the chip; Chip dispersion alignment device composed of a drive means for driving the rocking member. 제1항에 있어서, 상기 요동부재 구동수단은 구동원에 의해 회전되는 편심캠과 상기 캠과 계합되어 상·하, 좌·우 요동되면서 회전되는 캠 폴로워로 구성하여서 된 칩 분산 정렬장치.The chip dispersing alignment device according to claim 1, wherein the oscillating member driving means comprises an eccentric cam rotated by a driving source and a cam follower rotated while swinging up, down, left and right in engagement with the cam. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940040328A 1994-12-31 1994-12-31 Chip tray KR0167804B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940040328A KR0167804B1 (en) 1994-12-31 1994-12-31 Chip tray

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940040328A KR0167804B1 (en) 1994-12-31 1994-12-31 Chip tray

Publications (2)

Publication Number Publication Date
KR960026534A true KR960026534A (en) 1996-07-22
KR0167804B1 KR0167804B1 (en) 1999-02-01

Family

ID=19406110

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940040328A KR0167804B1 (en) 1994-12-31 1994-12-31 Chip tray

Country Status (1)

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KR (1) KR0167804B1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100363737B1 (en) * 2000-04-18 2002-12-06 동양반도체장비 주식회사 Material alignment device of marking apparatus for semiconductor
KR101305311B1 (en) * 2012-05-03 2013-09-06 주식회사 선일기연 Arrangement and fixing apparatus of carrier-plate for semiconductor

Also Published As

Publication number Publication date
KR0167804B1 (en) 1999-02-01

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