KR960025507U - 리드프레임용 메가진 - Google Patents
리드프레임용 메가진Info
- Publication number
- KR960025507U KR960025507U KR2019940035194U KR19940035194U KR960025507U KR 960025507 U KR960025507 U KR 960025507U KR 2019940035194 U KR2019940035194 U KR 2019940035194U KR 19940035194 U KR19940035194 U KR 19940035194U KR 960025507 U KR960025507 U KR 960025507U
- Authority
- KR
- South Korea
- Prior art keywords
- mega
- lead frames
- frames
- lead
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019940035194U KR0128232Y1 (ko) | 1994-12-22 | 1994-12-22 | 리드프레임용 메가진 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019940035194U KR0128232Y1 (ko) | 1994-12-22 | 1994-12-22 | 리드프레임용 메가진 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR960025507U true KR960025507U (ko) | 1996-07-22 |
KR0128232Y1 KR0128232Y1 (ko) | 1998-10-15 |
Family
ID=19402306
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019940035194U KR0128232Y1 (ko) | 1994-12-22 | 1994-12-22 | 리드프레임용 메가진 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR0128232Y1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100353405B1 (ko) * | 2000-01-12 | 2002-09-18 | 주식회사 하이닉스반도체 | 반도체 리드프레임 적재용 메가진 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101656465B1 (ko) * | 2015-06-10 | 2016-09-22 | 주식회사 에스에프에이반도체 | 매거진 고정 블럭 |
-
1994
- 1994-12-22 KR KR2019940035194U patent/KR0128232Y1/ko not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100353405B1 (ko) * | 2000-01-12 | 2002-09-18 | 주식회사 하이닉스반도체 | 반도체 리드프레임 적재용 메가진 |
Also Published As
Publication number | Publication date |
---|---|
KR0128232Y1 (ko) | 1998-10-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20050718 Year of fee payment: 8 |
|
LAPS | Lapse due to unpaid annual fee |