KR960025356U - Wafer charged particle removal device - Google Patents

Wafer charged particle removal device

Info

Publication number
KR960025356U
KR960025356U KR2019940037665U KR19940037665U KR960025356U KR 960025356 U KR960025356 U KR 960025356U KR 2019940037665 U KR2019940037665 U KR 2019940037665U KR 19940037665 U KR19940037665 U KR 19940037665U KR 960025356 U KR960025356 U KR 960025356U
Authority
KR
South Korea
Prior art keywords
charged particle
removal device
particle removal
wafer charged
wafer
Prior art date
Application number
KR2019940037665U
Other languages
Korean (ko)
Other versions
KR0128246Y1 (en
Inventor
구자붕
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019940037665U priority Critical patent/KR0128246Y1/en
Publication of KR960025356U publication Critical patent/KR960025356U/en
Application granted granted Critical
Publication of KR0128246Y1 publication Critical patent/KR0128246Y1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/3244Gas supply means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR2019940037665U 1994-12-29 1994-12-29 Apparatus for removing charged particle of wafer KR0128246Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940037665U KR0128246Y1 (en) 1994-12-29 1994-12-29 Apparatus for removing charged particle of wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940037665U KR0128246Y1 (en) 1994-12-29 1994-12-29 Apparatus for removing charged particle of wafer

Publications (2)

Publication Number Publication Date
KR960025356U true KR960025356U (en) 1996-07-22
KR0128246Y1 KR0128246Y1 (en) 1998-12-01

Family

ID=19404093

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940037665U KR0128246Y1 (en) 1994-12-29 1994-12-29 Apparatus for removing charged particle of wafer

Country Status (1)

Country Link
KR (1) KR0128246Y1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100810892B1 (en) * 2003-12-17 2008-03-07 동부일렉트로닉스 주식회사 Dust Collector in Process Chamber

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100810892B1 (en) * 2003-12-17 2008-03-07 동부일렉트로닉스 주식회사 Dust Collector in Process Chamber

Also Published As

Publication number Publication date
KR0128246Y1 (en) 1998-12-01

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20040719

Year of fee payment: 7

LAPS Lapse due to unpaid annual fee