KR960022832A - Polyamide film composition - Google Patents

Polyamide film composition Download PDF

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Publication number
KR960022832A
KR960022832A KR1019940033772A KR19940033772A KR960022832A KR 960022832 A KR960022832 A KR 960022832A KR 1019940033772 A KR1019940033772 A KR 1019940033772A KR 19940033772 A KR19940033772 A KR 19940033772A KR 960022832 A KR960022832 A KR 960022832A
Authority
KR
South Korea
Prior art keywords
film composition
polyamide film
aliphatic
average particle
particle diameter
Prior art date
Application number
KR1019940033772A
Other languages
Korean (ko)
Other versions
KR0143363B1 (en
Inventor
송기상
Original Assignee
이웅열
주식회사 코오롱
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이웅열, 주식회사 코오롱 filed Critical 이웅열
Priority to KR1019940033772A priority Critical patent/KR0143363B1/en
Publication of KR960022832A publication Critical patent/KR960022832A/en
Application granted granted Critical
Publication of KR0143363B1 publication Critical patent/KR0143363B1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/54—Inorganic substances
    • C08L2666/58—SiO2 or silicates

Abstract

지방족 또는 방향족 디아민, 디카르본산, 아미노 애시드를 포함하는 폴리아미드 필름 조성물에 있어서, 평균 입경 0.5~10㎛, 흡유량 200㎖/100g 이하인 이산화규소를 0.01~2.0wt% 더욱 포함하는 것을 특징으로 하는 폴리아미드 필름 조성물은 슬립성이 우수하며 따라서 고속 생산성 및 슬리팅, 인쇄, 라미네이트 등의 후가공이 용이하며 파단이 발생하지 않아 조업성이 우수한 폴리아미드 필름 조성물이다.A polyamide film composition comprising an aliphatic or aromatic diamine, dicarboxylic acid and amino acid, the polyamide film composition comprising 0.01 to 2.0 wt% of silicon dioxide having an average particle diameter of 0.5 to 10 µm and an oil absorption amount of 200 ml / 100 g or less. The amide film composition is a polyamide film composition which is excellent in slip property, and thus has high productivity and easy post-processing such as slitting, printing, and lamination, and does not cause breakage.

Description

폴리아미드 필름 조성물Polyamide film composition

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

Claims (1)

지방족 또는 방향족 디아민, 디카르본산, 아미노 애시드를 포함하는 폴리아미드 필름 조성물에 있어서, 평균 입경 0.5~10㎛, 흡유량 200㎖/100g 이하인 이산화규소를 0.01~2.0wt% 더욱 포함하는 것을 특징으로 하는 폴리아미드 필름.A polyamide film composition comprising an aliphatic or aromatic diamine, dicarboxylic acid and amino acid, the polyamide film composition comprising 0.01 to 2.0 wt% of silicon dioxide having an average particle diameter of 0.5 to 10 µm and an oil absorption amount of 200 ml / 100 g or less. Amide film. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940033772A 1994-12-12 1994-12-12 Polyamide film composition KR0143363B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940033772A KR0143363B1 (en) 1994-12-12 1994-12-12 Polyamide film composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940033772A KR0143363B1 (en) 1994-12-12 1994-12-12 Polyamide film composition

Publications (2)

Publication Number Publication Date
KR960022832A true KR960022832A (en) 1996-07-18
KR0143363B1 KR0143363B1 (en) 1998-07-15

Family

ID=19401080

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940033772A KR0143363B1 (en) 1994-12-12 1994-12-12 Polyamide film composition

Country Status (1)

Country Link
KR (1) KR0143363B1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100317906B1 (en) * 2000-02-22 2001-12-22 홍원기 Building Anchoring Method by friction and its design method
KR100313721B1 (en) * 1998-11-26 2001-12-28 김징완 Method for designing synthetic underground retaining wall by temporary soil protection structure and working process of underground retaining wall of structure
KR100358600B1 (en) * 1995-11-02 2003-01-29 주식회사 코오롱 Process for preparing polyamide mat film

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100358600B1 (en) * 1995-11-02 2003-01-29 주식회사 코오롱 Process for preparing polyamide mat film
KR100313721B1 (en) * 1998-11-26 2001-12-28 김징완 Method for designing synthetic underground retaining wall by temporary soil protection structure and working process of underground retaining wall of structure
KR100317906B1 (en) * 2000-02-22 2001-12-22 홍원기 Building Anchoring Method by friction and its design method

Also Published As

Publication number Publication date
KR0143363B1 (en) 1998-07-15

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