KR960016831B1 - A method for manufacturing semiconductor device - Google Patents

A method for manufacturing semiconductor device Download PDF

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Publication number
KR960016831B1
KR960016831B1 KR93024621A KR930024621A KR960016831B1 KR 960016831 B1 KR960016831 B1 KR 960016831B1 KR 93024621 A KR93024621 A KR 93024621A KR 930024621 A KR930024621 A KR 930024621A KR 960016831 B1 KR960016831 B1 KR 960016831B1
Authority
KR
South Korea
Prior art keywords
semiconductor device
manufacturing semiconductor
etch
sog
layer
Prior art date
Application number
KR93024621A
Other languages
Korean (ko)
Other versions
KR950015639A (en
Inventor
Jang-Bin Lim
Jung-Inn Hong
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Priority to KR93024621A priority Critical patent/KR960016831B1/en
Publication of KR950015639A publication Critical patent/KR950015639A/en
Application granted granted Critical
Publication of KR960016831B1 publication Critical patent/KR960016831B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76819—Smoothing of the dielectric

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Element Separation (AREA)

Abstract

The method is for improving the reliability of a semiconductor device by solving the problem of the lifting phenomenon in the planarizing insulator. The method comprises the steps of: forming a SOG(Spin-On-Glass) layer(105) on top of a semiconductor substrate(101) having a not-plane surface; an etch-back of the SOG layer(105); and removing an unnecessary polymer(106) formed on the surface by the etch-back process using O2/CHF3 gas.
KR93024621A 1993-11-18 1993-11-18 A method for manufacturing semiconductor device KR960016831B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR93024621A KR960016831B1 (en) 1993-11-18 1993-11-18 A method for manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR93024621A KR960016831B1 (en) 1993-11-18 1993-11-18 A method for manufacturing semiconductor device

Publications (2)

Publication Number Publication Date
KR950015639A KR950015639A (en) 1995-06-17
KR960016831B1 true KR960016831B1 (en) 1996-12-21

Family

ID=19368417

Family Applications (1)

Application Number Title Priority Date Filing Date
KR93024621A KR960016831B1 (en) 1993-11-18 1993-11-18 A method for manufacturing semiconductor device

Country Status (1)

Country Link
KR (1) KR960016831B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019045210A1 (en) * 2017-08-31 2019-03-07 삼성전자주식회사 Dishwasher and home appliances

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019045210A1 (en) * 2017-08-31 2019-03-07 삼성전자주식회사 Dishwasher and home appliances

Also Published As

Publication number Publication date
KR950015639A (en) 1995-06-17

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