KR960016501B1 - Wiring board and method for connecting pad and lead-wire of a semiconductor device - Google Patents

Wiring board and method for connecting pad and lead-wire of a semiconductor device Download PDF

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Publication number
KR960016501B1
KR960016501B1 KR93000009A KR930000009A KR960016501B1 KR 960016501 B1 KR960016501 B1 KR 960016501B1 KR 93000009 A KR93000009 A KR 93000009A KR 930000009 A KR930000009 A KR 930000009A KR 960016501 B1 KR960016501 B1 KR 960016501B1
Authority
KR
South Korea
Prior art keywords
lead
wire
semiconductor device
wiring board
connecting pad
Prior art date
Application number
KR93000009A
Other languages
Korean (ko)
Other versions
KR940018954A (en
Inventor
Tae-Ho Yun
Original Assignee
Lg Semicon Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Semicon Co Ltd filed Critical Lg Semicon Co Ltd
Priority to KR93000009A priority Critical patent/KR960016501B1/en
Publication of KR940018954A publication Critical patent/KR940018954A/en
Application granted granted Critical
Publication of KR960016501B1 publication Critical patent/KR960016501B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

a thin insulating board(10); a bonding bumper(15) formed to penetrate the insulating board(10) on the region where a bonding pad(2) of a semiconductor chip and an inner lead(1) of a lead frame are bonded; and a connecting wire(14) which connects the bonding bumper(15) connected with the bonding pad to the bonding pad connected with the inner lead(1).
KR93000009A 1993-01-04 1993-01-04 Wiring board and method for connecting pad and lead-wire of a semiconductor device KR960016501B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR93000009A KR960016501B1 (en) 1993-01-04 1993-01-04 Wiring board and method for connecting pad and lead-wire of a semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR93000009A KR960016501B1 (en) 1993-01-04 1993-01-04 Wiring board and method for connecting pad and lead-wire of a semiconductor device

Publications (2)

Publication Number Publication Date
KR940018954A KR940018954A (en) 1994-08-19
KR960016501B1 true KR960016501B1 (en) 1996-12-12

Family

ID=19349318

Family Applications (1)

Application Number Title Priority Date Filing Date
KR93000009A KR960016501B1 (en) 1993-01-04 1993-01-04 Wiring board and method for connecting pad and lead-wire of a semiconductor device

Country Status (1)

Country Link
KR (1) KR960016501B1 (en)

Also Published As

Publication number Publication date
KR940018954A (en) 1994-08-19

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