KR960016243B1 - Dynamic ram and the manufacture method - Google Patents

Dynamic ram and the manufacture method Download PDF

Info

Publication number
KR960016243B1
KR960016243B1 KR92011729A KR920011729A KR960016243B1 KR 960016243 B1 KR960016243 B1 KR 960016243B1 KR 92011729 A KR92011729 A KR 92011729A KR 920011729 A KR920011729 A KR 920011729A KR 960016243 B1 KR960016243 B1 KR 960016243B1
Authority
KR
South Korea
Prior art keywords
manufacture method
dynamic ram
ram
dynamic
manufacture
Prior art date
Application number
KR92011729A
Other languages
Korean (ko)
Other versions
KR930003398A (en
Inventor
Toru Ozaki
Kazumasa Sunochi
Seichi Takedai
Yoshiyuki Shioyama
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of KR930003398A publication Critical patent/KR930003398A/en
Application granted granted Critical
Publication of KR960016243B1 publication Critical patent/KR960016243B1/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/01Manufacture or treatment
    • H10B12/02Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03Making the capacitor or connections thereto
    • H10B12/038Making the capacitor or connections thereto the capacitor being in a trench in the substrate
    • H10B12/0383Making the capacitor or connections thereto the capacitor being in a trench in the substrate wherein the transistor is vertical
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/01Manufacture or treatment
    • H10B12/02Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03Making the capacitor or connections thereto
    • H10B12/038Making the capacitor or connections thereto the capacitor being in a trench in the substrate
    • H10B12/0387Making the trench

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
  • Element Separation (AREA)
  • Semiconductor Integrated Circuits (AREA)
KR92011729A 1991-07-03 1992-07-02 Dynamic ram and the manufacture method KR960016243B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP91-163166 1991-07-03
JP16316691A JP3208153B2 (en) 1991-07-03 1991-07-03 Semiconductor device and method of manufacturing the same

Publications (2)

Publication Number Publication Date
KR930003398A KR930003398A (en) 1993-02-24
KR960016243B1 true KR960016243B1 (en) 1996-12-07

Family

ID=15768491

Family Applications (1)

Application Number Title Priority Date Filing Date
KR92011729A KR960016243B1 (en) 1991-07-03 1992-07-02 Dynamic ram and the manufacture method

Country Status (2)

Country Link
JP (1) JP3208153B2 (en)
KR (1) KR960016243B1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3480745B2 (en) 1993-09-16 2003-12-22 株式会社東芝 Method for manufacturing semiconductor device
JP3214975B2 (en) * 1994-04-25 2001-10-02 旭化成株式会社 Ammoxidation catalyst composition and production method

Also Published As

Publication number Publication date
JP3208153B2 (en) 2001-09-10
KR930003398A (en) 1993-02-24
JPH0513707A (en) 1993-01-22

Similar Documents

Publication Publication Date Title
KR960011646B1 (en) Capacitor and method of fabricating the same
GB2281047B (en) Structural member and method for forming the same
EP0533144A3 (en) Copolymer and method for production thereof
AU2199092A (en) Prosthesis press and method of using the same
EP0589675A3 (en) BiCDMOS process technology and structures.
EP0548952A3 (en) Magnet roll and method for producing the same
PL314980A1 (en) Paroxetin tablets and method making them
EP0331412A3 (en) Connection arrangement and method for forming the same
GB2259475B (en) Molding die and method
AU1563392A (en) Pallet and method for producing the same
EP0694974A3 (en) Photosensor and method for forming the same
EP0503199A3 (en) Dynamic ram and process for producing same
GB2257716B (en) Compression ring and method for manufacturing the same
GB2270863B (en) Press die assembly and method for producing the same
US5358366B1 (en) Screw and thread rolling die
PL297107A1 (en) Sheet metal drawing method and die
KR960016243B1 (en) Dynamic ram and the manufacture method
ZA922983B (en) Vehicle and method of producing the same
EP0526850A3 (en) Copolymer and method for production thereof
ZA891885B (en) Reduced chromium-ore bearing powder and method for producing the same
EP0622396A3 (en) Polysilanes and method for producing the same.
GB2220165B (en) Coextrusion process and die
AU2595092A (en) Wad mat and method for producing the same
EP0510924A3 (en) Output method and apparatus employing the same
GB2257435B (en) Aluminum-lithium alloys and method of making the same

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20081120

Year of fee payment: 13

LAPS Lapse due to unpaid annual fee