KR960012666U - 금속배선의 부식방지 장치 - Google Patents

금속배선의 부식방지 장치

Info

Publication number
KR960012666U
KR960012666U KR2019940023510U KR19940023510U KR960012666U KR 960012666 U KR960012666 U KR 960012666U KR 2019940023510 U KR2019940023510 U KR 2019940023510U KR 19940023510 U KR19940023510 U KR 19940023510U KR 960012666 U KR960012666 U KR 960012666U
Authority
KR
South Korea
Prior art keywords
metal wiring
prevention device
corrosion prevention
corrosion
wiring
Prior art date
Application number
KR2019940023510U
Other languages
English (en)
Other versions
KR0119735Y1 (ko
Inventor
이준식
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019940023510U priority Critical patent/KR0119735Y1/ko
Publication of KR960012666U publication Critical patent/KR960012666U/ko
Application granted granted Critical
Publication of KR0119735Y1 publication Critical patent/KR0119735Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR2019940023510U 1994-09-12 1994-09-12 금속배선의 부식방지 장치 KR0119735Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940023510U KR0119735Y1 (ko) 1994-09-12 1994-09-12 금속배선의 부식방지 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940023510U KR0119735Y1 (ko) 1994-09-12 1994-09-12 금속배선의 부식방지 장치

Publications (2)

Publication Number Publication Date
KR960012666U true KR960012666U (ko) 1996-04-17
KR0119735Y1 KR0119735Y1 (ko) 1998-08-01

Family

ID=19392974

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940023510U KR0119735Y1 (ko) 1994-09-12 1994-09-12 금속배선의 부식방지 장치

Country Status (1)

Country Link
KR (1) KR0119735Y1 (ko)

Also Published As

Publication number Publication date
KR0119735Y1 (ko) 1998-08-01

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
AMND Amendment
E601 Decision to refuse application
J2X1 Appeal (before the patent court)

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B701 Decision to grant
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20090223

Year of fee payment: 12

EXPY Expiration of term