KR960011872A - Laser diode package - Google Patents

Laser diode package Download PDF

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Publication number
KR960011872A
KR960011872A KR1019940024003A KR19940024003A KR960011872A KR 960011872 A KR960011872 A KR 960011872A KR 1019940024003 A KR1019940024003 A KR 1019940024003A KR 19940024003 A KR19940024003 A KR 19940024003A KR 960011872 A KR960011872 A KR 960011872A
Authority
KR
South Korea
Prior art keywords
laser diode
package
fixing part
base surface
lead frame
Prior art date
Application number
KR1019940024003A
Other languages
Korean (ko)
Other versions
KR0141188B1 (en
Inventor
박춘성
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019940024003A priority Critical patent/KR0141188B1/en
Publication of KR960011872A publication Critical patent/KR960011872A/en
Application granted granted Critical
Publication of KR0141188B1 publication Critical patent/KR0141188B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/0232—Lead-frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Head (AREA)

Abstract

모서리 발광 레이저 다이오드에서 출사되는 광이 패키지의 기저면에 대하여 수직한 방향을 향하도록 이루어진 레이저 다이오드 패키지가 개시되어 있다.A laser diode package is disclosed in which light emitted from an edge emitting laser diode is directed in a direction perpendicular to the base surface of the package.

이 개시된 레이저 다이오드 패키지는 레이저 다이오드가 결합되는 리드프레임(31)의 일측이 기저면에 대하여 수직방향으로 구부려진 고정부(32)를 포함하고, 그 고정부(32)의 측면에 레이저 다이오드(11)가 결합된다. 이 고정부(32)의 측면과 측면이 소정 간격 이격되어 마주보도록 동일 형상의 리드프레임(31)을 마련하고, 그 간격 사이에 상기 레이저 다이오드를 고정하므로, 와이어에 의하지 않고 레이저 다이오드에 전류를 직접 공급할 수 있고, 구동시 발생되는 열을 상기 리드프레임의 열전달에 의하여 제거할 수 있다.The disclosed laser diode package includes a fixing portion 32 in which one side of the lead frame 31 to which the laser diode is coupled is bent in a direction perpendicular to the base surface, and the laser diode 11 on the side of the fixing portion 32. Is combined. Since the lead frame 31 having the same shape is provided so that the side and side surfaces of the fixing part 32 face each other at a predetermined interval, and the laser diode is fixed between the gaps, the current is directly applied to the laser diode without using wires. It can be supplied, and heat generated during driving can be removed by heat transfer of the lead frame.

또한, 상기 두 리드프레임의 고정부(42, 44) 각각의 측면이 동일 방향으로 향하도록 패키지의 기저면에 배열하고 일 고정부(42)의 측면에 레이저 다이오드를 결합하고, 다른 고정부(44)에 와이어등의 전기적 접속수단을 이용하여 상기 레이저 다이오드(11)와 결합할 수 있다.In addition, the sides of each of the fixing parts 42 and 44 of the two lead frames are arranged on the base surface of the package so as to face the same direction, and the laser diode is coupled to the side of the one fixing part 42, and the other fixing part 44 is provided. It may be coupled to the laser diode 11 using an electrical connection means such as a wire.

Description

레이저 다이오드 패키지Laser diode package

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제3도는 본 발명에 따른 광원 및 수광부 일체형 패키지의 일실시예를 나타낸 사시도.3 is a perspective view showing an embodiment of a light source and a light receiving unit integrated package according to the present invention.

제4도는 본 발명에 따른 광원 및 수광부 일체형 패키지의 다른 실시예를 나타낸 사시도.4 is a perspective view showing another embodiment of a light source and a light receiving unit integrated package according to the present invention.

Claims (3)

모서리에서 발광하는 레이저 다이오드와, 이 레이저 다이오드의 광이 패키지의 기저면에 대하여 수직하게 출사하도록 광축을 변환하는 변환수단을 구비한 레이저 다이오드 패키지에 있어서,A laser diode package having a laser diode emitting light at an edge and converting means for converting an optical axis so that light of the laser diode is emitted perpendicularly to the base surface of the package. 상기 변환수단으로 상기 패키지의 내부 소자와 외부를 연결하는 리드프레임들 중 적어도 하나의 리드프레임이 상기 패키지의 기저면에 대하여 상방으로 수직하게 구부려진 고정부를 포함하고, 상기 고정부의 측면에 상기 레이저 다이오드가 결합된 것을 특징으로 하는 레이저 다이오드 패키지.At least one lead frame of the lead frames connecting the internal element and the outside of the package by the conversion means comprises a fixing portion bent upwardly perpendicular to the base surface of the package, the laser on the side of the fixing portion Laser diode package, characterized in that the diode is coupled. 제1항에 있어서,The method of claim 1, 상기고정부를 포함하는 리드프레임이 상기 고정부의 측면이 소정간격 이격되어 마주보도록 두 개 마련되어 그 측면 사이에 상기 레이저 다이오드의 두 전극이 직접 결합된 것을 특징으로 하는 레이저 다이오드 패키지.The lead frame including the fixing portion is provided with two so as to face the side of the fixing part spaced apart a predetermined interval laser diode package, characterized in that the two electrodes of the laser diode directly coupled between the sides. 제1항에 있어서,The method of claim 1, 상기 고정부를 포함하는 리드프레임이 상기 고정부의 측면이 동일 방향을 향하도록 두 개 마련되어 상기 일 고정부의 측면에 상기 레이저 다이오드를 결합하고, 다른 고정부의 측면에 상기 레이저 다이오드와 전기적으로 결합되는 결합수단이 마련된 것을 특징으로 하는 레이저 다이오드 패키지.Two lead frames including the fixing part may be provided such that side surfaces of the fixing part face the same direction, and couple the laser diode to the side of the fixing part, and electrically couple the laser diode to the side of the other fixing part. Laser diode package, characterized in that the coupling means is provided. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940024003A 1994-09-23 1994-09-23 Laser diode package KR0141188B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940024003A KR0141188B1 (en) 1994-09-23 1994-09-23 Laser diode package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940024003A KR0141188B1 (en) 1994-09-23 1994-09-23 Laser diode package

Publications (2)

Publication Number Publication Date
KR960011872A true KR960011872A (en) 1996-04-20
KR0141188B1 KR0141188B1 (en) 1998-06-01

Family

ID=19393333

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940024003A KR0141188B1 (en) 1994-09-23 1994-09-23 Laser diode package

Country Status (1)

Country Link
KR (1) KR0141188B1 (en)

Also Published As

Publication number Publication date
KR0141188B1 (en) 1998-06-01

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