KR960009103A - JIG for silicon wafer heat treatment and manufacturing method thereof - Google Patents

JIG for silicon wafer heat treatment and manufacturing method thereof Download PDF

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Publication number
KR960009103A
KR960009103A KR1019950027732A KR19950027732A KR960009103A KR 960009103 A KR960009103 A KR 960009103A KR 1019950027732 A KR1019950027732 A KR 1019950027732A KR 19950027732 A KR19950027732 A KR 19950027732A KR 960009103 A KR960009103 A KR 960009103A
Authority
KR
South Korea
Prior art keywords
jig
manufacturing
heat treatment
silicon wafer
wafer heat
Prior art date
Application number
KR1019950027732A
Other languages
Korean (ko)
Other versions
KR100208623B1 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of KR960009103A publication Critical patent/KR960009103A/en
Application granted granted Critical
Publication of KR100208623B1 publication Critical patent/KR100208623B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • H01L21/67316—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements characterized by a material, a roughness, a coating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67306—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by a material, a roughness, a coating or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Glass Compositions (AREA)
KR1019950027732A 1994-08-31 1995-08-30 Quartz glass jig for the heat treatment of silicon wafers and method and device for producing the same KR100208623B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP94-228968 1994-08-31
JP22896894A JP2802234B2 (en) 1994-08-31 1994-08-31 Combination jig for heat treatment of silicon wafer and manufacturing method thereof

Publications (2)

Publication Number Publication Date
KR960009103A true KR960009103A (en) 1996-03-22
KR100208623B1 KR100208623B1 (en) 1999-07-15

Family

ID=16884693

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950027732A KR100208623B1 (en) 1994-08-31 1995-08-30 Quartz glass jig for the heat treatment of silicon wafers and method and device for producing the same

Country Status (2)

Country Link
JP (1) JP2802234B2 (en)
KR (1) KR100208623B1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5050363B2 (en) 2005-08-12 2012-10-17 株式会社Ｓｕｍｃｏ Heat treatment jig for semiconductor silicon substrate and manufacturing method thereof
JP6134172B2 (en) * 2013-03-21 2017-05-24 東京エレクトロン株式会社 Magnetic annealing equipment

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53148283A (en) * 1977-05-30 1978-12-23 Toshiba Ceramics Co Silicon wafer jig
JPS5599718A (en) * 1979-01-26 1980-07-30 Hitachi Ltd Heat treatment jig of wafer
JPS5851508A (en) * 1981-09-22 1983-03-26 Yamagata Nippon Denki Kk Jig for manufacturing semiconductor element
JPS58165319A (en) * 1982-03-26 1983-09-30 Hitachi Ltd Jig for heat treatment
JPS5972726U (en) * 1982-11-08 1984-05-17 株式会社テクニスコ Diffusion jig motherboard

Also Published As

Publication number Publication date
JP2802234B2 (en) 1998-09-24
KR100208623B1 (en) 1999-07-15
JPH0878349A (en) 1996-03-22

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E701 Decision to grant or registration of patent right
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