KR960008973A - Porous Ceramic Substrates Used in Wafer Cutting - Google Patents

Porous Ceramic Substrates Used in Wafer Cutting Download PDF

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Publication number
KR960008973A
KR960008973A KR1019940021177A KR19940021177A KR960008973A KR 960008973 A KR960008973 A KR 960008973A KR 1019940021177 A KR1019940021177 A KR 1019940021177A KR 19940021177 A KR19940021177 A KR 19940021177A KR 960008973 A KR960008973 A KR 960008973A
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KR
South Korea
Prior art keywords
porous ceramic
ceramic substrate
wafer
present
wafer cutting
Prior art date
Application number
KR1019940021177A
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Korean (ko)
Other versions
KR0134738B1 (en
Inventor
김기수
김수룡
이현재
Original Assignee
우덕창
쌍용양회공업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to KR1019940021177A priority Critical patent/KR0134738B1/en
Publication of KR960008973A publication Critical patent/KR960008973A/en
Application granted granted Critical
Publication of KR0134738B1 publication Critical patent/KR0134738B1/en

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  • Compositions Of Oxide Ceramics (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

본 발명은 웨이퍼에 부착하는 다공질 세라믹 기판에 관한 것으로, 더욱 상세하게는 반도체의 제조공정중 웨이퍼의 절단시 부착시켜 절단효율을 높이고, 이후 자동처리 공정을 용이하게 하는 다공질 세라믹 기판에 관한 것이다. 본 발명은 반도체 웨이퍼 절단가공시 부착되는 다공성 세라믹 기판에 있어서, Al2O₃10∼35중량% MgO 10∼25중량%, SiO₂40∼80중량%,의 조성비 및 약 20부피%의 기공율로 이루어진다.The present invention relates to a porous ceramic substrate attached to a wafer, and more particularly, to a porous ceramic substrate attached to a wafer during cutting of a semiconductor to increase cutting efficiency and to facilitate an automatic processing process. The present invention is a semiconductor wafer in the porous ceramic substrate which is adhered during the cutting process, Al 2 O₃10~35 comprises a porosity of the composition and about 20% by volume of 10~25 wt% MgO wt%, SiO₂40~80% by weight.

본 발명을 제조된 다공성 세라믹 기판은 종래의 기판에 비하여 진공 흡입 부착력이 우수하고, 곡강도 또한 양호한것으로 나타났다.The porous ceramic substrate prepared according to the present invention was superior in vacuum suction adhesion force and good bending strength as compared with the conventional substrate.

Description

웨이퍼 절단 가공시 사용되는 다공성 세라믹 기판Porous Ceramic Substrates Used in Wafer Cutting

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 진공 흡입 부착력 측정장치 이다.1 is a vacuum suction adhesion force measuring device.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

1 : 측정장치 2 : 흡입 부착판1 measuring device 2 suction plate

3 : 다공성 세라믹 기판 4 : 고무링3: porous ceramic substrate 4: rubber ring

5 : 진공펌프 6 : 흡입 부착력 측정점5: vacuum pump 6: suction adhesion force measuring point

Claims (1)

반도체 웨이퍼 절단가공시 부착되는 다공성 세라믹 기판에 있어서, Al20310 ∼35중량％, MgO 10∼25 중량％, SiO₂40∼80중량％의 조성비 및 20부피％의 기공율로 이루어지는 것을 특징으로 하는 다공질 세라믹 기판.A porous ceramic substrate attached during semiconductor wafer cutting, wherein the porous ceramic substrate comprises a composition ratio of Al 2 0 3 10 to 35% by weight, MgO 10 to 25% by weight, SiO 2 40 to 80% by weight, and a porosity of 20% by volume. Ceramic substrate. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940021177A 1994-08-26 1994-08-26 Ceramic plate of porosity for use in the cut processing of wafer KR0134738B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940021177A KR0134738B1 (en) 1994-08-26 1994-08-26 Ceramic plate of porosity for use in the cut processing of wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940021177A KR0134738B1 (en) 1994-08-26 1994-08-26 Ceramic plate of porosity for use in the cut processing of wafer

Publications (2)

Publication Number Publication Date
KR960008973A true KR960008973A (en) 1996-03-22
KR0134738B1 KR0134738B1 (en) 1998-04-20

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ID=19391209

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940021177A KR0134738B1 (en) 1994-08-26 1994-08-26 Ceramic plate of porosity for use in the cut processing of wafer

Country Status (1)

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KR (1) KR0134738B1 (en)

Also Published As

Publication number Publication date
KR0134738B1 (en) 1998-04-20

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