KR960008484B1 - Amorphous polypropyrene-based hot melt adhesive - Google Patents

Abstract

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Description

Hot Melt Adhesives Based on Amorphous-Polypropylene

1 is a schematic diagram of a test electrode used for electrolytic corrosion discussed in the Examples.

2-5 are micrographs of the adhesive composition taken with a transmission electron microscope illustrating the distinct domains formed within the adhesive composition of the present invention.

The present invention relates to compositions useful as hot melt adhesives. The present invention specifically relates to amorphous (or amorphous) polypropylene-based high melting melt adhesives.

In general, the hot melt adhesive melts quickly upon heating and flows substantially freely for ease of use in adherends to be bonded. The adhesive cures upon cooling to form the desired bond.

Hot melt adhesives have been formulated for use in a variety of applications, such as bonding paper, wood, textiles and creased chipboard. Typical adhesive compositions often contain adhesive resins and oils or waxes to modify the viscosity of the composition or to improve the adhesion of the composition to the substrate. As an example, a second polymer or elastomer (elastomer) may be added to modify certain properties of the adhesive.

For use in joining products such as mechanical components and electronic components (devices) made of various materials, including metals and plastics, the adhesives must provide bonding strength with sufficient thermal shock resistance, resistance to mechanical impact, and shear strength. . In order to be suitable for use in attaching electronic components to circuit boards in the case of electronic components or electrical components, the adhesive may have the desired electrical properties as defined in this application, for example, other materials constituting the components. Low melting point, high resistance to electrical properties such as high resistance, etc., as well as melting point enough to apply the adhesive composition at a temperature low enough not to damage other components of the electronic components It should have a characteristic that the bonding strength is not broken even at the temperature required by the assembly and the other processes exposed during the subsequent process.

Japanese Patent Laid-Open No. 60-120775 (Inaba et al.) Discloses a hotmelt adhesive comprising a thermoplastic elastomer such as styrene-butadiene-styrene as an ethylene / propylene copolymer, atactic polypropylene tackifier and filler. It is. Such compositions typically do not provide sufficient creep resistance (especially at high temperatures). Moreover, the electrical properties of such compositions may not fall within the generally required ranges for use in electronic components.

Japanese Patent Application Laid-Open No. 58-23865 (Okude et al.) Has a hot-melt adhesive in which toughness is given using vulcanized rubber particles (5 to 200 mesh) to improve the elasticity of the adhesive and the bonding force provided when the adhesive is used. Presented. Adhesive compositions of the type presented in this reference generally do not provide the desired degree of thermal and / or mechanical impact resistance, and shear strength (especially at low temperatures).

The present invention provides novel compositions useful as hot melt adhesives and articles made therefrom. The hot melt adhesives provided by the present invention have strong impact resistance and are suitable for many applications requiring thermally stable bonding. Typical applications are to combine electronic or mechanical parts.

In summary, the composition of the present invention mainly consists of the following components; (a) amorphous polypropylene; (b) styrene-based thermoplastic elastomers (defined below); (c) pressure-sensitive adhesives; And (d) waxes; Wherein the composition has a dissipation factor of about 0.010 or less at 23 ^° C., 1 KHz, and a volume resistivity of at least about 1 × 10 ¹⁴ ohm-cm at 23 ^° C.

Such adhesives are particularly useful for bonding electronic components because they typically provide high peel strength, high low temperature shear strength, excellent heat resistance, high creep resistance at high temperatures, and high mechanical impact resistance. Especially at low temperatures, eg -40 ^° C., since this adhesive is virtually corrosive to copper. Such adhesives will also effectively wet various adherends and provide effective adhesion to them. Moreover, such adhesives can be used to form assemblies that can withstand the high temperatures typically encountered during the assembly of electronic components and their use, and can provide good low temperature properties as described above. That is, the hot melt adhesive compositions described above provide desirable adhesion properties over the useful temperature range.

The invention is further described with reference to the accompanying drawings, which are merely illustrative of the invention and do not limit the invention.

As mentioned above, typically the hot melt adhesive of the present invention mainly consists of the following components; (a) amorphous polypropylene; (b) styrene-based thermoplastic elastomers (defined below); (c) an adhesive; And (d) waxes; Wherein the composition has a dissipation factor of about 0.010 or less at 23 ^° C., 1 KHz, and a volume resistivity of at least about 1 × 10 ¹⁴ ohm-cm at 23 ^° C.

In addition, adhesive compositions formulated according to the present invention typically have a volume resistivity of between about 10 ¹⁴ and 10 ¹⁷ ohm-cm at 23 ^° C., an insulation strength between about 25 and about 50 kilovolts / mm, and about 2.3 to about 1 KHz. Dielectric constant between about 3.0, dielectric loss tangent (= dielectric lost tangent; or loss rate) between about 0.0008 and about 0.010 at 23 ^o C 1 kHz and electrolytic corrosion between about 10 ¹⁰ and 10 ¹² ohm after 1000 hours. It is a characteristic.

An example of an amorphous polypropylene that can be used in the compositions of the present invention is an atactic polypropylene having a weight average molecular weight of preferably between about 10,000 and about 100,000, more preferably between about 10,000 and about 50,000. Substantially lower the molecular weight than that described above, the final adhesive composition tends to have poor physical properties (eg, lower strength and resistance to impact). Substantially higher molecular weights than those described above tend to result in too high a viscosity of the composition that makes processing and handling difficult during the manufacture of the adhesive.

Attackic polypropylene is an amorphous, i.e., amorphous, polypropylene that is formed in relatively small amounts during the production of isotactic polypropylene, which is a more crystalline form of polypropylene, by stereospecific polymerization of propylene. Examples of commercially available amorphous polypropylene resins suitable for use in the present invention include: EASTOBOND Series M-5W, M-500 and G-92 (available from Eastman Chemical Products, Inc.) ; POLYTAC R Series, SUPERTAC and POLYMER C polypropylene (commercially available from Crowley Chemical Company); And A-FAX 500, 600, 800 and 940 polypropylene (commercially available from Hercules Inc.).

Another example of an amorphous polypropylene suitable for use in the compositions of the present invention is the copolymerization of propylene with low molecular weight alkenes (such as ethylene or 1-butene), such as amorphous poly alpha olefins available from El Paso Products Company. have.

The adhesive composition of the present invention preferably contains about 10 to 70% by weight of amorphous polypropylene, more preferably about 14 to about 50% by weight. Substantially more content of amorphous polypropylene than described above and the final composition tends to be too soft to have lower strength, while less content of amorphous polypropylene results in less brittleness. Tend to lose. The polypropylene component of such adhesive compositions is typically of about 10% or less by weight, preferably about 2% by weight or less of other forms of polypropylene that are more crystalline in nature (e.g. isotactic or syndiotactic) Small amounts of syndiotactic polypropylene). The higher the content of this type of polypropylene, the more crystalline properties are imparted to the final adhesive composition, so that the adhesive composition breaks better and thus reduces its usefulness as a hot melt adhesive.

The adhesive composition of the present invention also contains a thermoplastic elastomer based on styrene. Styrene-based thermoplastic elastomers include blocks of hard segments (e.g. polystyrene) and soft segment blocks (e.g. polyisoprene, polybutadiene, poly (ethylene-propylene), poly (ethylene-butylene) and Polypropylene). In other words, useful styrene-based elastomers are, for example, blocks of polystyrene and blocks of polyisoprene or blocks of polystyrene and blocks of polybutadiene, or blocks of polystyrene and blocks of poly (ethylene-butadiene). It may include. The soft fragments constituting the styrene-based elastomer are preferably nearly saturated (eg polymers such as poly (ethylene-propylene), poly (ethylene-butylene)), for styrene-containing such fragments. This is because based thermoplastic elastomers tend to be more resistant to oxidative disintegration (decomposition) when heat is applied thereto. Styrene-based elastomers preferably have styrene-ends because such block copolymers tend to have greater elasticity.

Polystyrene block bodies, sometimes referred to as A block bodies, preferably have a weight average molecular weight between about 5,000 and about 125,000 and more preferably between about 8,000 and about 45,000. In the case of the adhesive composition in which the above-mentioned A block body has a substantially higher molecular weight than the above-mentioned range, there is a tendency to have a viscosity higher than the viscosity desired to facilitate handling, while the A block body having a substantially lower molecular weight In the case of a composition comprising a tendency to break too well. The block bodies of the soft fragments referred to above as B block bodies preferably have a weight average molecular weight (Mw) between about 30,000 and about 125,000 and more preferably between about 50,000 and about 100,000.

Preferably the styrene-based thermoplastic elastomer comprises A: B block bodies in a weight ratio of about 1: 4 to 4: 1. Adhesive compositions that contain substantially less than about 1: 4 of these weight ratios tend to be too soft so that the bonding strength provided using this adhesive has less strength, while the weight ratio of about 4: 4 There is a tendency to break better than for adhesive compositions comprising styrene-based thermoplastic elastomers that are substantially higher than one.

Examples of styrene-based thermoplastic elastomers useful in the present invention are those available from Shell Chemcal Company, including styrene-ethylene-butylene-styrene block copolymers (eg, KRATON G-1650, G-1652 and G-1657); Styrene-butadiene-styrene block copolymers (eg KRATON D-1101 and D-1102); Styrene-isoprene-styrene block copolymers (eg, KRATON D-1107, D-1111, D-1112 and D1117); Styrene-ethylene-propylene block copolymers (eg KRATON G-1701 and G-1702); Styrene-isoprene block copolymers (eg KRATON D-1320); And styrene-butadiene block copolymers (eg KRATON D-1118). Blends or mixtures of such block copolymers, such as the blends of styrene-ethylene-butylene-styrene block copolymers and styrene-ethylene-butadiene block copolymers commercially available from Shell Chemcal Company, KRATON G-1726 X It is also useful for the adhesive composition of the present invention. G-Series KRATONS are substantially saturated and for this reason are generally preferred for use in the compositions of the present invention over unsaturated D-Series KRATONS.

Examples of other commercially available styrene-based thermoplastic elastomers suitable for use in the present invention include QUINTAC 3420, 3430 and 3435 (available from Japanese Zeon Co., Ltd.), and SIS-5000 (Japan Synthetic Rubber Co., Ltd.). Commercially available from Ltd.) (styrene-isoprene-styrene block copolymer); And SOLPRENE T-411, T-414 and T-475 (commercially available from Phillips Petroleum Co.,), TUFPRENE A and ASAPRENE T-431 (commercially available from Asahi Chemical Industry Company Co., Ltd.), and TR-1000 and TR -2000 (commercially available from Japan Synthetic Rubber Co., Ltd.). (Styrene-butadiene-styrene block copolymer).

Typically the adhesive composition of the present invention contains from about 2 to 70 and preferably from about 2 to about 60% by weight of styrene-based thermoplastic elastomer, the content of which depends on the specific properties required for the final composition. Adhesive compositions comprising lesser amounts of styrene-based elastomers typically tend to exhibit higher impact strength and shear strength, but tend to have poorer thermal impact resistance and mechanical properties, while styrene-based Adhesive compositions containing more proportions of elastomers tend to have higher viscosity and lower ability to wet the substrate, which presents difficult difficulties in handling and using.

The amorphous polypropylene component and the styrene-based elastomer component constituting the adhesive composition of the present invention are immiscibility so that the mixture composed of them forms separate domains or separate phases. The inventors do not wish to be bound by this theory, but the reason why the adhesives of the present invention have excellent impact strength and low temperature properties is at least in part the stress exerted on the adhesive bonding force by this phase-separation structure. It is believed that stress is absorbed inside more effectively on finely dispersed styrene-based elastomers without breaking the binding force.

The phase separation structure described above can be easily observed by adding ruthenium tetroxide dye to the composition and irradiating with a transmission-type electron microscope. Under these conditions, the polystyrene block and amorphous polypropylene phase of the styrene-based elastomer body appear dark while the soft segments of the styrene-based elastomer appear brighter.

Such phase-separated or discrete domain structures may also be observed in FIGS. 2-5 which show micrographs taken of the transmission electron microscope of the compositions of the present invention. FIG. 2 is a magnified photograph of 10,000 times the adhesive composition prepared in Example 45, and FIG. 3 is a magnified 30,000 times of the same composition. 4 is a 3,000 times enlarged photograph of the adhesive composition prepared in Example 46, and FIG. 5 is a 10,000 times enlarged photograph of the same composition.

In addition, the adhesive composition of the present invention typically contains one or more tackifiers. Such pressure sensitive adhesives must be compatible with amorphous polypropylene, for example, should not be separated when left in liquid or molten form, and preferably oxidatively stable. Naturally produced resins that can be used include polyterpenes, rosins, rosin esters and derivatives thereof, of which the more fully hydrogenated forms are generally preferred because they give the composition a bright color and high oxidative stability. Do. Hydrocarbon resins having 5 and 9 carbons, preferably hydrocarbon resins with few hydrophilic functional groups, may also be used as the pressure sensitive adhesive. Various synthetically produced adhesive resins may also be used, examples of which include aliphatic resins and aromatic resins, and fully hydrogenated forms thereof are preferred. Examples of other resins that may be used include modified terpenes, coumarin-indenes, polyesters, alkylphenols and styrene oligomers. Mixtures of the above-described pressure-sensitive adhesives may also be used.

A tackifier is typically present in an effective amount that does not exceed the proportion of amorphous polypropylene in the composition to improve the adhesive to the substrate by lowering the melt viscosity of the composition and improving its ability to wet the substrate. Thus, the adhesive composition of the present invention typically contains at least about 1% by weight of the adhesive, and may contain up to about 35% by weight of the adhesive.

In addition, the adhesive composition of the present invention generally contains up to about 24% by weight, most commonly up to about 2 to 20% by weight of one or more waxes, for example to improve the set times of the adhesive composition and Improving the handling properties of the composition may be included in the adhesive composition for the purpose of changing the viscosity and / or increasing the hardness of the bonding force provided by the adhesive. Known waxes used in hot melt adhesives, such as low molecular weight polyethylene, microcrystalline waxes, Fisher-Tropsch waxes, synthetic hydrocarbon waxes and paraffin waxes are examples of waxes suitable for use in the present invention.

The adhesive composition of the present invention may also contain one or more other reagents depending on the properties required in the application used. Some examples of such reagents or additives include a minimum amount of crystalline polyolefins (eg, crystalline polypropylene or polyethylene) fillers (fumed silica, talc, clay) to reduce the set time of embodiments of the present invention. Glass microspheres, plastic microbubbles, etc.), colorants (eg titanium dioxide), antioxidants and stabilizers can be added.

The method of preparing the adhesive composition can be carried out by mixing the above-described components and the good additives in a conventional manner, where the components can be thoroughly mixed so that a nearly uniform blend can be obtained. The compatibility of the amorphous polypropylene component and the styrene-based elastomer component with particles of the styrene-based thermoplastic elastomer and particles of the amorphous polypropylene to about 100 microns or less, more preferably, to obtain a nearly uniform and homogeneous composition. Preferably by mixing and dispersing the components by known techniques such as shear mixing that are high enough to reduce to about 50 microns or less, and ideally to about 10 microns or less. Thus, a highly shearing technique that can add the viscous amorphous polypropylene and styrene-based thermoplastic elastomers to the mixing vessel first and then provide effective mixing to break up lumps (agglomerates) or globules composed of these components. The mixing is carried out using the shear technique. In general, the components are mixed continuously at a sufficiently high temperature to maintain the melt until the mixture is a homogeneous mixture.

Example

The invention is illustrated with reference to the following examples. All quantities are in parts by weight unless otherwise noted.

The following abbreviations are used herein.

Acronym Meaning

ASTM United States Material Testing Standards

JIS Japanese Industrial Standards Act

mPa Milli Pascal

Cm centimeter

Mm millimeter

Unless otherwise specified, the test methods mentioned in the following examples were performed as follows.

Ring and Bowl Softening Test

Ring and bowl softening points, hereinafter referred to as RB, were measured by ASTM E-28.

Freezing point

The congealing point, hereinafter referred to as CP, was measured by the ASTM D-938 method.

Non-cat softening point

The non-cat softening point, hereinafter referred to as Vicat, was measured by the ASTM D-1525 method.

Viscosity

Viscosity was measured by ASTM D-4402 method using a Brookfield RTV and # 27 spindle at 20 rpm at 180 ^° C.

Static load thermal resistance

Deadload heat resistance is the temperature at which the bond strength of Douglas Fir to Douglas Fir, 2.54 cm x 2.54 cm, can support a load of 200 g at static shear for 30 minutes. . The average value for three types of test pieces was taken.

Superimposed Shear Strength

Overlap shear strength, hereinafter referred to as OLS, was tested using an Instron tester with clean dry test strips with an overlap bond of 2.54 cm wide and bond line thickness of about 0.33 mm at a crosshead speed of about 5.1 cm / min. Was measured. The results are expressed in kg-pressure / cm 2 unless otherwise noted.

Tensile Load Shear Strength

Tension Loading Shear Strength, hereinafter referred to as TLS, was measured at a tensile rate of 50 mm / min using ASTM D-3164 method and D-1002 method (same as JISK 6850 method).

Impact shear strength

Impact shear strength was measured by ASTM D-950 (same method as JIS K 6855) using Birch wood of 12.5 mm width. The results are expressed in (kg-pressure) (cm) / cm 2 unless otherwise noted.

Heat shock cycle

The thermal shock cycle combines several electronic components (0.6 cm diameter axial capacitors) to the epoxy glass board with the test adhesive composition, and almost completely embeds the electronic components in the adhesive composition, then coldens the test samples 40 times. and hot cycles). Each cycle consists of immersion in liquid FC-40 of 3M FLUORINERT blend for about 5 minutes at a temperature of about -40 ^° C., followed by immersion in liquid FC-40 of 3M FLUORINERT blend at about 90 ^° C. for about 5 minutes. do. The number of broken test samples, i.e., the number of peeled or peeled off epoxy glass boards, was recorded and reported as failure rate.

Volume resistivity

The volume resistivity, hereinafter referred to as resistivity, was measured by ASTM D-257 (the same test method as JIS K 6911) at 23 ^° C.

Dielectric strength

Dielectric strength was measured according to ASTM D-149 at 23 ^° C (the same test method as JIS K 6911).

Dielectric constant

The dielectric constant was measured according to ASTM D-150 (same test method as JIS K 6911) at 23 ^° C and 1 kHz.

Loss rate

The loss rate was measured according to ASTM D-150 (same test method as JIS K 6911) at 23 ^o C, 1 kHz.

Appetite

The catalysis was measured by embedding a comb electrode with a 0.8 mm spacing in a test adhesive coating layer of about 0.8 mm circuit width and 1 mm thickness on a glass epoxy board without solder resist. This test sample was exposed to 95% relative humidity of 60 ^° C. while generating a 100 volt DC voltage between the electrodes for this period of time. After generating a DC voltage of 500 volts for 1 minute between the electrodes, the insulation resistance was measured at 23 ^° C. A schematic diagram of the test electrode is illustrated in FIG. 1, where the circuit components 2 and 4 are shown and the projecting components 8 arranged in the gap type separated by the spacing 10. . The opposite potential difference is applied to the circuit components (2) and (4) during the test, ie positive and negative, respectively.

180 ^o C Stripping Strength

180 ^° C. Peel strength was measured by the method of JIS K 6854 at a tensile rate of 50 mm / min. This test method provided a minimum value of 2.0 kg / 25 mm-width.

Example 1

Example 1 illustrates an embodiment of the invention.

The following components were added to a clean steel barrel on a hot plate and heated to about 194 ^° .

Ingredient amount

EASTOBOND G-92-Eastman Chemical Products, Inc.

Product, atactic polypropylene 35.64 with RB of about 145 ^o C

Petroleum resin 24.75 with RB of about 125 ^o C as ARKON P-125-adhesive

PARAFINT H-1-Moore Munger, Inc. has a CP of about 95 ^o C.

Product Fischer-Tropsch Wax 9.9

ALLIED AC-617-Allied Chemical product with an RB of about 102 ^o C

Low Molecular Weight Polyethylene 9.9

TENITE 625-Eastman Chemical Products

3.96 crystalline polypropylene between about 58 ^o and 85 ^o C

Tetrakis from Ciba-Geigy Corp. as IRGANOX 1010-Antioxidant

[Methylene-3 (3 ', 5'-di-tert-butyl-4'-hydroxyphenyl) propionate] methane 0.9

After the contents had liquefied, it began to stir slowly using a 5 cm diameter cowles blade propelled by an air mixer. When the mixture became homogeneous, 14.85 parts of KRATON G-1657, a styrene-ethylene-butylene-styrene block copolymer having a specific gravity of about 0.90, was added with stirring. The mixture was heated to about 205 ^° C. and the mixing rate increased to about 1500 rpm. This condition was maintained for about 45-90 minutes until the mixture showed a smooth and uniform shape. This mixture was then cast into a rod to cool. The hot melt adhesive obtained thereafter was tested. the results are as follow.

Property results

RB 149 ^o C

Viscosity (mPa) 6125

Static load thermal resistance 180 ^o C

Thermal Shock Cycle (Destruction) 0.0%

OLS Douglas vs. Equivalents at 25 ^o C 15.5

Polyethylene vs. Equal 17.2

FR-4 ^* vs. the same 18.7

Volume resistivity (x10 ¹⁷ ohm-cm) 6.7

Insulation strength (KV / mm) 51

Dielectric Constant 2.3

Loss rate 0.0010

* FR-4 is a glass reinforced epoxy circuit board.

The results indicate that excellent adhesive and electrical properties were provided by the adhesive composition of the present invention.

Example 2 and Comparative Example A

Example 2 and Comparative Example A were prepared using the following components.

Component Example Comparative Example A

ESTOBOND G-92 40.8 48

ARKON P-125 25.4 30

PARAFLINT H-1 9.4 11

ALLIED AC-617 9.4 11

KRATON G-1657 15.0-

Each mixture was prepared by placing the above ingredients in a clean steel container and heating. Agitation was started using a 4 cm sigma blade when the components were almost melted and the temperature was raised to about 180 ^° C. Each mixture was then stirred continuously at 2000 rpm and the temperature was raised to about 200 ^° C. until the mixture was homogeneous each.

Each mixture was then cast into a rod to cool. The obtained hot melt adhesive was tested. The results obtained for each composition are shown in Table (I).

.

Example 2 and Comparative Example A demonstrate that the adhesive composition of the present invention has excellent adhesion, corrosion resistance and thermal shock resistance, and also in the hot melt adhesive composition comprising the styrene-based elastomer according to the present invention. It indicates that the characteristic is improved.

Example 3-10

Example 3-10 exemplified the case where the amount of styrene-isoprene-styrene block copolymer was used in the adhesive composition of the present invention.

The composition of Examples 3-6 was prepared in the same manner as in Example 2. In Examples 7-10, because of the high viscosity of the mixture, the styrene-isoprene-styrene block copolymer, amorphous polypropylene, and tacky resin were first melted and then mixed at about 180 ^° C. with a sigma-type kneader. Mix with other ingredients as in Example 3-6.

The adhesive compositions prepared in the present examples and their properties are shown in Table (II).

From the above results, it can be seen that by using about 2 to 70% by weight of the styrene-isoprene-styrene block copolymer in the adhesive composition of the present invention, the impact strength is improved, and in particular, the tensile load shear strength at low temperature is improved.

Example 11-17

Examples 11-17 are examples of using styrene-ethylene-butylene-styrene block copolymers in different amounts in the adhesive composition of the present invention.

The compositions in Examples 11-14 and 15-17 were prepared as in Examples 3-6 and 7-10, respectively. The adhesive compositions prepared in the present examples and their properties are shown in Table (III).

The results indicate that the impact strength and tensile load shear strength at low temperatures are improved by using up to about 2 to 50% by weight of styrene-ethylene-butylene-styrene block copolymer in the adhesive composition of the present invention.

Example 18-24

Examples 18-24 relate to the use of varying amounts of SEP block copolymers in the adhesive compositions of the invention.

The compositions in Examples 18-21 and 22-24 were prepared as in Examples 3-6 and 7-10, respectively. The adhesive compositions prepared in this example and their properties are shown in Table (IV).

The results indicate that impact strength and tensile load shear strength at low temperatures are improved by using up to about 2-50% by weight of styrene-ethylene-propylene block copolymer in the adhesive composition of the present invention.

Example 25-28

Examples 25-28 illustrate the use of other types of styrene-based thermoplastic elastomers in the adhesive composition of the present invention.

The compositions were prepared in the same manner as in Example 7-10 except that the indicated block copolymer was used in place of styrene-isoprene-styrene in the indicated amount. The test compositions and their properties are shown in Table (V).

Examples 29-36

Examples 29-36 illustrate examples of using other types of atactic polypropylenes in the adhesive composition of the present invention.

The present test compositions and their properties are shown in Table (VI).

Cnisso Company 제품.

Cnisso Company products.

Mitsui Toatsu chemicals Inc 제품.

Mitsui Toatsu chemicals Inc products.

Examples 37-44 and Comparative Example B-1

Examples 37-44 and Comparative Examples B-1 each illustrate examples of using different types of viscous resins and waxes in the adhesive composition of the present invention.

The compositions were prepared as in Examples 7-10. The test compositions and properties of these examples are shown in the table below.

미소결정질 왁스는 Nippon Seiro Co 제품으로 96^oC의 융점을 갖는다.

Microcrystalline wax is a Nippon Seiro Co product with a melting point of 96 ^° C.

It was observed that the composition of Comparative Example C had a higher tensile load shear strength at 25 ^° C. than the composition of Example 38, but the former was very brittle while the composition of Example 38 had more elastic properties have.

Chisso Co 제품으로 RB가 115^oC인 어택틱 폴리프로필렌

Atactic polypropylene with RB of 115 ^o C from Chisso Co

Nippon Selro Co 제품인 융점 69^oC의 파리핀왁스

Nippon Selro Co, Paris Finwax at melting point 69 ^o C

Chisso Co 제품으로 RB가 115^oC인 어택틱 폴리프로필렌

Atactic polypropylene with RB of 115 ^o C from Chisso Co

Nippon Selro Co 제품인 융점 69^oC의 파리핀왁스

Nippon Selro Co, Paris Finwax at melting point 69 ^o C

Chisso Co 제품인 RB가 115^oC인 어택틱 폴리프로필렌

Atactic Polypropylene with Chisso Co RB 115 ^o C

Examples 45 and 46

The adhesive compositions and properties produced in this example are shown below.

RB가 145^oC인 어택틱 폴리프로필렌

Atactic polypropylene with RB of 145 ^o C

RB가 108^oC인 Fischer-Tropsch 왁스

Fischer-Tropsch wax with RB of 108 ^o C

RB가 102^oC인 저분자량 폴리에틸렌

Low molecular weight polyethylene with RB of 102 ^o C

2 to 5 are micrographs of the adhesive compositions prepared in Examples 45 and 46. The test sample was immersed in a 1% aqueous solution of ruthenium tetroxide for 24 hours in a sample of the adhesive composition to be irradiated, cut into a conventional micro-tom, and then irradiated with a transmission electron microscope. The phase separation structure of the adhesive composition provided by the present invention is easily observed in FIGS.

Those skilled in the art can modify and modify the present invention without departing from the scope and object of the present invention.

Claims (17)

(a) between about 10 and about 70 weight percent of amorphous polypropylene; (b) between about 2 to about 70 weight percent of a styrene-based thermoplastic, elastomeric styrene-diene block copolymer or hydrogenated styrene-diene block copolymer; consisting primarily of (c) between about 1 to about 35 weight percent of adhesive and (d) up to about 24 weight percent of wax, with a loss ratio of about 0.01 or less at 23 ^o C, 1 kHz, and a volume resistivity At least about 1 × 10 ¹⁴ ohm-cm at 23 ^° C., and a propagation value after 1000 hours between about 10 ¹¹ and about 10 ¹² ohms. The composition of claim 1, wherein the composition comprises: (a) about 14 to about 50 weight percent of the amorphous polypropylene; (b) about 2 to about 60 weight percent of said styrene-based elastomer; (c) about 1 to about 25 weight percent of the tackifier; And (d) up to about 24% by weight of the wax. The composition of claim 1 or 2, wherein the amorphous polypropylene has a weight average molecular weight of about 10,000 to about 100,000. The composition of claim 1 or 2, wherein said amorphous polypropylene has a weight average molecular weight of about 10,000 to about 50,000. The composition of claim 1 or 2, wherein the amorphous polypropylene comprises at least one of atactic polypropylene and propylene copolymerized with low molecular weight alkenes. A composition according to claim 1 or 2, wherein the styrene-based elastomer has a repeating structure of A-B or A-B-A, wherein A is polystyrene and B is a compatible soft copolymer fragment. 7. The composition of claim 6, wherein said A block body has a weight average molecular weight of about 5,000 to about 125,000. 7. The composition of claim 6, wherein said A block body has a weight average molecular weight of about 8,000 to about 45,000. 7. The composition of claim 6, wherein said B block body has a weight average molecular weight of about 30,000 to about 125,000. 7. The composition of claim 6, wherein said B block body has a weight average molecular weight of about 50,000 to about 100,000. 7. The composition of claim 6, wherein the weight ratio between the A block bodies and the B block bodies is about 1: 4 to about 4: 1. The composition of claim 1 or 2, wherein the styrene-based thermoplastic elastomer comprises a block of hard fragments and a block of soft fragments, wherein the soft fragments are substantially saturated. The method according to claim 1 or 2, wherein the pressure-sensitive adhesive is polyterpene, rosin, rosin ester or derivatives thereof, hydrocarbon resin having 5 or 9 carbons, aliphatic resin or aromatic resin, modified terpene, coumarone-indene At least one of polyester, alkylphenol or styrene oligomer. The composition of claim 1 or 2, wherein the wax is at least one of low molecular weight polyethylene, microcrystalline wax, Fischer-Tropsch wax, synthetic hydrocarbon wax or paraffin wax. The composition of claim 1 or 2, wherein the composition comprises at least one of crystalline polyolefins, fillers, colorants, antioxidants or stabilizers. An electronic component provided with a bonding force therein by using the composition according to claim 1. The method of claim 1, wherein the volume resistivity is about 10 ¹⁴ to about 10 ¹⁷ ohm-cm at 23 ^° C., dielectric strength is about 25 to about 50 kilovolts / mm, and the dielectric constant is about 2.3 to about 3.0 at 1 KHz. And a loss rate of between about 0.0008 and about 0.010 at 1 KHz at 23 ^° C., with a propagation value of about 10 ¹⁰ to 10 ¹² ohms after 1000 hours.

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