KR960006834Y1 - Heat radiating mechanism of a power transistor - Google Patents
Heat radiating mechanism of a power transistor Download PDFInfo
- Publication number
- KR960006834Y1 KR960006834Y1 KR93004528U KR930004528U KR960006834Y1 KR 960006834 Y1 KR960006834 Y1 KR 960006834Y1 KR 93004528 U KR93004528 U KR 93004528U KR 930004528 U KR930004528 U KR 930004528U KR 960006834 Y1 KR960006834 Y1 KR 960006834Y1
- Authority
- KR
- South Korea
- Prior art keywords
- heat radiating
- power transistor
- radiating mechanism
- transistor
- power
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR93004528U KR960006834Y1 (en) | 1993-03-25 | 1993-03-25 | Heat radiating mechanism of a power transistor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR93004528U KR960006834Y1 (en) | 1993-03-25 | 1993-03-25 | Heat radiating mechanism of a power transistor |
Publications (2)
Publication Number | Publication Date |
---|---|
KR940023802U KR940023802U (ko) | 1994-10-22 |
KR960006834Y1 true KR960006834Y1 (en) | 1996-08-08 |
Family
ID=19352661
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR93004528U KR960006834Y1 (en) | 1993-03-25 | 1993-03-25 | Heat radiating mechanism of a power transistor |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR960006834Y1 (ko) |
-
1993
- 1993-03-25 KR KR93004528U patent/KR960006834Y1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR940023802U (ko) | 1994-10-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20070620 Year of fee payment: 12 |
|
EXPY | Expiration of term |